Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/17/2007CN100343962C Method and device for mfg. buried insulator type semiconductor silicon carbide substrate
10/17/2007CN100343961C Production method for anneal wafer and anneal wafer
10/17/2007CN100343960C Method for forming silica layer on substrate by adopting atomic layer deposition technique
10/17/2007CN100343959C Production method for semiconductor device
10/17/2007CN100343958C Polishing pad having slurry utilization enhancing grooves
10/17/2007CN100343957C Wafer jetter assembly
10/17/2007CN100343956C Plasma working method and equipment and support frame for plasma working
10/17/2007CN100343955C Method for making integrated circuit using memory wordline hard mask extension
10/17/2007CN100343954C Method of fabricating crystalline silicon and switching device using crystalline silicon
10/17/2007CN100343953C Method for removing photoresist in semiconductor manufacturing process
10/17/2007CN100343952C Silicon chip unloading technology capable of raising production volume and reducing silicon chip surface roughness
10/17/2007CN100343951C Apparatus for manufacturing flat panel display devices
10/17/2007CN100343950C Lining heating device and multi-chamber lining treatment system
10/17/2007CN100343949C Micro-switching element fabrication method and micro-switching element
10/17/2007CN100343948C Method for forming multiwidth gap wall
10/17/2007CN100343947C Crystallizing device, crystallizing method and phase exchanging mechanism
10/17/2007CN100343946C Substrate processing apparatus
10/17/2007CN100343945C Method for manufacturing semiconductor device suitable for image sensor
10/17/2007CN100343943C Inductively-coupled plasma processing system
10/17/2007CN100343942C Multi-directional scanning of movable member and ion beam monitoring arrangement therefor
10/17/2007CN100343937C Method for aligning needle or like and aligning unit
10/17/2007CN100343901C Method and apparatus for testing tunnel magnetoresistive effect element
10/17/2007CN100343871C Electronic device, rubber product, and methods for manufacturing the same
10/17/2007CN100343855C Repair determining method and semiconductor element electric performance testing system with it
10/17/2007CN100343771C Integrated electronic hardware for wafer processing control and diagnostic
10/17/2007CN100343760C Exposure device and method
10/17/2007CN100343759C Mask for projection exposure, projection exposure appts. and used method
10/17/2007CN100343758C Electroplating method
10/17/2007CN100343757C Mask and manufacturing method using mask
10/17/2007CN100343749C Array substrate of thin film transistor liquid crystal display and manufacturing method thereof
10/17/2007CN100343748C Substrate for a liquid crystal display
10/17/2007CN100343712C Miniature movable device
10/17/2007CN100343682C Testing device sensor and testing device
10/17/2007CN100343676C Probe for testing electric conduction
10/17/2007CN100343424C Method for manufacturing a free-standing substrate made of monocrystalline semi-conductor material
10/17/2007CN100343423C Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode
10/17/2007CN100343417C Method for forming interconnection metal layer, method for selectively forming metal, apparatus for selectively forming metal, and substrate apparatus
10/17/2007CN100343362C Polishing fluid for metal and polishing Method
10/17/2007CN100343361C Aqueous cleaning compsn. contg. copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
10/17/2007CN100343200C Methods of roughening ceramic surface
10/17/2007CN100343018C Chip grinding machine structure
10/17/2007CN100342952C Process for decomposing fluorine compounds
10/16/2007US7284171 Integrated circuit device
10/16/2007US7284134 ID installable LSI, secret key installation method, LSI test method, and LSI development method
10/16/2007US7283931 Inspecting apparatus for semiconductor device
10/16/2007US7283890 Work convey system, unmanned convey vehicle system, unmanned convey vehicle, and work convey method
10/16/2007US7283885 Electron beam lithography system, method of electron beam lithography, program and method for manufacturing a semiconductor device with direct writing
10/16/2007US7283401 Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout
10/16/2007US7283397 Flash EEprom system capable of selective erasing and parallel programming/verifying memory cell blocks
