Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/16/2007WO2007091670A1 Apparatus and method for processing wafer
08/16/2007WO2007091653A1 Nitride semiconductor device
08/16/2007WO2007091639A1 Method for manufacturing soi substrate
08/16/2007WO2007091638A1 Susceptor and apparatus for manufacturing epitaxial wafer
08/16/2007WO2007091637A1 Semiconductor light-emitting device and process for producing the same
08/16/2007WO2007091635A1 Contact-bonding device
08/16/2007WO2007091621A1 Radiation-sensitive composition
08/16/2007WO2007091619A1 Electrostatic chuck
08/16/2007WO2007091583A1 Semiconductor production plant
08/16/2007WO2007091574A1 Multilayer wiring structure, and method for fabricating multilayer wiring
08/16/2007WO2007091569A1 Method for producing film-forming material
08/16/2007WO2007091555A1 Apparatus for controlling substrate processing apparatus and program for controlling substrate processing apparatus
08/16/2007WO2007091541A1 Semiconductor memory
08/16/2007WO2007091532A1 Switching device, rewritable logic integrated circuit, and memory device
08/16/2007WO2007091503A1 Robot device
08/16/2007WO2007091498A1 Method of determining pickup order of components
08/16/2007WO2007091463A1 Catadioptric imaging system, exposure device, and device manufacturing method
08/16/2007WO2007091439A1 Abrasive pad and abrasion device
08/16/2007WO2007091435A1 Plasma treatment apparatus
08/16/2007WO2007091412A1 Method for pattern film formation and pattern film forming apparatus
08/16/2007WO2007091405A1 Reflective tft substrate and method for manufacturing reflective tft substrate
08/16/2007WO2007091402A1 Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board
08/16/2007WO2007091383A1 Semiconductor device
08/16/2007WO2007091361A1 Method, program and arithmetic processor for setting microprocessor power supply voltage
08/16/2007WO2007091360A1 Semiconductor device and method for manufacturing same
08/16/2007WO2007091339A1 Method of forming metal film
08/16/2007WO2007091316A1 p-CHANNEL MOS TRANSISTOR AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
08/16/2007WO2007091302A1 Semiconductor device and process for producing the same
08/16/2007WO2007091301A1 Semiconductor device and process for producing the same
08/16/2007WO2007091299A1 Method for heating tft substrate, temperature measuring method for tft substrate, and temperature control method for tft substrate
08/16/2007WO2007091214A1 Semiconductor device and method of manufacturing thereof
08/16/2007WO2007091196A2 A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object
08/16/2007WO2007090900A1 Device for treating thin disk-shaped objects in a continuous method in a vertical reactor
08/16/2007WO2007090856A1 Cmos devices with hybrid channel orientations, and method for fabricating the same
08/16/2007WO2007073356A3 Improved singulation system and method
08/16/2007WO2007042772A3 An electrically conductive release liner
08/16/2007WO2007040834A3 Plural treatment step process for treating dielectric films
08/16/2007WO2007038164A3 Methods for nanostructure doping
08/16/2007WO2007035200A3 Improved, higher selectivity, method for passivating short circuit current paths in semiconductor devices
08/16/2007WO2007015951A3 Semiconductor structures formed on substrates and methods of manufacturing the same
08/16/2007WO2007005823A3 Semiconductor wafer cutting blade and method
08/16/2007WO2007001179A3 Method and device for supplying and discharging carriers with electronic components
08/16/2007WO2006138103A3 Method for silicon based dielectric chemical vapor deposition
08/16/2007WO2006115968A3 Active interconnects and control points in integrated circuits
08/16/2007WO2006104819A3 A method and system for removing an oxide from a substrate
08/16/2007WO2006044349A9 Planar substrate devices integrated with finfets and method of manufacture
08/16/2007WO2005022602A3 A method and apparatus for semiconductor processing
08/16/2007US20070192757 Pattern generation method and charged particle beam writing apparatus
08/16/2007US20070192057 Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those
08/16/2007US20070190913 Polishing apparatus and polishing method
08/16/2007US20070190911 Polishing pad and forming method
08/16/2007US20070190908 Semiconductor device and method for manufacturing the semiconductor device
08/16/2007US20070190906 Polishing medium for chemical-mechanical polishing, and polishing method
