| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/13/2007 | US20070212894 Method of manufacturing semiconductor device |
| 09/13/2007 | US20070212893 System and method for sputtering a tensile silicon nitride film |
| 09/13/2007 | US20070212892 Method of forming semiconductor device structures using hardmasks |
| 09/13/2007 | US20070212891 Manufacturing method of substrate for ink jet head and manufacturing method of ink jet recording head |
| 09/13/2007 | US20070212890 Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head |
| 09/13/2007 | US20070212889 Trim process for critical dimension control for integrated circuits |
| 09/13/2007 | US20070212888 Silicon Substrate Etching Method |
| 09/13/2007 | US20070212887 Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium |
| 09/13/2007 | US20070212886 Organosilane polymers, hardmask compositions including the same and methods of producing semiconductor devices using organosilane hardmask compositions |
| 09/13/2007 | US20070212885 Method and composition for plasma etching of a self-aligned contact opening |
| 09/13/2007 | US20070212884 Coating and developing apparatus, coating film forming method, and storage medium storing program for performing the method |
| 09/13/2007 | US20070212882 Substrate polishing method and method of manufacturing semiconductor device |
| 09/13/2007 | US20070212881 Chemical mechanical polishing apparatus and operating method thereof |
| 09/13/2007 | US20070212880 Semiconductor device with charge storage pattern and method for fabricating the same |
| 09/13/2007 | US20070212879 Formation of lattice-tuning semiconductor substrates |
| 09/13/2007 | US20070212878 Variable width conductive lines having substantially constant impedance |
| 09/13/2007 | US20070212877 Method of forming a dual damascene structure |
| 09/13/2007 | US20070212876 Method for manufacturing wiring substrate |
| 09/13/2007 | US20070212874 Method for filling shallow isolation trenches and other recesses during the formation of a semiconductor device and electronic systems including the semiconductor device |
| 09/13/2007 | US20070212873 Guard Ring for Improved Matching |
| 09/13/2007 | US20070212872 Single mask process for variable thickness dual damascene structures, other grey-masking processes, and structures made using grey-masking |
| 09/13/2007 | US20070212871 Method of manufacturing interconnect substrate |
| 09/13/2007 | US20070212870 Interconnect structure with a barrier-redundancy feature |
| 09/13/2007 | US20070212869 Wire bonding method for preventing polymer cracking |
| 09/13/2007 | US20070212868 Method, system, and apparatus for gravity assisted chip attachment |
| 09/13/2007 | US20070212867 Method and structure for improving bonding reliability in bond pads |
| 09/13/2007 | US20070212866 Method of manufacturing semiconductor device |
| 09/13/2007 | US20070212865 Method for planarizing vias formed in a substrate |
| 09/13/2007 | US20070212864 Manufacturing a semiconductive device using a controlled atomic layer removal process |
| 09/13/2007 | US20070212863 Double Exposure Double Resist Layer Process For Forming Gate Patterns |
| 09/13/2007 | US20070212862 Process for forming schottky rectifier with PtNi silicide schottky barrier |
| 09/13/2007 | US20070212861 Laser surface annealing of antimony doped amorphized semiconductor region |
| 09/13/2007 | US20070212860 Method for crystallizing a semiconductor thin film |
| 09/13/2007 | US20070212859 Method of thermal processing structures formed on a substrate |
| 09/13/2007 | US20070212858 Method for crystallizing a semiconductor thin film |
| 09/13/2007 | US20070212857 Integrated Circuit With Bulk and SOI Devices Connected with an Epitaxial Region |
| 09/13/2007 | US20070212856 Determination of lithography misalignment based on curvature and stress mapping data of substrates |
| 09/13/2007 | US20070212855 Metal-Induced Crystallization of Amorphous Silicon in Thin Film Transistors |
| 09/13/2007 | US20070212854 Method of separating semiconductor dies |
| 09/13/2007 | US20070212853 Semiconductor Device and Method of Manufacturing the Same |
| 09/13/2007 | US20070212852 Method of fabricating a thin film |
| 09/13/2007 | US20070212851 In-place bonding of microstructures |
| 09/13/2007 | US20070212850 Gap-fill depositions in the formation of silicon containing dielectric materials |
| 09/13/2007 | US20070212849 Method of fabricating a groove-like structure in a semiconductor device |
| 09/13/2007 | US20070212848 Method of making an isolation trench and resulting isolation trench |
| 09/13/2007 | US20070212847 Multi-step anneal of thin films for film densification and improved gap-fill |
| 09/13/2007 | US20070212846 Substrate processing apparatus, method for examining substrate processing conditions, and storage medium |
| 09/13/2007 | US20070212845 MIM capacitor structure and fabricating method thereof |
| 09/13/2007 | US20070212844 Method for making a capacitor |
| 09/13/2007 | US20070212843 Semiconductor apparatus and method of manufacturing said semiconductor apparatus |
