| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/30/2007 | US20070199923 Polishing device and polishing method |
| 08/30/2007 | US20070199922 Etch methods to form anisotropic features for high aspect ratio applications |
| 08/30/2007 | US20070199860 Vertical Heat Treatment System And Method Of Transferring Process Objects |
| 08/30/2007 | US20070199825 Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures |
| 08/30/2007 | US20070199660 Bonded body, wafer support member using the same, and wafer treatment method |
| 08/30/2007 | US20070199659 Pedestal for furnace |
| 08/30/2007 | US20070199657 Apparatus and method for plasma etching |
| 08/30/2007 | US20070199656 Hybrid wafer-holder |
| 08/30/2007 | US20070199655 Substrate processing apparatus, method for modifying substrate processing conditions and storage medium |
| 08/30/2007 | US20070199507 Apparatus to improve wafer temperature uniformity for face-up wet processing |
| 08/30/2007 | US20070199201 Vacuum Device, Operation Method For Vacuum Device, Exposure System, And Operation Method For Exposure System |
| 08/30/2007 | DE60034451T2 Mehrachsige integrierte sensorschaltung und sensorpackung Multi-axis sensor integrated circuit and sensor package |
| 08/30/2007 | DE19912834B4 Elektronische Steuereinheit Electronic control unit |
| 08/30/2007 | DE19824046B4 Verfahren zur Planarisierung von Halbleiterwafern Method for planarization of semiconductor wafers |
| 08/30/2007 | DE19811078B4 Halbleiterbauelement Semiconductor device |
| 08/30/2007 | DE19709764B4 Halbleitervorrichtung mit Elektrode aus Aluminium und feinkörnigem Silizium und ihr Herstellungsverfahren A semiconductor device having electrode of aluminum and fine-grained silicon and their method of preparation |
| 08/30/2007 | DE19581952B4 Process for controlled collapse chip connection - wherein ball-limiting metallurgy is etched in the presence of lead@-tin@ solder bumps |
| 08/30/2007 | DE19503959B4 Fotomaske zur Herstellung eines Mikromusters einer Halbleitervorrichtung Photo mask for manufacturing a micro-pattern of a semiconductor device |
| 08/30/2007 | DE112005002371T5 Unterfüllmaterial zur Verringerung eines BLM-Ablösungs- und Bruchpotentials in Halbleitereinrichtungen Underfill material for reducing a BLM-stripping and breakdown potential in semiconductor devices |
| 08/30/2007 | DE112005001926T5 Verfahren zur Herstellung von Kontaktöffnungen mit geringem Abstand in einem Flash-Speicher Process for the preparation of contact holes with a small distance in a flash memory |
| 08/30/2007 | DE10339770B4 Verfahren zum Herstellen einer FBGA-Anordnung A method for producing a FBGA arrangement |
| 08/30/2007 | DE10258412B4 Verfahren zur Herstellung einer Halbleitervorrichtung, insbesondere einer DRAM-Vorrichtung mit einer COB-Struktur A method of manufacturing a semiconductor device, in particular a DRAM device with a COB structure |
| 08/30/2007 | DE10240861B4 Mittels Feldeffekt steuerbares Halbleiterbauelement und Verfahren zu dessen Herstellung By means of field-effect-controllable semiconductor component and process for its preparation |
| 08/30/2007 | DE10240356B4 Elektrostatisches Halteelement Electrostatic holding element |
| 08/30/2007 | DE10228519B4 Flüssigkristalldisplay-Vorrichtung A liquid crystal display device |
| 08/30/2007 | DE102007007178A1 Kapazitive mikrobearbeitete Ultraschalltransducer und Verfahren zur Herstellung derselben Capacitive micromachined ultrasonic transducers and method of producing same |
| 08/30/2007 | DE102007006504A1 Ablenkvorrichtung für Gerät zur Elektronenstrahllithographie sowie Gerät zur Elektronenstrahllithographie For deflecting device for electron beam lithography and device for electron beam lithography |
| 08/30/2007 | DE102006045581A1 Halbleiterbauelement mit einem Trench-Gate und Verfahren zu seiner Fertigung A semiconductor device with a trench gate and process for its manufacturing |
| 08/30/2007 | DE102006031407A1 Silicon semiconductor wafer thinning for production of power semiconductor component, involves thinning polished wafer until semiconductor wafer with preset wafer thickness of less than specific micrometer is obtained |
