Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/16/2007US7282732 Quantum dot structures
10/16/2007US7282725 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and stencil mask
10/16/2007US7282721 Method and apparatus for tuning ion implanters
10/16/2007US7282693 Camera module for compact electronic equipments
10/16/2007US7282550 Composition to provide a layer with uniform etch characteristics
10/16/2007US7282461 Phase-shifting mask and semiconductor device
10/16/2007US7282460 Transfer chamber for cluster system
10/16/2007US7282459 Ejection method and optical device manufacturing method for arranging nozzles in agreement with sections subject to ejection
10/16/2007US7282458 Low K and ultra low K SiCOH dielectric films and methods to form the same
10/16/2007US7282457 Apparatus for stabilizing high pressure oxidation of a semiconductor device
10/16/2007US7282456 Self-repair and enhancement of nanostructures by liquification under guiding conditions
10/16/2007US7282455 Method of producing a diffraction grating
10/16/2007US7282454 Switched uniformity control
10/16/2007US7282453 Method for fabricating semiconductor device
10/16/2007US7282452 Etching method, semiconductor and fabricating method for the same
10/16/2007US7282451 Methods of forming integrated circuit devices having metal interconnect layers therein
10/16/2007US7282450 Sidewall coverage for copper damascene filling
10/16/2007US7282449 Thermal treatment of a semiconductor layer
10/16/2007US7282448 Substrate and method of forming substrate for fluid ejection device
10/16/2007US7282447 Method for an integrated circuit contact
10/16/2007US7282446 Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array
10/16/2007US7282445 Multiple seed layers for interconnects
10/16/2007US7282444 Semiconductor chip and manufacturing method for the same, and semiconductor device
10/16/2007US7282443 Methods of forming metal silicide
10/16/2007US7282442 Contact hole structure of semiconductor device and method of forming the same
10/16/2007US7282441 De-fluorination after via etch to preserve passivation
10/16/2007US7282440 Integrated circuit contact
10/16/2007US7282439 Anti-reflective coating doped with carbon for use in integrated circuit technology and method of formation
10/16/2007US7282438 Low-k SiC copper diffusion barrier films
10/16/2007US7282437 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same
10/16/2007US7282436 Plasma treatment for silicon-based dielectrics
10/16/2007US7282435 Method of forming contact for dual liner product
10/16/2007US7282434 Method of manufacturing a semiconductor device
10/16/2007US7282433 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
10/16/2007US7282432 Semiconductor device, manufacturing method and apparatus for the same
10/16/2007US7282431 Single chip and stack-type chip semiconductor package and method of manufacturing the same
10/16/2007US7282430 Melt-based patterning for electronic devices
10/16/2007US7282429 Method of manufacturing Schottky diode device
10/16/2007US7282428 Method for solid phase diffusion of zinc into an InP-based photodiode and an InP photodiode made with the method
10/16/2007US7282427 Method of implanting a substrate and an ion implanter for performing the method
10/16/2007US7282426 Method of forming a semiconductor device having asymmetric dielectric regions and structure thereof
10/16/2007US7282425 Structure and method of integrating compound and elemental semiconductors for high-performance CMOS
10/16/2007US7282424 Method of manufacturing a plurality of assemblies
10/16/2007US7282423 Method of forming fet with T-shaped gate
10/16/2007US7282422 Overlay key, method of manufacturing the same and method of measuring an overlay degree using the same
10/16/2007US7282421 Methods for reducing a thickness variation of a nitride layer formed in a shallow trench isolation CMP process and for forming a device isolation film of a semiconductor device
10/16/2007US7282420 Method of manufacturing a flash memory device
10/16/2007US7282419 Thin-film capacitor device, mounting module for the same, and method for fabricating the same
10/16/2007US7282418 Method for fabricating a self-aligned bipolar transistor without spacers
10/16/2007US7282417 Ion doping method to form source and drain
10/16/2007US7282416 Method for fabricating electronic device
10/16/2007US7282415 Method for making a semiconductor device with strain enhancement
10/16/2007US7282414 Fabrication methods for compressive strained-silicon and transistors using the same
