Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/30/2007US20070202671 Method for forming fine pattern of semiconductor device
08/30/2007US20070202670 Method for fabricating semiconductor device
08/30/2007US20070202669 Epitaxial growth method and semiconductor device fabrication method
08/30/2007US20070202668 Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential laterial solidification
08/30/2007US20070202667 Method of manufacturing a semiconductor device
08/30/2007US20070202666 Method for fabricating semiconductor device
08/30/2007US20070202665 Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication
08/30/2007US20070202664 Chip ID applying method suitable for use in semiconductor integrated circuit
08/30/2007US20070202663 Managing integrated circuit stress using stress adjustment trenches
08/30/2007US20070202662 Managing integrated circuit stress using dummy diffusion regions
08/30/2007US20070202661 Semiconductor substrate, production method thereof and semiconductor device
08/30/2007US20070202660 Method For Producing Mixed Stacked Structures, Different Insulating Areas And/Or Localised Vertical Electrical conducting Areas
08/30/2007US20070202659 FinFET Body Contact Structure
08/30/2007US20070202658 Approach for fabricating cantilever probes for probe card assemblies
08/30/2007US20070202657 Method for fabricating capacitor in semiconductor device
08/30/2007US20070202656 Method of fabricating a semiconductor device
08/30/2007US20070202655 Method of providing a via opening in a dielectric film of a thin film capacitor
08/30/2007US20070202654 Spacer and process to enhance the strain in the channel with stress liner
08/30/2007US20070202653 Technique for forming a strained transistor by a late amorphization and disposable spacers
08/30/2007US20070202652 Elevation of transistor channels to reduce impact of shallow trench isolation on transistor performance
08/30/2007US20070202651 Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors
08/30/2007US20070202650 Low voltage power MOSFET device and process for its manufacture
08/30/2007US20070202649 Semiconductor device and method of manufacturing the same
08/30/2007US20070202648 Memory device and method of manufacturing the same
08/30/2007US20070202647 Method for manufacturing non volatile memory cells integrated on a semiconductor substrate
08/30/2007US20070202646 Method for forming a flash memory floating gate
08/30/2007US20070202645 Method for forming a deposited oxide layer
08/30/2007US20070202644 Schottky-barrier mos transistor on a fully-depleted semiconductor film and process for fabricating such a transistor
08/30/2007US20070202643 Method for separately optimizing spacer width for two or more transistor classes using a recess spacer integration
08/30/2007US20070202642 Thermally stable BiCMOS fabrication method and bipolar junction transistors formed according to the method
08/30/2007US20070202641 Transistor device having an increased threshold stability without drive current degradation
08/30/2007US20070202640 Low-k spacer integration into CMOS transistors
08/30/2007US20070202639 Dual stressed soi substrates
08/30/2007US20070202638 Vertical misfet manufacturing method, vertical misfet, semiconductor memory device manufacturing method, and semiconductor memory device
08/30/2007US20070202637 Body capacitor for soi memory
08/30/2007US20070202636 Method of controlling the film thickness uniformity of PECVD-deposited silicon-comprising thin films
08/30/2007US20070202635 Multi-orientation semiconductor-on-insulator (soi) substrate, and method of fabricating same
08/30/2007US20070202634 Method of manufacturing semiconductor device with offset sidewall structure
08/30/2007US20070202633 Semiconductor package and method for fabricating the same
08/30/2007US20070202632 Capacitor attachment method
08/30/2007US20070202631 Semiconductor package
08/30/2007US20070202630 Method for Manufacturing Semiconductor Device
08/30/2007US20070202629 Method for manufacturing integrated circuit
08/30/2007US20070202628 Manufacturing process for integrated piezo elements
08/30/2007US20070202627 Silicon Condenser Microphone and Manufacturing Method
08/30/2007US20070202626 Piezoelectric MEMS switches and methods of making
08/30/2007US20070202625 Active matrix organic luminescence display device and manufacturing method for the same
08/30/2007US20070202624 Nitride-based semiconductor light-emitting device and method of manufacturing the same
