Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/30/2007WO2007098215A2 Method for growth of semipolar (al,in,ga,b)n optoelectronic devices
08/30/2007WO2007098076A2 Shielded gate trench (sgt) mosfet devices and manufacturing processes
08/30/2007WO2007098071A2 Process tuning gas injection from the substrate edge
08/30/2007WO2007097942A1 Method for removing a coating from a substrate using a defocused laser beam
08/30/2007WO2007097938A1 Devices including graphene layers epitaxially grown on single crystal substrates
08/30/2007WO2007097897A1 Stabilized, non-aqueous cleaning compositions for microelectronics substrates
08/30/2007WO2007097559A1 Probe pin assembly and method for manufacturing the same
08/30/2007WO2007097508A1 Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of frabricating the same
08/30/2007WO2007097507A1 Semiconductor chip with solder bump and method of frabricating the same
08/30/2007WO2007097466A1 Measuring device and method, processing device and method, pattern forming device and method, exposing device and method, and device fabricating method
08/30/2007WO2007097457A1 Composition for forming antireflection film and antireflection film
08/30/2007WO2007097432A1 Method for forming amorphous carbon film and method for manufacturing semiconductor device using same
08/30/2007WO2007097380A1 Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method
08/30/2007WO2007097379A1 Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method and device manufacturing method
08/30/2007WO2007097350A1 Position measuring device and position measuring method, mobile body driving system and mobile body driving method, pattern forming device and pattern forming method, exposure device and exposure method, and device manufacturing method
08/30/2007WO2007097270A1 Film forming apparatus and substrate processing method
08/30/2007WO2007097264A1 Semiconductor element
08/30/2007WO2007097233A1 Cleaning liquid for lithography and cleaning method using same
08/30/2007WO2007097223A1 Mounting method
08/30/2007WO2007097212A1 Method for manufacturing organic semiconductor device and composition for forming insulating film used therein
08/30/2007WO2007097207A1 Inspecting method, inspecting apparatus and control program
08/30/2007WO2007097199A1 Heat treatment equipment, heater and its manufacturing method
08/30/2007WO2007097179A1 Method for manufacturing soi substrate
08/30/2007WO2007097165A1 Field effect transistor
08/30/2007WO2007097147A1 Conveyance device and conveyance method
08/30/2007WO2007097103A1 Method and apparatus for activating compound semiconductor
08/30/2007WO2007097074A1 Active matrix substrate, display, television receiver, method for producing active matrix substrate and method for forming gate insulation film
08/30/2007WO2007097068A1 Active matrix substrate, display device and television receiver
08/30/2007WO2007097024A1 Vaporizer, semiconductor production apparatus and process of semiconductor production
08/30/2007WO2007096996A1 Semiconductor device and process for producing the same
08/30/2007WO2007096995A1 Rapid heat treatment equipment
08/30/2007WO2007096984A1 Buffer device, buffer arrangement method, and information processing device
08/30/2007WO2007096976A1 Semiconductor device and method for manufacturing same
08/30/2007WO2007096949A1 Photo lithography system, photo lithography method and method for fabricating electronic device
08/30/2007WO2007096946A1 Package and method for producing same
08/30/2007WO2007096581A2 Radio frequency integrated circuit manufacturing
08/30/2007WO2007096473A1 Method and arrangement for forming electronic device
08/30/2007WO2007096426A1 Method for producing partial soi structures comprising zones connecting a superficial layer and a substrate
08/30/2007WO2007096405A1 Nitride semiconductor component and method for the production thereof
08/30/2007WO2007096095A2 Etching solution and method for structuring a ubm layer system
08/30/2007WO2007096017A1 Method for producing planar insulating layers with breakthroughs at the correct position by means of laser cutting and devices produced accordingly
08/30/2007WO2007095973A1 Integrated system for semiconductor substrate processing using liquid phase metal deposition
08/30/2007WO2007095916A2 Device for aligning and machining a wafer
08/30/2007WO2007079477A3 Apparatus and method for test structure inspection
08/30/2007WO2007078957A3 Method and structure for reducing the external resistance of a three-dimensional transistor through use of epitaxial layers
08/30/2007WO2007078892A3 A tensile strained nmos transistor using group iii-n source/drain regions
08/30/2007WO2007078823A3 Method of manufacturing rfid devices
08/30/2007WO2007075568A3 Laser anneal of vertically oriented semiconductor structures while maintaining a dopant profile
08/30/2007WO2007056258A3 Methods for fabricating multi-terminal phase change devices
