Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/18/2007US7270931 Silicon-containing compositions for spin-on ARC/hardmask materials
09/18/2007US7270886 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
09/18/2007US7270884 Prevents peeling of noble metal electrodes, such as Pt, from a silicon dioxide (5i02) substrate in capacitor structures of memory devices
09/18/2007US7270868 Micromechanical component
09/18/2007US7270867 Leadless plastic chip carrier
09/18/2007US7270849 Organic siloxane copolymer film, method and deposition apparatus for producing same, and semiconductor device using such copolymer film
09/18/2007US7270844 Supplying the material to be deposited;atomizing the material to produce a plurality of discrete particles;applying a force; collimating particles by surrounding the carrier gas with a coflowing sheath gas; passing the particles through no more than one orifice; depositing
09/18/2007US7270765 Composition for forming dielectric layer, MIM capacitor and process for its production
09/18/2007US7270763 Anisotropic wet etching of silicon
09/18/2007US7270762 Polishing compositions for noble metals
09/18/2007US7270761 Fluorine free integrated process for etching aluminum including chamber dry clean
09/18/2007US7270760 Method and apparatus for simulating standard test wafers
09/18/2007US7270729 System for, and method of, etching a surface on a wafer
09/18/2007US7270724 Scanning plasma reactor
09/18/2007US7270715 Chemical vapor deposition apparatus
09/18/2007US7270713 Tunable gas distribution plate assembly
09/18/2007US7270712 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
09/18/2007US7270709 Method and apparatus of generating PDMAT precursor
09/18/2007US7270597 Rinsing to remove by-products; conditioning wafer surface of copper or oxide; applying ammonium chloride, copper chloride, hydrochloric acid, ammonium persulfate, sulfuric acid, ammonium hydroxide, citric acid, ammonium citrate, hydrofluoric acid, tetramethylammonium hydroxide, and/or chelate compound
09/18/2007US7270594 Polishing apparatus
09/18/2007US7270573 Electrical connector with load bearing features
09/18/2007US7270510 Device and method for transporting wafer-shaped articles
09/18/2007US7270478 X-ray alignment system for fabricating electronic chips
09/18/2007US7270258 Method of fabrication of semiconductor integrated circuit device
09/18/2007US7270240 Device for accomodating substrates
09/18/2007US7270137 Apparatus and method of securing a workpiece during high-pressure processing
09/18/2007US7270136 Apparatus for cleaning the edges of wafers
09/18/2007US7270130 Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation
09/18/2007US7269979 Set of washing machine and dryer and rear cover assembly thereof
09/18/2007US7269898 Method for making an edge intensive antifuse
09/18/2007US7269897 Manufacturing process of a stacked semiconductor device
09/17/2007CA2579325A1 Method for producing a semiconductor component having a metallic control electrode, and semiconductor component
09/13/2007WO2007103854A2 Hybrid orientation scheme for standard orthogonal circuits
09/13/2007WO2007103829A1 Method for production of metal oxide coatings
09/13/2007WO2007103824A1 Nanostructured metal oxides
09/13/2007WO2007103820A1 Nanostructured indium-doped iron oxide
09/13/2007WO2007103643A2 Method and apparatus for thermal processing structures formed on a substrate
09/13/2007WO2007103610A2 Method and apparatus for a stepped-drift mosfet
09/13/2007WO2007103609A2 Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors
09/13/2007WO2007103578A1 Method of polishing a tungsten carbide surface
09/13/2007WO2007103566A2 Determination of lithography misalignment based on curvature and stress mapping data of substrates
09/13/2007WO2007103343A1 Trim process for critical dimension control for integrated circuits
09/13/2007WO2007103224A2 Structure and method of making lidded chips
09/13/2007WO2007103147A2 U-shaped transistor and corresponding manufacturing method
09/13/2007WO2007103088A2 Shared contact structures for integrated circuits
09/13/2007WO2007103036A2 Method of semiconductor package singulation
09/13/2007WO2007102604A1 Liquid treating device and method of defoaming treating liquid
09/13/2007WO2007102598A1 Electrostatic holding device
09/13/2007WO2007102582A1 Substrate treating device system
09/13/2007WO2007102487A1 Treated substratum with hydrophilic region and water-repellent region and process for producing the same