08/16/2007US20070190905 Polishing pad and semiconductor device manufacturing method
08/16/2007US20070190904 Wafer holder and wafer conveyor equipped with the same
08/16/2007US20070190887 Display apparatus and method of manufacturing the same
08/16/2007US20070190812 Semiconductor device having sufficient process margin and method of forming same
08/16/2007US20070190811 Method of forming patterns and/or pattern data for controlling pattern density of semiconductor devices and pattern density controlled semiconductor devices
08/16/2007US20070190810 Laser irradiation method and method of manufacturing a semiconductor device
08/16/2007US20070190809 Wafer processing method, semiconductor device manufacturing method, and wafer processing apparatus
08/16/2007US20070190808 Low-k dielectric layers for large substrates
08/16/2007US20070190807 Method for forming dielectric or metallic films
08/16/2007US20070190806 UV blocking and crack protecting passivation layer fabricating method
08/16/2007US20070190805 Method for improving the alignment accuracy of semiconductor process and method of forming opening
08/16/2007US20070190804 Minimizing low-k dielectric damage during plasma processing
08/16/2007US20070190803 Device and method to eliminate shorting induced by via to metal misalignment
08/16/2007US20070190802 Method for manufacturing semiconductor device, substrate treater, and substrate treatment system
08/16/2007US20070190801 Method and apparatus for forming oxynitride film and nitride film, oxynitride film, nitride film, and substrate
08/16/2007US20070190800 Low-k dielectric material
08/16/2007US20070190799 Refurbishing a wafer having a low-k dielectric layer
08/16/2007US20070190798 Removing a low-k dielectric layer from a wafer
08/16/2007US20070190797 Cleaning method for use in semiconductor device fabrication
08/16/2007US20070190796 Method and apparatus for manufacturing a functional layer consisting of at least two components
08/16/2007US20070190795 Method for fabricating a semiconductor device with a high-K dielectric
08/16/2007US20070190794 Conductive polymers for the electroplating
08/16/2007US20070190793 Dual trench alternating phase shift mask fabrication
08/16/2007US20070190792 Method and system for selectively etching a dielectric material relative to silicon
08/16/2007US20070190791 Removing a low-k dielectric layer from a wafer by chemical mechanical polishing
08/16/2007US20070190790 Fine grinding a low-k dielectric layer off a wafer
08/16/2007US20070190789 Compositions and methods for CMP of indium tin oxide surfaces
08/16/2007US20070190788 Wafer removing force reduction on cmp tool
08/16/2007US20070190787 Method for etching silicon-germanium in the presence of silicon
08/16/2007US20070190786 Site-selectively modified micro-and nanostructures and the methods of their fabrication
08/16/2007US20070190785 Methods, apparatus, and systems for causing fluid to flow through or into via holes, vents, and other openings or recesses that communicate with surfaces of substrates of semiconductor device components
08/16/2007US20070190784 Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
08/16/2007US20070190783 Patterning crystalline compounds on surfaces
08/16/2007US20070190782 Method of depositing Ru films having high density
08/16/2007US20070190781 Methods of forming metal-containing films over surfaces of semiconductor substrates
08/16/2007US20070190780 Atomic layer deposition of barrier materials
08/16/2007US20070190779 Diffusion Barrier Layers and Methods Comprising for Depositing Metal Films by CVD or ALD Processes
08/16/2007US20070190778 Via plug formation in dual damascene process
08/16/2007US20070190777 Method of making dense, conformal, ultra-thin cap layers for nanoporous low-k ild by plasma assisted atomic layer deposition
08/16/2007US20070190776 Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
08/16/2007US20070190775 Low selectivity deposition methods
08/16/2007US20070190774 Method for fabricating a metal-insulator-metal capacitor
08/16/2007US20070190773 Method of fabricating a semiconductor device
08/16/2007US20070190772 Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
08/16/2007US20070190771 System and method for stress free conductor removal
08/16/2007US20070190770 Post-cmp treating liquid and manufacturing method of semiconductor device using the same
08/16/2007US20070190769 Method for forming low dielectric constant fluorine-doped layers
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