Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/06/2007DE102006009353A1 Wafer treatment, involves coating front side of wafer with layer with separation properties and carrier layer, where carrier layer exhibits electrostatic properties and includes elastomer layer or hard layer of polyimide
09/06/2007DE102006009280A1 Verfahren zur Herstellung von CMOS-Schaltkreisen A process for the fabrication of CMOS circuits
09/06/2007DE102006005420A1 Stapelbares Halbleiterbauteil und Verfahren zur Herstellung desselben A stackable semiconductor device and method of manufacturing the same
09/06/2007DE102006003608A1 Process to recover high-purity silicon material from laser etching in polycrystalline form
09/06/2007DE102006003605A1 Process to recover high-purity silicon material from laser etching in polycrystalline form
09/06/2007DE102006002481B3 Kombinierter Widerstandstemperatursensor Combined resistance temperature sensor
09/06/2007DE102005047856B4 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten, Systemträger zur Aufnahme der Halbleiterbauteilkomponenten und Verfahren zur Herstellung des Systemträgers und von Halbleiterbauteilen Semiconductor device having embedded in plastic housing compound semiconductor device components, system unit for receiving the semiconductor device components and methods of making the system carrier and semiconductor devices
09/06/2007DE102005046736B4 Vorrichtung und Verfahren zum Beladen einer Sockel- bzw. Adapter-Einrichtung mit einem entsprechenden Halbleiter-Bauelement Apparatus and method for loading a socket or adapter device with a corresponding semiconductor device
09/06/2007DE102004024885B4 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
09/06/2007DE10137184B4 Verfahren zur Herstellung eines elektronischen Bauteils mit einem Kuststoffgehäuse und elektronisches Bauteil A method of manufacturing an electronic component and electronic component with a Kuststoffgehäuse
09/06/2007DE10126309B4 Rückwärtssperrendes Leistungshalbleiterbauelement und Verfahren zu dessen Herstellung Reverse-locking power semiconductor device and process for its preparation
09/05/2007EP1830456A1 Magnetic guiding apparatus, stage apparatus, exposure apparatus and device manufacturing method
09/05/2007EP1830416A2 Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices
09/05/2007EP1830402A2 A spiral inductor formed in a semiconductor substrate and a method for forming the inductor
09/05/2007EP1830401A1 Microstructure for forming a silicone and germanium substrate on an insulator of the Si1-XGeX type
09/05/2007EP1830400A1 Method of manufacturing a substrate by germanium condensation
09/05/2007EP1830399A1 Resin composition for flip-chip packaging and resin composition for forming bump
09/05/2007EP1830397A2 Surface treatment method of compound semiconductor substrate, fabrication method of compound semiconductor, compound semiconductor substrate, and semiconductor wafer
09/05/2007EP1830396A1 Magnetic fluid sealing unit for semiconductor wafer vertical heat treating apparatus
09/05/2007EP1830395A1 Method for measuring position of mask surface in height direction, exposure apparatus and exposure method
09/05/2007EP1830394A1 Exposure apparatus, exposure method and device manufacturing method
09/05/2007EP1830393A1 Photoresist coating liquid supplying apparatus, and photoresist coating liquid supplying method and photoresist coating apparatus using such photoresist coating liquid supplying apparatus
09/05/2007EP1830392A2 Thermal processing system with accross-flow liner
09/05/2007EP1830391A2 Surface protective film peeling method and surface protective film peeling apparatus
09/05/2007EP1830309A1 Electronic device manufacturing method
09/05/2007EP1830229A2 Photosensitive polymer including copolymer of alkyl vinyl ether and resist composition containing the same
09/05/2007EP1830228A1 Compound for resist and radiation-sensitive composition
09/05/2007EP1830227A1 Resist composition for liquid immersion exposure and method for resist pattern formation
09/05/2007EP1830196A1 Test mode activation by phase comparison
09/05/2007EP1829945A1 Film, silica film and method of forming the same, composition for forming silica film, and electronic part
09/05/2007EP1829836A1 Large glass substrate for photomask and method for producing same, computer readable recording medium, and method for exposing mother glass
09/05/2007EP1829114A2 Reduced channel pitch in semiconductor device
09/05/2007EP1829108A1 Multi-thickness dielectric for semiconductor memory
09/05/2007EP1829104A1 Thermally controlled fluidic self-assembly
09/05/2007EP1829103A1 Eeprom array with self-aligned shallow-trench isolation
09/05/2007EP1829102A1 Semiconductor device
09/05/2007EP1829101A2 Flexible electronic circuit articles and method of making thereof
09/05/2007EP1829100A1 Method for transferring a circuit to a grounding plane
09/05/2007EP1829099A1 Method for treating the surface of a wafer
09/05/2007EP1829098A1 Soi substrate materials and method to form si-containing soi and underlying substrate with different orientations
09/05/2007EP1829097A1 Component for detecting especially infrared electromagnetic radiation
