Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/29/2007CN101027769A Transfer method with a treatment of a surface to be bonded
08/29/2007CN101027768A Thin layer transfer method wherein a co-implantation step is performed according to conditions avoiding blisters formation and limiting roughness
08/29/2007CN101027767A Container conveying appratus
08/29/2007CN101027766A Semiconductor integrated circuit device and method for inspecting the same, semiconductor wafer and burn-in inspection apparatus
08/29/2007CN101027765A Methods for forming co-planar wafer-scale chip packages
08/29/2007CN101027764A Conductor frame for an electronic component and method for the production thereof
08/29/2007CN101027763A Metal gate transistors with epitaxial source and drain regions
08/29/2007CN101027762A Improving short channel effect of MOS devices by retrograde well engineering using tilted dopant implantation into recessed source/drain regions
08/29/2007CN101027761A Planarizing a semiconductor structure to form replacement metal gates
08/29/2007CN101027760A Low-K dielectric etch
08/29/2007CN101027759A 线边缘粗糙度控制 Line edge roughness control
08/29/2007CN101027758A Semiconductor device and method of forming the same
08/29/2007CN101027757A Laser irradiation apparatus and laser irradiation method
08/29/2007CN101027756A Thermal oxide formation apparatus and the method by chemical vapor deposition in wafer
08/29/2007CN101027755A Method for manufacturing semiconductor wafer
08/29/2007CN101027754A Formation of lattice-tuning semiconductor substrates
08/29/2007CN101027753A Flexible electro-optical apparatus and method for manufacturing the same
08/29/2007CN101027752A Integrated SiCr metal thin film resistors for SiGe RF-BiCMOS technology
08/29/2007CN101027751A Semiconductor device and method for manufacturing the same
08/29/2007CN101027750A Die attach area cut-on-fly method and apparatus
08/29/2007CN101027749A Technique and apparatus for depositing thin layers of semiconductors for solar cell fabricaton
08/29/2007CN101027607A Mask blank manufacturing method
08/29/2007CN101027426A Method for deposition of ruthenium metal layers in a thermal chemical vapor deposition process
08/29/2007CN101027424A System for and method of manufacturing a large-area backplane by use of a small-area shadow mask
08/29/2007CN101027281A Adamantane derivative, process for producing the same, and photosensitive material for photoresist
08/29/2007CN101027267A Method for purifying silicon carbide structures
08/29/2007CN101026931A Right-angled signal line making method and its circuit board
08/29/2007CN101026921A Plasma generation apparatus and work processing apparatus
08/29/2007CN101026920A Plasma generation apparatus and work processing apparatus
08/29/2007CN101026285A Optoelectric composite substrate and electronic apparatus
08/29/2007CN101026225A Method for manufacturing semiconductor device
08/29/2007CN101026208A Light-emitting diode and its preparing method
08/29/2007CN101026207A Light-emitting diode package structure and its package method
08/29/2007CN101026201A Method for making irregularly surfaced substrate and method for fabricating photovoltaic device
08/29/2007CN101026200A Method for preparing nitrogen-doped modified TiO2 film under ammonia regulation and high pressure reaction device
08/29/2007CN101026199A Method for for preparing cadmiumsulfide quantum dot sensitized porous titanium dioxide photoelectrode
08/29/2007CN101026196A Semiconductor device and method of manufacturing semiconductor device
08/29/2007CN101026194A Non-volatile floating-gate memory based on two-layer nano silicon structure and its preparing method
08/29/2007CN101026192A Semiconductor device and method of manufacturing the same
08/29/2007CN101026191A Semiconductor device and method of manufacturing the same
08/29/2007CN101026190A Trench high-pressure N-type metal oxide semiconductor tube and its preparing process
08/29/2007CN101026189A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/29/2007CN101026187A Thin film semiconductor device, and its making process and liquid crystal display
08/29/2007CN101026183A 显示装置及其制造方法 Display device and manufacturing method
08/29/2007CN101026182A Organic light emitting display and method of fabricating the same
08/29/2007CN101026180A System for displaying images including electroluminescent device and method for fabricating the same
08/29/2007CN101026179A OLED integrated colour filter image quality improvement structure and method