| 08/30/2007 | DE102006019080B3 Housing manufacturing method for e.g. infrared sensor, involves enclosing electrical circuit along metal frame, where circuit is isolated along isolating contour that does not cut surface of substrate |
| 08/30/2007 | DE102006009478A1 Flip chip bonding fabricating method for semiconductor component, involves hardening of bumps after applying two-stage adhesive, and applying die with bumps made of hardened adhesive on substrate by contact of bumps with substrate contact |
| 08/30/2007 | DE102006009225A1 Silicon-doped layer manufacturing method for field effect transistor, involves forming semiconductor layer in recess to produce tensile strain in transistor channel region, and forming top coating on layer and silicon-doped layer on coating |
| 08/30/2007 | DE102006008929A1 Layer structure production for nitride semiconductor component on silicon surface, involves preparation of substrate having silicon surface on which nitride nucleation layer is deposited with masking layer |
| 08/30/2007 | DE102006008261A1 Etching solution for etching layer system, comprising phosphoric acid, nitric acid, de-ionized water and halogen component, which releases halogen ions that contain these components |
| 08/30/2007 | DE102006007321A1 Integrierte Schaltkreis-Anordnung und Verfahren zum Ermitteln des parasitären ohmschen Widerstands zumindest der Zuleitung zumindest einer Speicherzelle einer integrierten Schaltkreis-Anordnung Integrated circuit arrangement and method for determining the parasitic ohmic resistance of at least the feed of at least one memory cell of an integrated circuit arrangement |
| 08/30/2007 | DE102006007096A1 Metal oxide semiconductor field effect transistor, comprises drift zone having sub zone arranged between another sub zone and body zone, and drift zone is doped more strongly than sub zone |
| 08/30/2007 | DE102006004412B3 Verfahren zum Erhöhen der Ätzselektivität in einer Kontaktstruktur in Halbleiterbauelementen A method for increasing the etch selectivity of a contact structure in semiconductor devices |
| 08/30/2007 | DE102005051332B4 Halbleitersubstrat, Halbleiterchip, Halbleiterbauteil und Verfahren zur Herstellung eines Halbleiterbauteils Semiconductor substrate, the semiconductor chip, semiconductor device and method of manufacturing a semiconductor device |
| 08/30/2007 | DE102005026961B4 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates |
| 08/30/2007 | DE102004036435B4 Haltevorrichtung für scheibenförmige Objekte Holding device for disk-shaped objects |
| 08/30/2007 | CA2642445A1 Stabilized, non-aqueous cleaning compositions for microelectronics substrates |
| 08/29/2007 | EP1827069A2 Printed wiring board and method of manufacturing the same |
| 08/29/2007 | EP1827068A2 Printed wiring board and method of manufacturing the same |
| 08/29/2007 | EP1827065A2 Printed wiring board and method of manufacturing the same |
| 08/29/2007 | EP1826824A2 Semiconductor device and method of manufacturing the same |
| 08/29/2007 | EP1826822A1 Quantum dot array and production method therefor, and dot array element and production method thererfor |
| 08/29/2007 | EP1826819A2 Semiconductor memory device and manufacturing method thereof |
| 08/29/2007 | EP1826818A2 Semiconductor device and manufacturing method thereof |
| 08/29/2007 | EP1826816A1 Semiconductor device, electronic device and fabrication method of the same |
| 08/29/2007 | EP1826815A2 Semiconductor device and method of manufacturing the same |
| 08/29/2007 | EP1826814A1 Plasma doping method |
| 08/29/2007 | EP1826813A1 Stage device and exposure apparatus |
| 08/29/2007 | EP1826812A1 Method and device for receiving and/or transporting substrates |
| 08/29/2007 | EP1826580A2 Testing circuit and testing method for semiconductor device and semiconductor chip |
| 08/29/2007 | EP1826579A1 Multiple-capture DFT system for detecting or locating crossing clock-domain faults during self-test or scan test |