09/05/2007EP1829096A2 Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method
09/05/2007EP1829095A2 Process sequence for doped silicon fill of deep trenches
09/05/2007EP1829094A2 Wet etching of the edge and bevel of a silicon wafer
09/05/2007EP1829093A2 Cmp composition comprising surfactant
09/05/2007EP1829092A2 A method for forming a semiconductor device with gate sidewall spacers of specific dimensions
09/05/2007EP1829091A2 Optimization of beam utilization
09/05/2007EP1829090A1 METHOD OF MANUFACTURING DOPED Inx AlyGa1-x-yN EPITAXIAL LAYERS, DOPED InxAlyGa1-x-yN EPITAXIAL LAYER AND SEMICONDUCTOR MULTI-LAYER STRUCTURE COMPRISING AT LEAST ONE DOPED InxALyGa1-x-yN EPITAXIAL LAYER, WHERE
09/05/2007EP1829089A2 Use of cl2 and/or hcl during silicon epitaxial film formation
09/05/2007EP1829088A1 Lift-off patterning processes employing energetically-stimulated local removal of solid-condensed-gas layers
09/05/2007EP1829087A2 Method and system for providing a highly textured magnetoresistance element and magnetic memory
09/05/2007EP1829086A2 Selective epitaxy process with alternating gas supply
09/05/2007EP1829085A1 Apparatus and method for drying disk-shaped substrates
09/05/2007EP1829084A1 Rotatable device for holding a substrate
09/05/2007EP1828820A1 Single axis light pipe for homogenizing one axis of illumination systems based on laser diodes
09/05/2007EP1828444A2 Topotactic anion exchange oxide films and method of producing the same
09/05/2007EP1828333A1 Polishing composition and polishing method
09/05/2007EP1828070A2 Selective high dielectric constant material etchant
09/05/2007EP1827712A2 Device for coating the outer edge of a substrate during microelectronics manufacturing
09/05/2007EP1502296A4 Semiconductor probe with resistive tip and method of fabricating the same, and information recording apparatus, information reproducing apparatus, and information measuring apparatus having the semiconductor probe
09/05/2007EP1464455B1 Scalar type robot for carrying flat plate-like object; and flat plate-like object processing system
09/05/2007EP1464080B1 Method for production of a bonding device
09/05/2007EP1407179A4 Single-handed cord/cable management device
09/05/2007EP1373278A4 Metalloamide and aminosilane precursors for cvd formation of dielectric thin films
09/05/2007EP1230678B1 Self-aligned metal caps for interlevel metal connections
09/05/2007EP1200981B1 Gas distribution apparatus for semiconductor processing
09/05/2007EP1194949B1 Surface finishing of soi substrates using an epi process
09/05/2007EP1038996B1 Combinatorial molecular layer epitaxy device
09/05/2007EP1030788B1 Plasma processing methods and apparatus
09/05/2007CN200944400Y Chip glue silver rubber plate with improved structure
09/05/2007CN101032068A Linear motor, stage apparatus and exposure apparatus
09/05/2007CN101032032A Nonplanar device with thinned lower body portion and method of fabrication
09/05/2007CN101032030A 半导体装置 Semiconductor device
09/05/2007CN101032029A Semiconductor assembly comprising a tunnel contact and method for producing said assembly
09/05/2007CN101032027A Thin film transistor and its manufacturing method
09/05/2007CN101032024A Gate stacks
09/05/2007CN101032021A Low profile, chip-scale package and method of fabrication
09/05/2007CN101032020A Semiconductor storage device and method for manufacturing the same
09/05/2007CN101032019A Deep trench electrically isolated medium voltage cmos devices and method for making the same
09/05/2007CN101032018A Strained channel fet using sacrificial spacer
09/05/2007CN101032017A Dual gate cmos fabrication
09/05/2007CN101032016A Semiconductor device and semiconductor device testing method
09/05/2007CN101032015A Capping of metal interconnects in integrated circuit electronic devices
09/05/2007CN101032014A New structure for microelectronics and microsystem and manufacturing process
09/05/2007CN101032013A Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
09/05/2007CN101032012A Wire bump materials
09/05/2007CN101032011A 等离子体增强氮化物层 Plasma-enhanced nitride layer
09/05/2007CN101032010A Methods of optimization of implant conditions to minimize channeling and structures formed thereby
09/05/2007CN101032009A Methods for forming a transistor
09/05/2007CN101032008A Semiconductor manufacturing apparatus, flow rate correction method for same, and program
09/05/2007CN101032007A Method for forming copper wiring
09/05/2007CN101032006A Production method for semiconductor device and substrate processing device
09/05/2007CN101032005A Plasma film forming method and apparatus therefor
09/05/2007CN101032004A Method for forming a thin complete high-permittivity dielectric layer
09/05/2007CN101032003A Method for stripping photoresist from etched wafer
09/05/2007CN101032002A Plasma processing system for treating a substrate
09/05/2007CN101032001A CMP polishing compound and method for polishing substrate
09/05/2007CN101032000A Method and system for forming a passivated metal layer
09/05/2007CN101031999A Reduction of source and drain parasitic capacitance in cmos devices
09/05/2007CN101031998A Shower head of chemical vapor deposition apparatus