Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/11/2007DE102006030015A1 Verfahren zur Herstellung von Speicherbauelementen und Halbleiterspeicherbauelement Process for the preparation of memory devices and semiconductor memory device
10/11/2007DE102006019122A1 Verfahren zur Herstellung einer integrierten Speichervorrichtung und Speichervorrichtung A method of manufacturing an integrated storage device and storage device
10/11/2007DE102006018235B3 Semiconductor memory component, has substrate at main side, where lower bit lines are formed in substrate and arranged parallel to each other at distance, and word lines arranged over lower bit lines and transverse to lower bit lines
10/11/2007DE102006017795A1 Halbleiterpeicherbauelement und Herstellungsverfahren Halbleiterpeicherbauelement and manufacturing processes
10/11/2007DE102006017116A1 Vorrichtung und Verfahren zur Herstellung eines Gegenstands mittels Moldingtechnik Apparatus and method for producing an article by means of Molding technique
10/11/2007DE102006016530A1 Storage capacitor for dynamic RAM memory module, has two memory electrodes, memory dielectric arranged between two memory electrodes, and intermediate layer made of pure carbon, where one electrode layer completely covers dielectric
10/11/2007DE102006016173A1 Molding machine for embedding semi-formed articles comprises mold halves which fit together to form molding chamber, in which adjustable support for semi-formed article is mounted
10/11/2007DE102006015781A1 Semiconductor wafer useful for the production of electronic components, comprises inner area arranged in the middle of the wafer, outer area, and a first surface, which is formed of a semiconductor element in the inner area
10/11/2007DE102006015447A1 Leistungshalbleiterbauelement mit einem Leistungshalbleiterchip und Verfahren zur Herstellung desselben Power semiconductor component thereof with a power semiconductor chip and method for producing
10/11/2007DE102006015132A1 Semiconductor structure for use in smart power technology product, has deep trench isolation with meander-shaped course formed in control of bays such that one of diffusion areas is arranged in one of bays
10/11/2007DE102006015131A1 Semiconductor structure, has buried layer formed in parts of semiconductor substrate, and trench isolation arranged and electrically isolating sinker contact from adjacent areas of epilayer
10/11/2007DE102006015096A1 Verfahren zur Verringerung der durch Polieren hervorgerufenen Schäden in einer Kontaktstruktur durch Bilden einer Deckschicht A method of reducing the damages caused by polishing in a contact structure by forming a covering layer
10/11/2007DE102006015090A1 Transistor`s e.g. p-type MOS transistor, embedded deformation layers producing method for e.g. memory chip, involves forming recesses near gate electrodes of transistors, and epitaxially growing deformed semiconductor material in recess
10/11/2007DE102006015089A1 System und Verfahren zur Scheibenhandhabung in Halbleiterprozessanlagen System and method for wafer handling in semiconductor process equipment
10/11/2007DE102006015087A1 Verfahren zur Herstellung eingebetteter Drain/Source-Gebiete auf der Grundlage eines Prozesses zum kombinierten Ätzen von Abstandshaltern und einer Aussparung Process for the preparation of embedded drain / source regions on the basis of a process for combined etching of spacers and a recess
10/11/2007DE102006015086A1 Verfahren zur Herstellung äußerst flacher Übergänge mit hoher Qualität durch eine Kombination einer Festphasenepitaxie und einer Laserausheizung A process for producing extremely shallow junctions with high quality by a combination of a solid phase epitaxy and a Laserausheizung
10/11/2007DE102006015077A1 Technik zur Bereitstellung von Verspannungsquellen in Transistoren in unmittelbarer Nähe zu einem Kanalgebiet durch Vertiefen von Drain- und Source-Gebieten Technique for providing tension springs in transistors in close proximity to a channel region by recessing drain and source regions
10/11/2007DE102006015076A1 Halbleiterbauelement mit SOI-Transistoren und Vollsubstrattransistoren und ein Verfahren zur Herstellung A semiconductor device with SOI transistors, and bulk transistors and a process for preparing
