Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/18/2007US20070243664 Flip-Chip Mounting Method and Bump Formation Method
10/18/2007US20070243663 Method of wafer level chip size packaging
10/18/2007US20070243662 Packaging of MEMS devices
10/18/2007US20070243661 Thin semiconductor device package
10/18/2007US20070243660 Method for fabricating white-light-emitting flip-chip diode having silicon quantum dots
10/18/2007US20070243659 Phase-changeable memory device and method of manufacturing the same
10/18/2007US20070243657 Method and Apparatus to Form Thin Layers of Materials on a Base
10/18/2007US20070243655 Self-Aligned Process for Fabricating Imprint Templates Containing Variously Etched Features
10/18/2007US20070243654 Microelectromechanical device with integrated conductive shield
10/18/2007US20070243653 Methods for controllable doping of aluminum nitride bulk crystals
10/18/2007US20070243652 Stacked-substrate processes for production of nitride semiconductor structures
10/18/2007US20070243649 Centrifugally Cast Electrochemical Cell Components
10/18/2007US20070243648 Manufacturing method of pixel structure
10/18/2007US20070243647 LED package and method for producing the same
10/18/2007US20070243646 LED package and method for producing the same
10/18/2007US20070243644 Semiconductor laser device and method of manufacturing the same, and optical transmission module and optical disk apparatus using the semiconductor laser device
10/18/2007US20070243643 Circular Test Pads on Scribe Street Area
10/18/2007US20070243642 Method of Evaluating Characteristics of and Forming of an Insulating Film For a Semiconductor Device
10/18/2007US20070243641 Method for forming ferroelectric memory device
10/18/2007US20070243640 Method for manufacturing ferroelectric memory device
10/18/2007US20070243639 Methods and apparatus for a synthetic anti-ferromagnet structure with reduced temperature dependence
10/18/2007US20070243638 Novel method to form a nonmagnetic cap for the NiFe(free) MTJ stack to enhance dR/R
10/18/2007US20070243494 Mixture of acid, base such as alkanolamine and tetraalkylammonium compound and sulfur compound as corrosion resistant
10/18/2007US20070243464 Nanotube Position Controlling Method, Nanotube Position Controlling Flow Path Pattern and Electronic Element Using Nanotube
10/18/2007US20070243459 Method and apparatus for thin-film battery having ultra-thin electrolyte
10/18/2007US20070243414 Positive Electrode Structure and Gallium Nitride-Based Compound Semiconductor Light-Emitting Device
10/18/2007US20070243409 Process for Producing Ceramic Sheet, Ceramic Substrate Utilizing The Same and Use Thereof
10/18/2007US20070243352 Method of transferring a laminate and method of manufacturing a semiconductor device
10/18/2007US20070243057 Bolt and semiconductor manufacturing apparatus
10/18/2007US20070243049 Work-piece processing system
10/18/2007US20070243048 Compact apparatus and method for storing and loading semiconductor wafer carriers
10/18/2007US20070242922 Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
10/18/2007US20070242917 Etched-facet semiconductor optical component with integrated end-coupled waveguide and methods of fabrication and use thereof
10/18/2007US20070242511 Nand memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same
10/18/2007US20070242281 Wafer edge with light sensor
10/18/2007US20070242250 Objective with crystal lenses
10/18/2007US20070242247 Exposure apparatus and device manufacturing method
10/18/2007US20070242242 Exposure Apparatus, Exposure Method, Method for Producing Device, and Optical Part
10/18/2007US20070242241 Exposure Apparatus and Device Manufacturing Method
10/18/2007US20070241998 Electroluminescent Display Devices
10/18/2007US20070241811 Methods and Systems for Reducing Leakage Current in Semiconductor Circuits
10/18/2007US20070241790 Semiconductor integrated circuit
10/18/2007US20070241779 Semiconductor integrated circuit
10/18/2007US20070241460 Conductive Structures Including Titanium-Tungsten Base Layers
10/18/2007US20070241458 Metal / metal nitride barrier layer for semiconductor device applications
10/18/2007US20070241449 Apparatus for Effecting Reliable Heat Transfer of Bare Die Microelectroinc Device and Method Thereof
10/18/2007US20070241446 Two-sided wafer escape package
10/18/2007US20070241445 Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them
10/18/2007US20070241436 Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
10/18/2007US20070241434 Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device
10/18/2007US20070241432 Etched leadframe flipchip package system
10/18/2007US20070241428 Transistor structure with minimized parasitics and method of fabricating the same
10/18/2007US20070241421 Semiconductor structure and method of manufacture