08/30/2007WO2007050420A3 Semiconductor device with reduced package cross-talk and loss
08/30/2007WO2007031922A3 A structure for a semiconductor device and a method of manufacturing the same
08/30/2007WO2007021403A3 Low-temperature oxide removal using fluorine
08/30/2007WO2007014294A3 Solutions integrated circuit integration of alternative active area materials
08/30/2007WO2007011544A3 Electronically connecting substrate with electrical device
08/30/2007WO2007005639A3 Lead frame isolation using laser technology
08/30/2007WO2007005592A3 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
08/30/2007WO2006105782A3 Method and device for transferring a chip to a contact substrate
08/30/2007WO2006094307A3 Simultaneous and selective partitioning of via structures using plating resist
08/30/2007WO2005122285A3 Methods and devices for fabricating and assembling printable semiconductor elements
08/30/2007US20070204243 Stress analysis method, wiring structure design method, program, and semiconductor device production method
08/30/2007US20070203662 Testing circuit and testing method for semiconductor device and semiconductor chip
08/30/2007US20070203607 Semiconductor manufacturing apparatus, remote control system therefor, and remote operation device
08/30/2007US20070202710 Method for fabricating semiconductor device using hard mask
08/30/2007US20070202709 Mold and method of manufacturing display device
08/30/2007US20070202708 Method for forming a deposited oxide layer
08/30/2007US20070202707 Ion implantation for increasing etch rate differential between adjacent materials
08/30/2007US20070202706 Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrate
08/30/2007US20070202705 Method for fabricating semiconductor device
08/30/2007US20070202704 Method for etching platinum and method for fabricating capacitor using the same
08/30/2007US20070202703 Polishing composition and polishing method
08/30/2007US20070202702 forming film on wafer having at least one trench structure thereon, polishing surface of film by providing a polishing composition to provide a first polished surface, rinsing surface, and polishing with second polishing composition; provides surface free of residual silicon nitride in diffusion areas
08/30/2007US20070202701 Plasma etching apparatus and method
08/30/2007US20070202700 Etch methods to form anisotropic features for high aspect ratio applications
08/30/2007US20070202699 Electronic component fabrication method
08/30/2007US20070202698 Methods for fabricating one or more metal damascene structures in a semiconductor wafer
08/30/2007US20070202697 Method for forming fine pattern of semiconductor device
08/30/2007US20070202696 Method of manufacturing solid-state imaging device and solid-state imaging device
08/30/2007US20070202695 Method for fabricating a semiconductor device
08/30/2007US20070202694 Method of forming a layer and method of removing reaction by-products
08/30/2007US20070202693 Electrochemical deposition of one or more materials according to desired cross-sectional configurations so as to build up three dimensional structures from a plurality of at least partially adhered layers of deposited material; simplification
08/30/2007US20070202692 Method for forming silicide and method for fabricating semiconductor device
08/30/2007US20070202691 Method for fabricating a semiconductor device with self-aligned contact
08/30/2007US20070202690 Method of making openings in a layer of a semiconductor device
08/30/2007US20070202689 Methods of forming copper vias with argon sputtering etching in dual damascene processes
08/30/2007US20070202688 Method for forming contact opening
08/30/2007US20070202687 Method for fabricating capacitor
08/30/2007US20070202685 High performance system-on-chip inductor using post passivation process
08/30/2007US20070202684 High performance system-on-chip inductor using post passivation process
08/30/2007US20070202683 Stacked contact bump
08/30/2007US20070202682 Manufacturing method of semiconductor device
08/30/2007US20070202681 Bumping process
08/30/2007US20070202680 Semiconductor packaging method
08/30/2007US20070202679 Method for fabricating contact plug of semiconductor device
08/30/2007US20070202678 Catalytically enhanced atomic layer deposition process
08/30/2007US20070202677 Contact formation
08/30/2007US20070202676 Integration scheme for cu/low-k interconnects
08/30/2007US20070202675 Method for separately optimizing spacer width for two transistor groups using a recess spacer etch (RSE) integration
08/30/2007US20070202674 Vertical fet with nanowire channels and a silicided bottom contact
08/30/2007US20070202673 Article comprising metal oxide nanostructures and method for fabricating such nanostructures
08/30/2007US20070202672 Method and apparatus for using flex circuit technology to create a reference electrode channel
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