Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/18/2007DE10301432B4 Zwischenverbindungsstruktur in einer Waferebenenpackung und Herstellungsverfahren Interconnect structure in a wafer level package and manufacturing method
10/18/2007DE102007015232A1 Ladungspartikelstrahlenvorrichtung, Anomalieerfassungsverfahren für eine DA-Wandlereinheit, Ladungspartikelstrahlenschreibverfahren und Maske Charged particle beam apparatus, anomaly detection method for a DA converter unit, charged particle beam writing method and mask
10/18/2007DE102006040352B3 Electrical contact applying method for e.g. solar cell, involves applying layer of metallic powder on substrate, and guiding laser beam over substrate for local sintering and/or fusing metallic powder in inert atmosphere or in vacuum
10/18/2007DE102006026363A1 Transport and docking system for clean area application, has extraction unit arranged inside carriage, and frame coupled with removable segment such that segment is movable together with covering and extraction unit inside clean area
10/18/2007DE102006024735A1 Hartmaskenschichtstapel und Verfahren zum Strukturieren einer Schicht unter Verwendung des Hartmaskenschichtstapels Hard mask layer stack and method for structuring a layer using the hard mask layer stack
10/18/2007DE102006023682A1 Verfahren zum Herstellen eines Transistors in einem nichflüchtigen Speicher A method of manufacturing a transistor in an internal nonvolatile memory
10/18/2007DE102006020600A1 Verfahren und Anordnung zur Positionierung von Hochleistungs-LEDs Method and apparatus for positioning of High Power LEDs
10/18/2007DE102006019671A1 Multi-bonding head for removing electronic chip from e.g. adhesive film, and bonding chip on e.g. wafer, has suction nozzles arranged diagonally to each other over part of their length, such that nozzles run in succession towards free ends
10/18/2007DE102006019424A1 Herstellungsverfahren für eine integrierte Halbleiterkontaktstruktur mit einer verbesserten Aluminiumfüllung Manufacturing method of a semiconductor integrated contact structure having an improved aluminum filling
10/18/2007DE102006017668A1 Verfahren zur Herstellung von Leistungshalbleiterbauteilen und Verwendung von Farbstoffen A process for the production of power semiconductor components and use of dyes
10/18/2007DE102006017655A1 Verfahren und Anordnung zur berührungslosen Temperaturmessung Method and apparatus for non-contact temperature measurement
10/18/2007DE102006017423A1 Semiconductor wafer`s edge determining device, has illumination device arranged such that reflection point is produced with light beam at hitting point at wafer, and position-sensitive sensor arranged so that point is represented on sensor
10/18/2007DE102006017283A1 Semiconductor wafer pattern`s structural unit measuring method for semiconductor manufacturing system, involves providing model of ellipsometry irradiation, and calculating measurements of structural units on wafer based on model
10/18/2007DE102006017115A1 Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung A semiconductor device comprising a plastic housing and method for its preparation
10/18/2007DE102006017101A1 Rigid-flexible printed circuit board for electrical device, has sliding bow fastened to contact of multi-contact components e.g. unpackaged power semiconductor, with conductive adhesive that is applied by dosing machine
10/18/2007DE102006016964A1 Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe sowie Trägerkörper hierfür A process for preparing an electronic assembly and electronic assembly support body therefor
10/18/2007DE102006016345A1 Halbleitermodul mit diskreten Bauelementen und Verfahren zur Herstellung desselben Of the same semiconductor module having discrete components and methods for making
10/18/2007DE102006016090A1 Solder material producing method for e.g. flip-chip-connection between substrate and semiconductor, involves converting surface of passivation layer into finely nubby or slightly wettable surface by surface treatment
10/18/2007DE102006016049A1 Power semiconductor component, has charge carrier recombination zone with high temperature resistance in such a manner that recombination zone withstands locally when subjected to metallization process and/or soldering process
10/18/2007DE102005006333B4 Halbleiterbauteil mit mehreren Bondanschlüssen und gebondeten Kontaktelementen unterschiedlicher Metallzusammensetzung und Verfahren zur Herstellung desselben Of the same semiconductor device having a plurality of bonding pads and bonded contact elements of different metal composition and methods for preparing
10/18/2007DE102004052141B4 Verfahren zum Herstellen einer Halbleiterstruktur A method of fabricating a semiconductor structure
10/18/2007DE102004035368B4 Substrat mit Leiterbahnen und Herstellung der Leiterbahnen auf Substraten für Halbleiterbauteile Substrate with conductor tracks and manufacture of the conductor tracks on substrates for semiconductor devices