10/11/2007DE102006015075A1 Technik zur Bereitstellung von Verspannungsquellen in MOS-Transistoren in unmittelbarer Nähe zu einem Kanalgebiet Technique for providing tension springs in MOS transistors in the immediate vicinity of a channel region
10/11/2007DE102006014580A1 Vertical high volt semiconductor device`s e.g. thyristor, lip, has lateral semiconductor device provided in boundary region adjacent to cell field to contribute to current load-carrying capacity when high volt semiconductor device is on
10/11/2007DE102006012615A1 Enclosing unit, has intermediate layers enclosing electronic circuit, and claddings surrounding intermediate layers, where electronic circuit is surrounded by one intermediate layer
10/11/2007DE102006008997A1 Verfahren und Vorrichtung zum Aufnehmen und/oder Transportieren von Substraten Method and apparatus for receiving and / or transporting substrates
10/11/2007DE102005063400A1 Halbleiterbauelementanordnung und Verfahren zu deren Herstellung A semiconductor device assembly and method for their preparation
10/11/2007DE102005061263B4 Halbleiterwafersubstrat für Leistungshalbleiterbauelemente sowie Verfahren zur Herstellung desselben The same semiconductor wafer substrate for power semiconductor devices and methods for preparing
10/11/2007DE102005059034B4 SOI-Isolationsgrabenstrukturen SOI insulation grave structures
10/11/2007DE102005058435B4 Halbleiterbauelement mit einem Channelstopper und Verfahren zur Erzeugung eines Channelstoppers A semiconductor device comprising a channel stopper and method for generating a channel stopper
10/11/2007DE102004042538B4 Verfahren zum Herstellen eines Gehäuses für eine elektronische Komponente A method of manufacturing a housing for an electronic component
10/11/2007DE102004017166B4 Verfahren zur Herstellung von Bipolar-Transistoren A process for the production of bipolar transistors
10/11/2007DE102004016697B4 Verfahren zum Herstellen von Halbleiterchips umfassend ein Verbindungsverfahren, das Löten mit einem Lot umfasst, und Halbleiterchip A method of producing semiconductor chips comprising a connecting method, soldering with a solder comprising, and the semiconductor chip
10/11/2007DE10146226B4 Vertikale intern verbundene Grabenzelle und Herstellungsverfahren dafür Vertical internally connected grave cell and manufacturing method thereof
10/11/2007DE10132763B4 Integrierte Halbleiterschaltung, Verfahren zum Kühlen eines Mikrowellenschaltungsbereiches und Verfahren zum Herstellen einer integrierten Halbleiterschaltung A semiconductor integrated circuit, method of cooling a microwave circuit section and method for manufacturing a semiconductor integrated circuit
10/11/2007DE10122628B4 Verfahren zum Abtrennen von Scheiben von einem Werkstück A method for cutting wafers from a workpiece
10/11/2007DE10057806B4 Ferroelektrische Speicheranordnung und Verfahren zu ihrer Herstellung The ferroelectric memory device and methods for their preparation
10/10/2007EP1843470A1 Power system inhibit method and device and structure therefor
10/10/2007EP1843404A2 Zinc oxide films containing p-type dopant and process for preparing same
10/10/2007EP1843397A1 Semiconductor device
10/10/2007EP1843390A1 Semiconductor device provided with mis structure and method for manufacturing the same
10/10/2007EP1843389A1 Method and system of providing doping concentration based on diffusion, surface oxidation and etch-back steps, and method of producing solar cells
10/10/2007EP1843388A1 Substrate surface treating apparatus
10/10/2007EP1843387A1 Immersion exposure system, and recycle method and supply method of liquid for immersion exposure
10/10/2007EP1843386A1 Liquid removing apparatus, exposure apparatus and device manufacturing method
10/10/2007EP1843385A1 Projection optical system, exposure system, and exposure method
10/10/2007EP1843384A1 Exposure device and device manufacturing method
10/10/2007EP1843383A2 Patterns of conductive objects on a substrate and method of producing thereof
10/10/2007EP1843382A2 Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
10/10/2007EP1843277A1 USB chip card
10/10/2007EP1843204A1 Exposure device, exposure method, and micro device manufacturing method
10/10/2007EP1843126A1 Method and apparatus for measuring thin film sample, and method and apparatus for manufacturing thin film sample
10/10/2007EP1842942A2 GaN crystal substrate