| 09/13/2007 | US20070212842 Manufacturing method of high-voltage MOS transistor |
| 09/13/2007 | US20070212841 Structure and method for a sidewall SONOS memory device |
| 09/13/2007 | US20070212840 Method for forming a self-aligned twin well region with simplified processing |
| 09/13/2007 | US20070212839 Method for fabricating semiconductor device |
| 09/13/2007 | US20070212838 Methods of performance improvement of HVMOS devices |
| 09/13/2007 | US20070212837 Method And Apparatus Of Fabricating Semiconductor Device |
| 09/13/2007 | US20070212836 Fabricating method of single electron transistor (SET) by employing nano-lithographical technology in the semiconductor process |
| 09/13/2007 | US20070212835 Non-volatile semiconductor memory device and method of manufacturing the same |
| 09/13/2007 | US20070212834 Multiple-gate device with floating back gate |
| 09/13/2007 | US20070212833 Methods for making a nonvolatile memory device comprising a shunt silicon layer |
| 09/13/2007 | US20070212832 Method for making a multibit transistor |
| 09/13/2007 | US20070212831 Method for manufacturing semiconductor device having plural electroconductive plugs |
| 09/13/2007 | US20070212830 Trench memory with monolithic conducting material and methods for forming same |
| 09/13/2007 | US20070212829 Method of manufacturing a semiconductor device |
| 09/13/2007 | US20070212828 Method for manufacturing semiconductor device |
| 09/13/2007 | US20070212827 Method of Forming a Silicon Layer and Method of Manufacturing a Display Substrate by Using the Same |
| 09/13/2007 | US20070212826 Laser Processing Method and Laser Processing Apparatus |
| 09/13/2007 | US20070212825 Thin film semiconductor device and method for manufacturing same |
| 09/13/2007 | US20070212824 Method for manufacturing thin film transistor display array with dual-layer metal line |
| 09/13/2007 | US20070212823 Method for integrating DMOS into sub-micron CMOS process |
| 09/13/2007 | US20070212822 Method for fabricating a semiconductor package |
| 09/13/2007 | US20070212821 Method for manufacturing semiconductor device |
| 09/13/2007 | US20070212820 Method and device including reworkable alpha particle barrier and corrosion barrier |
| 09/13/2007 | US20070212819 Silicone Adhesive |
| 09/13/2007 | US20070212818 Multi-layer device |
| 09/13/2007 | US20070212817 Method and Process of Manufacturing Robust High Temperature Solder Joints |
| 09/13/2007 | US20070212816 Substrate processing system |
| 09/13/2007 | US20070212815 Sealed three dimensional metal bonded integrated circuits |
| 09/13/2007 | US20070212814 Method for manufacturing semiconductor device |
| 09/13/2007 | US20070212813 Perforated embedded plane package and method |
| 09/13/2007 | US20070212812 Wafer level chip scale package system with a thermal dissipation structure |
| 09/13/2007 | US20070212811 Low temperature CVD process with selected stress of the CVD layer on CMOS devices |
| 09/13/2007 | US20070212810 Memory device and method of manufacturing the device by simultaneously conditioning transition metal oxide layers in a plurality of memory cells |
| 09/13/2007 | US20070212809 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method |
| 09/13/2007 | US20070212805 Thin-film microelectromechanical device fabrication process |
| 09/13/2007 | US20070212804 Solid-state imaging device and method for manufacturing thereof |
| 09/13/2007 | US20070212803 III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer |
| 09/13/2007 | US20070212802 Method for manufacturing light emitting diode package |
| 09/13/2007 | US20070212801 System for adjusting manufacturing equipment, method for adjusting manufacturing equipment, and method for manufacturing semiconductor device |
| 09/13/2007 | US20070212800 Methods for detecting charge effects during semiconductor processing |
| 09/13/2007 | US20070212799 Method of Assessing Potential for Charging Damage in Integrated Circuit Designs and Structures for Preventing Charging Damage |
| 09/13/2007 | US20070212798 Die loss estimation using universal in-line metric (uilm) |
| 09/13/2007 | US20070212797 Method of forming a ferroelectric device |
| 09/13/2007 | US20070212796 Method for manufacturing ferroelectric memory device and ferroelectric memory device |
| 09/13/2007 | US20070212795 Device and method for improving interface adhesion in thin film structures |
| 09/13/2007 | US20070212620 Mask data generation method and mask |
| 09/13/2007 | US20070212619 A transparent substrate having a light-shielding film of a metal dry-etchable by fluorine and an etching mask film deposited on the light-shielding film of another resistant to fluorine dry etching; pattern size variation arising from density dependency reduced so high accuracy; microstructure |
| 09/13/2007 | US20070212617 For exposure of semiconductor wafer with dipole illumination light; photoresists |
| 09/13/2007 | US20070212567 Aluminum Nitride Junction Body And Method Of Producing The Same |
| 09/13/2007 | US20070212485 Gasification monitor, method for detecting mist, film forming method and film forming apparatus |