Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/29/2007CN101026100A Flip chip packaging structure and its forming method
08/29/2007CN101026099A Method for manufacturing a substrate with cavity
08/29/2007CN101026098A Semiconductor device with recess grid and its manufacturing method
08/29/2007CN101026097A Processing method
08/29/2007CN101026096A Removal of silicon oxycarbide from substrates
08/29/2007CN101026095A Method for manufacturing semiconductor device
08/29/2007CN101026094A Method for forming flash unit array with reduced word-linepitch
08/29/2007CN101026093A Method for forming silicon layer and method for fabricating display substrate using same
08/29/2007CN101026092A Substrate for growing pendeo epitaxy and method of forming the same
08/29/2007CN101026091A Semiconductor device including impurity doped region and its forming method
08/29/2007CN101026090A Method for producing flexible array substrate board
08/29/2007CN101026089A Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
08/29/2007CN101026088A Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
08/29/2007CN101026087A Method for forming fine pattern of semiconductor device
08/29/2007CN101026086A Method for forming fine pattern of semiconductor device
08/29/2007CN101026085A Semiconductor device manufacturing equipment with vacuum system
08/29/2007CN101026084A Manufacturing method of semiconductor device
08/29/2007CN101026083A Reactor chip manufacturing method
08/29/2007CN101026080A Particle-optical apparatus equipped with a gas ion source
08/29/2007CN101026078A Ion injection device
08/29/2007CN101025796A Electronic label reverse packaging process
08/29/2007CN101025613A Interlock control apparatus
08/29/2007CN101025580A Semiconductor exposure method and method for operating semiconductor exposure device
08/29/2007CN101025578A A gas mixture for removing photoresist and post etch residue and use thereof
08/29/2007CN101025577A Pattern formation method
08/29/2007CN101025576A 激光加工装置及其加工方法 The laser processing apparatus and processing method
08/29/2007CN101025575A Base plate exposure device and base plate exposure method
08/29/2007CN101025574A Batch silicon wafer exposure method
08/29/2007CN101025573A Lithographic apparatus and device manufacturing method
08/29/2007CN101025572A Supporting body of plate
08/29/2007CN101025571A 器件制造方法和计算机程序产品 Device manufacturing method, and computer program products
08/29/2007CN101025570A Exposure method and exposure platform
08/29/2007CN101025569A Method for forming fine pattern of semiconductor device
08/29/2007CN101025566A Pattern forming method and gray-tone mask manufacturing method
08/29/2007CN101025564A Four-gradation photomask manufacturing method and photomask blank for use therein
08/29/2007CN101025530A Display panel and method of forming thereof
08/29/2007CN101025528A 像素结构及液晶显示面板 Pixel structure and the liquid crystal display panel
08/29/2007CN101025527A Mount structure, electrooptic device, and electronic device
08/29/2007CN101025526A Liquid crystal distributor
08/29/2007CN101025502A Production method of flexible electronic device
08/29/2007CN101025445A Process of fabricating microlens mold
08/29/2007CN101025431A High power semiconduction tube test method and device
08/29/2007CN101025427A Method for judging leakage current in integrated circuit and MOS element
08/29/2007CN101025426A 探针组合体 Probe assembly
08/29/2007CN101025393A Method and system of trace electric layer pull test
08/29/2007CN101024903A Gallium nitride crystal substrate and method of producing same
08/29/2007CN101024895A Epitaxial wafer and method for production of epitaxial wafer
08/29/2007CN101024882A Cleaning solution for silicon surface and methods of fabricating semiconductor device using the same
08/29/2007CN101024480A Method for forming microelectronic spring structures on a substrate
08/29/2007CN101024451A Dual-face imaging system and method used for plane base sheet
08/29/2007CN101024450A Transport apparatus
08/29/2007CN101024332A Pattern formation method, liquid droplet ejection apparatus and electro-optical device
08/29/2007CN101024277A Three-dimensional network for chemical mechanical polishing
08/29/2007CN101024213A Method for producing chip-bearing disc protective layer
08/29/2007CN100334743C 半导体器件 Semiconductor devices
08/29/2007CN100334741C The structure and methods for strained fin - type field effect transistor
08/29/2007CN100334740C Power MOSFET and its mfg. method
08/29/2007CN100334738C Dynamic memory and its manufacturing method
08/29/2007CN100334737C Semiconductor integrated circuit device contg. nonvolatile semiconductor storage
08/29/2007CN100334736C Semiconductor device and method for manufacturing the same
08/29/2007CN100334734C Semiconductor storage unit and semiconductor memory
08/29/2007CN100334733C Single-chip pararrel isolation amplifier
08/29/2007CN100334732C Semiconductor integrated circuit device and its mfg. method
08/29/2007CN100334731C Trench DMOS transistor with embedded trench schottky rectifier
08/29/2007CN100334730C Semiconductor and inverter structure and method for forming semiconductor structure
08/29/2007CN100334729C Semiconductor integrated device and apparatus for designing the same
08/29/2007CN100334728C Semiconductor integrated circuit capable of facilitating layout modification
08/29/2007CN100334727C Resin moulded devices and manufacturing installation therefor
08/29/2007CN100334725C Semiconductor device and mfg. method thereof
08/29/2007CN100334724C 半导体集成电路器件 The semiconductor integrated circuit device
08/29/2007CN100334723C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/29/2007CN100334720C 连接垫结构 Connection pad structure
08/29/2007CN100334716C Method of programming coding of read-only memory devices and read-only memory formed thereby
08/29/2007CN100334715C Non-volatile storage element
08/29/2007CN100334714C An improved method for forming minimally spaced MRAM structures
08/29/2007CN100334713C Manufacturing methods for single-transistor random access memory
08/29/2007CN100334712C Memory element and its production method
08/29/2007CN100334711C Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
08/29/2007CN100334710C Mfg. method for conductor fig.
08/29/2007CN100334709C Semiconductor device and method of manufacturing the same
08/29/2007CN100334708C Semiconductor device mfg. method
08/29/2007CN100334707C Method for producing semiconductor device
08/29/2007CN100334706C Semiconductor device and its manufacturing method
08/29/2007CN100334705C Power semiconductor module with detector for detecting main circuit current through power semiconductor element
08/29/2007CN100334704C Laser annealing appts. and its technics
08/29/2007CN100334703C Method of calibrating and using a semiconductor processing system
08/29/2007CN100334702C Method for testing state settings of chip set
08/29/2007CN100334701C Apparatus and method for wafer attachment
08/29/2007CN100334700C Mold release layer transferring film and laminate film
08/29/2007CN100334699C Method of making connecting lead wire of chip back surface
08/29/2007CN100334698C A process for making semiconductor devices and semiconductor devices
08/29/2007CN100334697C Method for mfg. semiconductor device
08/29/2007CN100334696C Etching process for silicide low dielectric material
08/29/2007CN100334695C Process for silicon low dielectric material curing in furnace
08/29/2007CN100334694C Reaction ion etching equipment and method for mercury-cadmium-tellurium focal plane device micro mesa array
08/29/2007CN100334693C Method for etching 15-50 nanowire wide polycrystalline silicon gate
08/29/2007CN100334692C Constant pressure control method for process reaction chamber and pressure regulating valve thereof
08/29/2007CN100334691C Substrate processing apparatus and substrate processing method
08/29/2007CN100334690C Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
08/29/2007CN100334689C Method for manufacturing semiconductor chip
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