10/16/2007US7283394 Trench corner effect bidirectional flash memory cell
10/16/2007US7283388 Memory device using multiple layer nano tube cell
10/16/2007US7283346 Electrostatic chuck and its manufacturing method
10/16/2007US7283255 Wireless substrate-like sensor
10/16/2007US7283252 Measuring method and apparatus using interference, exposure method and apparatus using the same, and device fabrication method
10/16/2007US7283236 Alignment system and lithographic apparatus equipped with such an alignment system
10/16/2007US7283226 Measurement system cluster
10/16/2007US7283218 Method and apparatus for the determination of characteristic layer parameters at high temperatures
10/16/2007US7283207 Exposure apparatus
10/16/2007US7283182 Electro-optical device, electronic apparatus, and method of manufacturing electro-optical device
10/16/2007US7283130 Display device
10/16/2007US7283110 Flat panel display
10/16/2007US7282959 CMOS circuit including double-insulated-gate field-effect transistors
10/16/2007US7282951 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
10/16/2007US7282940 Semiconductor device with electrode pads for test probe
10/16/2007US7282932 Compliant contact pin assembly, card system and methods thereof
10/16/2007US7282931 Full wafer contacter and applications thereof
10/16/2007US7282821 Linear motor, stage apparatus, exposure apparatus, and device manufacturing apparatus
10/16/2007US7282820 Stage device and exposure apparatus
10/16/2007US7282819 Stage apparatus, exposure apparatus, and device manufacturing method
10/16/2007US7282806 Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
10/16/2007US7282804 Structure of high performance combo chip and processing method
10/16/2007US7282803 Integrated electronic circuit comprising a capacitor and a planar interference inhibiting metallic screen
10/16/2007US7282800 Semiconductor device and method of manufacturing the same
10/16/2007US7282799 Thermal interface with a patterned structure
10/16/2007US7282792 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/16/2007US7282781 Semiconductor device with a short-lifetime region and manufacturing method thereof
10/16/2007US7282780 Semiconductor device
10/16/2007US7282779 Device, method of manufacture thereof, manufacturing method for active matrix substrate, electro-optical apparatus and electronic apparatus
10/16/2007US7282778 Chemical sensor using chemically induced electron-hole production at a Schottky barrier
10/16/2007US7282774 Semiconductor device and method for manufacturing semiconductor device
10/16/2007US7282769 Thin film transistor device and method of making the same
10/16/2007US7282764 Semiconductor device
10/16/2007US7282763 Field effect transistor formed on an insulating substrate and integrated circuit thereof
10/16/2007US7282762 4F2 EEPROM NROM memory arrays with vertical devices
10/16/2007US7282761 Semiconductor memory devices having offset transistors and methods of fabricating the same
10/16/2007US7282760 Vertical junction field effect transistors, and methods of producing the vertical junction field effect transistors
10/16/2007US7282758 Method of fabricating a floating gate for a nonvolatile memory
10/16/2007US7282757 MIM capacitor structure and method of manufacture
10/16/2007US7282756 Structurally-stabilized capacitors and method of making of same
10/16/2007US7282755 Stress assisted current driven switching for magnetic memory applications
10/16/2007US7282753 Vertical conducting power semiconducting devices made by deep reactive ion etching
10/16/2007US7282752 MOSFET with a thin gate insulating film
10/16/2007US7282751 Semiconductor device
10/16/2007US7282750 Semiconductor component comprising areas with a high platinum concentration
10/16/2007US7282749 Organic electroluminescent device and method of fabricating the same
10/16/2007US7282742 Organic semiconductor material and organic semiconductor element employing the same including carbon nanotubes
10/16/2007US7282739 Silicon carbide semiconductor device
10/16/2007US7282738 Fabrication of crystalline materials over substrates
10/16/2007US7282737 Projector including a light source and liquid crystal display device
10/16/2007US7282736 Light emitting structure including an exposed electrode overlapping a wiring or conductive layer
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