08/29/2007CN101026178A Heat efficiency reduced minimum phase change memory and its making method
08/29/2007CN101026174A Semiconductor device and method for manufacturing same
08/29/2007CN101026173A Semiconductor device and method for manufacturing same
08/29/2007CN101026172A 半导体器件 Semiconductor devices
08/29/2007CN101026171A 薄膜晶体管阵列面板和显示装置 The thin film transistor array panel and a display device
08/29/2007CN101026170A Semiconductor memory and method for manufacturing a semiconductor memory
08/29/2007CN101026169A Semiconductor integrated circuit device and its manufacturing method
08/29/2007CN101026168A Dual gate multi-bit semiconductor memory array
08/29/2007CN101026165A 存储器元件及其形成方法 Memory device and method of forming the
08/29/2007CN101026162A Semiconductor device and its making method
08/29/2007CN101026157A Semiconductor device and its making method
08/29/2007CN101026156A 半导体器件 Semiconductor devices
08/29/2007CN101026150A Method for packaging organic light emitting display with frit seal and reinforcing structure
08/29/2007CN101026148A Multi-chip build up package structure for optronic chip and its manufacturing method
08/29/2007CN101026146A Power semiconductor module and its manufacturing method
08/29/2007CN101026144A Radiating type stereo package structure and its manufacturing method
08/29/2007CN101026143A Flexible circuit substrate for flip-chip-on-flex applications
08/29/2007CN101026140A Substrate for forming semiconductor element and manufacturing method of the semiconductor element
08/29/2007CN101026139A 半导体集成电路器件 The semiconductor integrated circuit device
08/29/2007CN101026137A Semiconductor heat-dissipating substrate, and manufacturing method and assembly therefor
08/29/2007CN101026136A Chip package structure and its package process
08/29/2007CN101026133A Semiconductor package structure with radiating fin and its manufacturing method
08/29/2007CN101026131A Semiconductor device and a manufacturing method thereof
08/29/2007CN101026130A Active matrix substrate, display device and manufacturing method for active matrix substrate
08/29/2007CN101026129A Nonvolatile memory device and method of forming the same
08/29/2007CN101026128A Method of manufacturing non-volatile memory device
08/29/2007CN101026127A Process for manufacturing semiconductor element with different voltage tolerance
08/29/2007CN101026126A Method for producing semiconductor chip
08/29/2007CN101026125A Wafer cutting method
08/29/2007CN101026124A Methods for fabricating semiconductor device structures and semiconductor device structures formed by the methods
08/29/2007CN101026123A Method of forming isolation structure of semiconductor device
08/29/2007CN101026122A Semiconductor device assembly and methods of manufacturing the same
08/29/2007CN101026121A Semiconductor isolating structure and its forming method
08/29/2007CN101026120A 半导体器件 Semiconductor devices
08/29/2007CN101026119A Etch resistant wafer processing apparatus and method for producing the same
08/29/2007CN101026118A Transporting machine
08/29/2007CN101026117A Transport system
08/29/2007CN101026116A Wafer detecting device and wafer detecting method
08/29/2007CN101026115A Appratus for detecting crack of substrate and substrate processing appratus
08/29/2007CN101026114A Judging method for bottom thin film residual thickness in opening
08/29/2007CN101026113A Recognition method and system
08/29/2007CN101026112A Electronic component, semiconductor device, methods of manufacturing the same
08/29/2007CN101026111A Wire bonding method and apparatus
08/29/2007CN101026110A Method of manufacturing circuit device
08/29/2007CN101026109A Semiconductor device and manufacturing method for the same
08/29/2007CN101026108A Flip chip package method and its circuit substrate solder preforms forming method
08/29/2007CN101026107A Wafer level package bump manufacturing method
08/29/2007CN101026106A Solder bump lead-free flux preparing process
08/29/2007CN101026105A Method of resin sealing electronic part
08/29/2007CN101026104A Display device and method for manufacturing the same
08/29/2007CN101026103A Package on package with cavity and method for manufacturing thereof
08/29/2007CN101026102A Stacked chip package using warp-proof insulative material and method of manufacturing the same
08/29/2007CN101026101A Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
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