10/16/2007US7282413 Semiconductor device including nonvolatile memory and method for fabricating the same
10/16/2007US7282412 Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same
10/16/2007US7282411 Method of manufacturing a nonvolatile semiconductor memory device
10/16/2007US7282410 Flash memory process with high voltage LDMOS embedded
10/16/2007US7282409 Isolation structure for a memory cell using Al2O3 dielectric
10/16/2007US7282408 Surface treatment of an oxide layer to enhance adhesion of a ruthenium metal layer
10/16/2007US7282407 Semiconductor memory device and method of manufacturing for preventing bit line oxidation
10/16/2007US7282406 Method of forming an MOS transistor and structure therefor
10/16/2007US7282405 Semiconductor memory device and method for manufacturing the same
10/16/2007US7282404 Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
10/16/2007US7282403 Temperature stable metal nitride gate electrode
10/16/2007US7282402 Method of making a dual strained channel semiconductor device
10/16/2007US7282401 Method and apparatus for a self-aligned recessed access device (RAD) transistor gate
10/16/2007US7282400 Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction
10/16/2007US7282399 Method for forming semiconductor device
10/16/2007US7282398 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device and method of fabricating the same
10/16/2007US7282397 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
10/16/2007US7282396 Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body
10/16/2007US7282395 Method of making exposed pad ball grid array package
10/16/2007US7282394 Printed circuit board including embedded chips and method of fabricating the same using plating
10/16/2007US7282393 Microelectromechanical device packages with integral heaters
10/16/2007US7282392 Method of fabricating a stacked die in die BGA package
10/16/2007US7282391 Method for precision assembly of integrated circuit chip packages
10/16/2007US7282390 Stacked die-in-die BGA package with die having a recess
10/16/2007US7282389 Semiconductor device manufacturing method and manufacturing apparatus
10/16/2007US7282388 Method of manufacturing wafer level package type FBAR device
10/16/2007US7282387 Electro- and electroless plating of metal in the manufacture of PCRAM devices
10/16/2007US7282386 Schottky device and method of forming
10/16/2007US7282385 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
10/16/2007US7282384 Thermoelectric transducing material thin film, sensor device, and its manufacturing method
10/16/2007US7282383 Micromachine production method
10/16/2007US7282382 Method for producing a photodiode contact for a TFA image sensor
10/16/2007US7282381 Method of producing self supporting substrates comprising III-nitrides by means of heteroepitaxy on a sacrificial layer
10/16/2007US7282380 Method for manufacturing semiconductor device
10/16/2007US7282379 Nitride semiconductor, semiconductor device, and method of manufacturing the same
10/16/2007US7282378 Method of manufacturing inspection unit
10/16/2007US7282377 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
10/16/2007US7282376 System, method, and apparatus for electrically testing lead-to-lead shorting during magnetoresistive sensor fabrication
10/16/2007US7282375 Wafer level package design that facilitates trimming and testing
10/16/2007US7282374 Method and apparatus for comparing device and non-device structures
10/16/2007US7282318 Photoresist composition for EUV and method for forming photoresist pattern using the same
10/16/2007US7282316 Sulfonyldiazomethane compounds, photoacid generator, resist materials and patterning using the same
10/16/2007US7282308 Phase shifter film and process for the same
10/16/2007US7282305 Reflective mask blank having a programmed defect and method of producing the same, reflective mask having a programmed defect and method of producing the same, and substrate for use in producing the reflective mask blank or the reflective mask having a programmed defect
10/16/2007US7282265 impregnating a porous graphitized extrudate with a molten metal and then heat-treating the resultant composite material; good dimensional stability when heated; same level as those of silicon and compound semiconductors
10/16/2007US7282190 Silicon layer production method and solar cell production method
10/16/2007US7282158 Method of processing a workpiece
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