09/13/2007WO2007102484A1 Device manufacturing method, device manufacturing system, and measuring/examining instrument
09/13/2007WO2007102482A1 Mounting method, board with electrical component, and electrical apparatus
09/13/2007WO2007102466A1 Plasma processing apparatus
09/13/2007WO2007102464A1 Processing device
09/13/2007WO2007102456A1 Semiconductor storage device and method for operating same
09/13/2007WO2007102454A1 Temperature regulation method
09/13/2007WO2007102426A1 Substrate processing apparatus and substrate processing method
09/13/2007WO2007102425A1 Positive resist composition and method for forming resist pattern
09/13/2007WO2007102338A1 Photomask, method for manufacturing such photomask and pattern forming method using such photomask
09/13/2007WO2007102335A1 Sequential comparison type ad converter, semiconductor integrated circuit device manufacturing method, and semiconductor integrated circuit device manufacturing method
09/13/2007WO2007102333A1 Methods of depositing ruthenium film and memory medium readable by computer
09/13/2007WO2007102321A1 Stage unit
09/13/2007WO2007102304A1 Apparatus and method for cutting sheet
09/13/2007WO2007102298A1 Rotary drive apparatus and electron beam irradiation apparatus
09/13/2007WO2007102289A1 Photosensitive composition, photosensitive film, method for permanent pattern formation using said photosensitive composition, and printed board
09/13/2007WO2007102287A1 Conductive paste and solar cell
09/13/2007WO2007102281A1 Method for manufacturing silicon carbide semiconductor device, and silicon carbide semiconductor device
09/13/2007WO2007102261A1 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board
09/13/2007WO2007102257A1 Semiconductor device and method for inspecting semiconductor device
09/13/2007WO2007102248A1 Semiconductor device and process for producing the same
09/13/2007WO2007102239A1 Semiconductor integrated circuit
09/13/2007WO2007102214A1 Semiconductor device and method for manufacturing the same
09/13/2007WO2007102210A1 Heat focusing jig for anodic bonding, method of anodic bonding and apparatus therefor
09/13/2007WO2007102192A1 Method for fabricating semiconductor device
09/13/2007WO2007102041A1 Lead fingers of a semiconductor chip with an even layer of coating
09/13/2007WO2007101851A1 Coating method for enhanced electromigration resistance of copper
09/13/2007WO2007101764A1 Device for fluid treating plate-like articles
09/13/2007WO2007101352A1 Method of selective removal of organophosphonic acid molecules from their self-assembled monolayer on si substrates
09/13/2007WO2007046849A3 Microwavable composite material and fabrication method thereof
09/13/2007WO2007038427A3 Method and apparatus for electronic device manufacture using shadow masks
09/13/2007WO2007031930A3 Method of manufacturing semiconductor device with different metallic gates
09/13/2007WO2007002376A3 Method of preparing electrode
09/13/2007WO2006121604A3 Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
09/13/2007WO2006110162A3 Artificial dielectrics using nanostructures
09/13/2007WO2006098291A9 Photosensitive resin composition
09/13/2007WO2005108641A3 Multi-workpiece processing chamber
09/13/2007US20070214448 Orientation dependent shielding for use with dipole illumination techniques
09/13/2007US20070214098 Neural network for determining the endpoint in a process
09/13/2007US20070213864 Control device and method for a substrate processing apparatus
09/13/2007US20070213488 Interlayer insulating film, method for forming the same and polymer compositon
09/13/2007US20070213467 Resin Composition and Semiconductor Device Produced By Using the Same
09/13/2007US20070213447 Over-coating agent for forming fine patterns and a method of forming fine patterns using such agent
09/13/2007US20070212988 Polishing apparatus
09/13/2007US20070212987 Monitoring a metal layer during chemical mechanical polishing
09/13/2007US20070212980 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
09/13/2007US20070212899 Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same
09/13/2007US20070212898 Method for depositing film and method for manufacturing semiconductor device
09/13/2007US20070212897 High-temperature attachment of organic molecules to substrates
09/13/2007US20070212896 Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
09/13/2007US20070212895 Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system