08/30/2007US20070202623 Wafer level package for very small footprint and low profile white LED devices
08/30/2007US20070202622 Method for manufacturing surface-emitting semiconductor laser
08/30/2007US20070202621 Method of manufacturing nitride semiconductor light emitting device
08/30/2007US20070202620 Fusing Nanowires Using In Situ Crystal Growth
08/30/2007US20070202619 Laser processing apparatus and laser processing method
08/30/2007US20070202618 Method of manufacturing information display panel
08/30/2007US20070202617 Method for fabricating stacked semiconductor components with through wire interconnects
08/30/2007US20070202616 Structure and method for reliability evaluation of fcpbga substrates for high power semiconductor packaging applications
08/30/2007US20070202615 Method of measuring critical dimension
08/30/2007US20070202614 Method and apparatus for combinatorially varying materials, unit process and process sequence
08/30/2007US20070202613 Plasma processing apparatus
08/30/2007US20070202612 Plasma-Polymerisation Of Polycylic Compounds
08/30/2007US20070202610 Method and apparatus for combinatorially varying materials, unit process and process sequence
08/30/2007US20070202420 Adjustable film frame aligner
08/30/2007US20070201276 Dual-gate, non-volatile memory cells, arrays thereof, methods of manufacturing the same and methods of operating the same
08/30/2007US20070201119 Laser treatment apparatus and method of manufacturing semiconductor device
08/30/2007US20070201020 Fiber optic darkfield ring light
08/30/2007US20070201016 Method And Apparatus For Seasoning Semiconductor Apparatus Of Sensing Plasma Equipment
08/30/2007US20070201010 Exposure Apparatus, Exposure Method, And Device Manufacturing Method
08/30/2007US20070200983 Display apparatus and method for manufacturing the same
08/30/2007US20070200981 Thin Film Transistor Array Panel and Manufacturing Method Thereof
08/30/2007US20070200580 Wafer probe
08/30/2007US20070200574 Sheet-like probe, method of producing the probe, and application of the probe
08/30/2007US20070200555 Contact pusher, contact arm, and electronic device test apparatus
08/30/2007US20070200477 Nanofabrication
08/30/2007US20070200377 Vacuum Suction Head, And Vacuum Suction Device And Table Using The Same
08/30/2007US20070200254 Method and apparatus for using flex circuit technology to create an electrode
08/30/2007US20070200251 Method of fabricating ultra thin flip-chip package
08/30/2007US20070200245 Semiconductor device and pattern generating method
08/30/2007US20070200229 Chip underfill in flip-chip technologies
08/30/2007US20070200227 Power semiconductor arrangement
08/30/2007US20070200217 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
08/30/2007US20070200216 Chip stack package
08/30/2007US20070200203 Semiconductor device and method for fabricating the same
08/30/2007US20070200196 Shallow trench isolation (STI) devices and processes
08/30/2007US20070200187 Nanowire device and method of making
08/30/2007US20070200184 Methods and apparatus for a stepped-drift MOSFET
08/30/2007US20070200179 Strain enhanced CMOS architecture with amorphous carbon film and fabrication method of forming the same
08/30/2007US20070200178 Gate-all-around type of semiconductor device and method of fabricating the same
08/30/2007US20070200175 Functional device and method of manufacturing it
08/30/2007US20070200174 SOI substrate, mask blank for charged particle beam exposure, and mask for charged particle beam exposure
08/30/2007US20070200169 Gate electrode of semiconductor device and method for fabricating the same
08/30/2007US20070200148 Element for solid-state imaging device
08/30/2007US20070200139 Semiconductor device, manufacturing method thereof, and display device
08/30/2007US20070200132 Electrical connection for optoelectronic devices
08/30/2007US20070200129 Transparent Positive Electrode
08/30/2007US20070200117 Silicon carbide semiconductor device having junction field effect transistor and method for manufacturing the same
08/30/2007US20070200114 Compound Semiconductor Device, Production Method Of Compound Semiconductor Device And Diode
08/30/2007US20070200113 Semiconductor device and fabrication method thereof
08/30/2007US20070200065 Monitoring system comprising infrared thermopile detector
08/30/2007US20070199974 Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
08/30/2007US20070199925 Method Of Manufacturing Sealed Electronic Component And Sealed Electronic Component
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