| 08/29/2007 | EP1826260A1 Cleaning composition for removing impurities and method of removing impurities using the same |
| 08/29/2007 | EP1826231A2 Organohydridosiloxane Resins With High Organic Content |
| 08/29/2007 | EP1825523A1 Method for the production of semiconducting or photovoltaically active films |
| 08/29/2007 | EP1825521A2 Nitrogen-containing field effect transistor gate stack containing a threshold voltage control layer formed via deposition of a metal oxide |
| 08/29/2007 | EP1825520A1 Semiconductor device and method for production thereof |
| 08/29/2007 | EP1825511A1 Semiconductor switching module |
| 08/29/2007 | EP1825509A2 Dual stressed soi substrates |
| 08/29/2007 | EP1825508A2 Method for forming self-aligned dual salicide in cmos technologies |
| 08/29/2007 | EP1825507A1 Increasing die strength by etching during or after dicing |
| 08/29/2007 | EP1825506A1 Method for producing deep trench structures |
| 08/29/2007 | EP1825505A2 Methodology for recovery of hot carrier induced degradation in bipolar devices |
| 08/29/2007 | EP1825504A1 Vertical bipolar transistor |
| 08/29/2007 | EP1825503A1 Method of producing an epitaxial layer on a semiconductor substrate and device produced with such a method |
| 08/29/2007 | EP1825502A2 Methods of exposure for the purpose of thermal management for imprint lithography processes |
| 08/29/2007 | EP1825501A2 Strained nmos transistor featuring deep carbon doped regions and raised donor doped source and drain |
| 08/29/2007 | EP1825500A2 Post-etch treatment to remove residues |
| 08/29/2007 | EP1825499A1 System for multiple removal of microchips from a wafer consisting of a plurality of microchips |
| 08/29/2007 | EP1694769A4 Dual-stage wafer applied underfills |
| 08/29/2007 | EP1614150B1 Device and method for cleaning and drying objects used to produce semiconductors, especially transport and cleaning containers for wafers |
| 08/29/2007 | EP1522078B1 Erasable and programmable non-volatile cell |
| 08/29/2007 | EP1474832A4 Method and system for molecular charge storage field effect transistor |
| 08/29/2007 | EP1444705B1 Method for effective trimming of resistors using pulsed heating |
| 08/29/2007 | EP1410397A4 Nanotube films and articles |
| 08/29/2007 | EP1409156A4 Methods of nanotube films and articles |
| 08/29/2007 | EP1393357B1 A method for making a metal-insulator-metal capacitor using plate-through mask techniques |
| 08/29/2007 | EP1373981B1 Lithographic apparatus with a mobile lens for producing digital holograms |
| 08/29/2007 | EP1368837B1 Semiconductor devices having field shaping regions |
| 08/29/2007 | EP1364417B1 Keepers for mram electrodes |
| 08/29/2007 | EP1364410B1 Semiconductor devices and their peripheral termination |
| 08/29/2007 | EP1305453A4 Ring-shaped high-density plasma source and method |
| 08/29/2007 | EP1301569A4 Absorbing compounds for spin-on glass anti-reflective coatings for photolithography |
| 08/29/2007 | EP1299490B1 Silane containing polishing composition for cmp |
| 08/29/2007 | EP1279194B1 Implantation process using sub-stoichiometric, oxygen doses at different energies |
| 08/29/2007 | EP1198822B1 New methodologies to reduce process sensitivity to the chamber condition |
| 08/29/2007 | EP1158077B1 Method and apparatus for producing single crystal of silicon carbide |
| 08/29/2007 | EP1157425B1 Igbt with pn insulation |
| 08/29/2007 | CN101027841A D/A conversion circuit, display panel drive circuit, and display |
| 08/29/2007 | CN101027786A Optical semiconductor device and method of manufacturing thereof |
| 08/29/2007 | CN101027780A III-V HEMT devices |
| 08/29/2007 | CN101027779A Poly-silicon-germanium gate stack and method for forming the same |
| 08/29/2007 | CN101027775A Manufacture of a layer including a component |
| 08/29/2007 | CN101027773A Stacked die module |
| 08/29/2007 | CN101027772A Independently accessed double-gate and tri-gate transistors in same process flow |
| 08/29/2007 | CN101027771A Method for fabricating dual-metal gate device |
| 08/29/2007 | CN101027770A A metal gate electrode semiconductor device |