10/18/2007US20070241416 Solid state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof
10/18/2007US20070241415 Micro-electro mechanical system device using silicon on insulator wafer and method of manufacturing the same
10/18/2007US20070241414 Semiconductor Device and Manufacturing Process Therefor
10/18/2007US20070241413 Field-Effect-Transistor Multiplexing/Demultiplexing Architectures and Methods of Forming The Same
10/18/2007US20070241409 Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
10/18/2007US20070241407 Electrostatic discharge protection device and method of fabricating the same
10/18/2007US20070241404 Semiconductor device and manufacturing method thereof
10/18/2007US20070241403 Integrated circuit with different channel materials for P and N channel transistors and method therefor
10/18/2007US20070241399 Semiconductor device and method of fabricating the same
10/18/2007US20070241397 Semiconductor apparatus and method of manufacturing the same
10/18/2007US20070241396 Semiconductor apparatus and method of manufacturing the same
10/18/2007US20070241391 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration
10/18/2007US20070241382 Semiconductor integrated circuit device and process for manufacturing the same
10/18/2007US20070241381 Methods for Fabricating Semiconductor Devices
10/18/2007US20070241379 Compositions for thin-film capacitance device, high-dielectric constant insulating film, thin-film capacitance device and thin-film multilayer capacitor
10/18/2007US20070241375 Image sensor and method of forming the same
10/18/2007US20070241373 Semiconductor Device and Its Manufacturing Method
10/18/2007US20070241371 Memory device and manufacturing method
10/18/2007US20070241367 Ultra Scalable High Speed Heterojunction Vertical n-Channel Misfets and Methods Thereof
10/18/2007US20070241360 Light emitting devices suitable for flip-chip bonding
10/18/2007US20070241357 LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
10/18/2007US20070241354 Semiconductor Light-Emitting Device and Its Manufacturing Method
10/18/2007US20070241345 Semiconductor light-emitting device and method of fabricating the same
10/18/2007US20070241335 Methods of fabricating semiconductor integrated circuits using selective epitaxial growth and partial planarization techniques and semiconductor integrated circuits fabricated thereby
10/18/2007US20070241334 Thin film transistor, method of manufacturing the thin film transistor, and display device
10/18/2007US20070241329 Semiconductor integrated circuit and method for manufacturing same, and mask
10/18/2007US20070241325 Schottky Gate Organic Field Effect Transistor and Fabrication Method of the Same
10/18/2007US20070241322 Long Wavelength Induim Arsenide Phosphide (InAsP) Quantum Well Active Region And Method For Producing Same
10/18/2007US20070241202 Wafer identification mark
10/18/2007US20070241199 Semiconductor Device and Communication System
10/18/2007US20070241086 Method for fabricating semiconductor film and semiconductor device and laser processing apparatus
10/18/2007US20070240826 Gas supply device and apparatus for gas etching or cleaning substrates
10/18/2007US20070240825 Wafer processing apparatus capable of controlling wafer temperature
10/18/2007US20070240824 Liquid processing apparatus
10/18/2007US20070240737 Post etch wafer surface cleaning with liquid meniscus
10/18/2007US20070240736 Substrate cleaning method, substrate cleaning system and program storage medium
10/18/2007US20070240637 Thin-Film Forming Apparatus
10/18/2007US20070240633 One hundred millimeter single crystal silicon carbide wafer
10/18/2007US20070240630 One hundred millimeter single crystal silicon carbide water
10/18/2007US20070240628 Silicon wafer
10/18/2007US20070240510 Semiconductor sensor and method of manufacturing the same
10/18/2007US20070240366 Composition for Polishing
10/18/2007DE4234700B4 Gehäuste Halbleiteranordnung Packaged semiconductor device
10/18/2007DE19944011B4 Verfahren zur Bildung mindestens zweier Speicherzellen eines Halbleiterspeichers A method of forming at least two storage cells of a semiconductor memory
10/18/2007DE19903380B4 Halbleitersensoren für eine physikalische Grösse und ihre Herstellungsverfahren Semiconductor sensors for a physical quantity and its manufacturing method
10/18/2007DE19648309B4 Stark reflektierende Kontakte für Licht-emittierende Halbleiterbauelemente Highly reflective contacts for light-emitting semiconductor devices
10/18/2007DE10310329B4 Verfahren zur Herstellung einer integrierten Schaltungsvorrichtung, nach dem Verfahren hergestellte integrierte Schaltungsvorrichtung und Sicherungsbox A process for producing an integrated circuit device, integrated circuit device produced by the method and fuse