10/10/2007EP1842941A1 Method for forming a group III nitride material on a silicon substrate
10/10/2007EP1842940A1 Method for forming a group III nitride material on a silicon substrate
10/10/2007EP1842240A2 TiC AS A THERMALLY STABLE p-METAL CARBIDE ON HIGH k SiO2 GATE STACKS
10/10/2007EP1842239A2 Structure and method to optimize strain in cmosfets
10/10/2007EP1842238A2 Semiconductor devices
10/10/2007EP1842237A2 Electronic device and process for forming same
10/10/2007EP1842236A2 Process for high voltage superjunction termination
10/10/2007EP1842235A1 Dual silicide process to improve device performance
10/10/2007EP1842234A1 A bga-type test and burn-in socket for integrated circuits(ics)
10/10/2007EP1842233A1 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
10/10/2007EP1842232A1 Improvements to ceramic packages for high frequency circuits
10/10/2007EP1842231A2 Micro-feature fill process and apparatus using hexachlorodisilane or other chlorine-containing silicon precursor
10/10/2007EP1842230A1 Method of producing a silicon oxide-based material with a low dielectric constant
10/10/2007EP1842229A1 Bipolar transistor and method of fabricating the same
10/10/2007EP1842228A2 System and method for creating a surface pattern
10/10/2007EP1842227A2 Diamond medical devices
10/10/2007EP1842225A2 Cluster tool architecture for processing a substrate
10/10/2007EP1842224A1 Methods and apparatus having wafer level chip scale package for sensing elements
10/10/2007EP1842223A1 Method for manufacturing an oled or a blank for forming an oled as well as such a blank or oled
10/10/2007EP1842100A1 Exposure method, method for forming projecting and recessed pattern, and method for manufacturing optical element
10/10/2007EP1841831A2 Polishing composition and polishing method
10/10/2007EP1561368B1 Multi-layer circuit assembly and process for preparing the same
10/10/2007EP1547131A4 Large-diameter sic wafer and manufacturing method thereof
10/10/2007EP1495485A4 Remote monitoring system for chemical liquid delivery
10/10/2007EP1490895A4 Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire
10/10/2007EP1470447A4 Photolithographic critical dimension control using reticle measurements
10/10/2007EP1402081A4 Ring-type sputtering target
10/10/2007EP1315005B1 Method of forming optical thin film
10/10/2007EP1309988B1 Method for wafer position data retrieval in semiconductor wafer manufacturing
10/10/2007EP1269535B1 Method for cutting an object and for further processing the cut material and a carrier for holding the object or the cut material
10/10/2007EP1243029B1 Bipolar transistor with upper heterojunction collector and method for making the same
10/10/2007EP1224700A4 Lateral rf mos device with improved breakdown voltage
10/10/2007EP1205576B1 Method for producing ceramic
10/10/2007EP1115146B1 Method and apparatus for vacuum processing
10/10/2007CN200959337Y LED lens fixer
10/10/2007CN200959336Y LED shared operating platform
10/10/2007CN200959327Y Magnetic analytic system of ion filler
10/10/2007CN200959025Y LED testing operation platform
10/10/2007CN101053113A 传输线 Transmission line
10/10/2007CN101053112A Transmission line pair and transmission line group
10/10/2007CN101053085A Thin film semiconductor devices and methods of making
10/10/2007CN101053084A Electronic circuit board and its manufacturing method
10/10/2007CN101053083A Semiconductor device manufacturing method and plasma oxidation method
10/10/2007CN101053082A Electronic device including a self-assembled monolayer, and a method of fabricating the same
10/10/2007CN101053078A High withstand voltage semiconductor device covered with resin and manufacturing method therefor
10/10/2007CN101053077A Method of forming narrowly spaced flash memory contact openings
10/10/2007CN101053076A 半导体集成电路 The semiconductor integrated circuit
10/10/2007CN101053075A Diamond semiconductor element and method for manufacturing same
10/10/2007CN101053074A Planarising damascene structures
10/10/2007CN101053073A Selective w-cvd process and process for producing cu multilayer wiring
10/10/2007CN101053072A Substrate treatment method, method and apparatus for film formation and computer program
1 ... 2846 2847 2848 2849 2850 2851 2852 2853 2854 2855 2856 2857 2858 2859 2860 2861 2862 2863 2864 2865 2866 ... 6590