10/18/2007DE102004028709B4 Vertikaldoppelkanal-Silicon-on-Insulator-Transistor und Verfahren zu seiner Herstellung Vertical double-channel silicon-on-insulator transistor and method for its preparation
10/18/2007DE102004022139B4 Verfahren zur Herstellung einer Spiralinduktivität auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement A method of manufacturing a spiral inductor on a substrate and produced by such a process component
10/18/2007DE10197008B4 Verfahren zur Herstellung einer Materialbahn, Materialbahn mit intelligenten Etiketten, Verfahren zur Herstellung einer Trägerbahn und Bauteil für ein intelligentes Etikett A process for producing a material web, the material web with intelligent labels, processes for preparing a carrier web and component for an intelligent tag
10/18/2007CA2644914A1 Substrate cassette
10/17/2007EP1845754A1 Heating element
10/17/2007EP1845753A2 Heating element
10/17/2007EP1845563A1 Precursor film and method of forming the same
10/17/2007EP1845561A2 Semiconductor device including a heterojunction diode and manufacturing method thereof
10/17/2007EP1845557A2 Bonded wafer and method of producing the same
10/17/2007EP1845556A1 Electric component mounting apparatus
10/17/2007EP1845555A1 Post chemical-mechanical planarization (CMP) cleaning composition
10/17/2007EP1845554A2 A method to create super secondary grain growth in narrow trenches
10/17/2007EP1845553A1 Semiconductor manufacturing apparatus, abnormality detection in such semiconductor manufacturing apparatus, method for specifying abnormality cause or predicting abnormality, and recording medium wherein computer program for executing such method is recorded
10/17/2007EP1845552A1 Transportation system and transportation method
10/17/2007EP1845417A2 Illumination system with zoom lens
10/17/2007EP1845415A2 Process for producing an image using a first minimum bottom antireflective coating composition
10/17/2007EP1845100A1 CYCLIC SILOXANE COMPOUND, Si-CONTAINING FILM-FORMING MATERIAL, AND USE THEREOF
10/17/2007EP1844891A1 Method of working sintered diamond, cutter wheel for substrate and method of working the same
10/17/2007EP1844884A1 Silver particle powder and process for producing the same
10/17/2007EP1844883A1 Silver particle powder and process for producing the same
10/17/2007EP1844850A1 Cleaning of contaminated articles by aqueous supercritical oxidation
10/17/2007EP1844498A2 Method of fabricating a fet
10/17/2007EP1844496A2 Fabrication process for increased capacitance in an embedded dram memory
10/17/2007EP1844495A2 Manufacturing method for semiconductor chips, and semiconductor chip
10/17/2007EP1844494A1 Modular sub-assembly of semiconductor strips
10/17/2007EP1844493A1 Method for producing integrated circuits provided with silicon- germanium hetero-bipolar transistors
10/17/2007EP1844492A2 Non-volatile nanocrystal memory and method therefor
10/17/2007EP1844491A1 Method for patterning coatings
10/17/2007EP1844490A1 Measuring apparatus, exposure apparatus and method, and device manufacturing method
10/17/2007EP1844489A2 A semiconductor substrate processing method
10/17/2007EP1844342A1 Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated
10/17/2007EP1844311A2 Sample preparation for micro-analysis
10/17/2007EP1844122A1 Adjuvant for chemical mechanical polishing slurry
10/17/2007EP1843972A2 Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers
10/17/2007EP1664935B1 Stripping and cleaning compositions for microelectronics
10/17/2007EP1652221A4 Failure analysis methods and systems
10/17/2007EP1648991B1 Semiconductor cleaning solution
10/17/2007EP1558954B1 Method of producing a movable lens structure for a light shaping unit
10/17/2007EP1502300B1 Circuit comprising a capacitor and at least one semiconductor component, and method for designing same
10/17/2007EP1502299B1 Contacting of nanotubes
10/17/2007EP1417502B1 Electronic circuit and method for testing
10/17/2007EP1240552A4 Water-processable photoresist compositions
10/17/2007EP1152906A4 Local vectorial particle cleaning
10/17/2007EP1147557B1 Integrated circuit device, electronic module for chip card using said device and method for making same
10/17/2007EP1132772B1 Halftone phase shift photomask and blank for it, and pattern forming method using this mask
10/17/2007EP1114460B1 Semiconductor chip with surface coating
10/17/2007EP1103074A4 Mosfet having self-aligned gate and buried shield and method of making same
10/17/2007EP1064676A4 Reliable via structures having hydrophobic inner wall surfaces and methods for making the same
10/17/2007EP1059019A4 Components with releasable leads
10/17/2007EP0988651A4 Lateral diffused mos transistor with trench source contact
10/17/2007EP0920542B1 Chemical vapor deposition of fluorocarbon polymer thin films
10/17/2007CN200962416Y Device for preventing the surface pasting semiconductor part pin from distortion
10/17/2007CN101057340A Semiconductor device and methods for the production thereof
10/17/2007CN101057339A 无定形氧化物和场效应晶体管 Amorphous oxide, and field-effect transistors
10/17/2007CN101057338A Field effect transistor employing an amorphous oxide
10/17/2007CN101057331A Flash- and rom-memory
10/17/2007CN101057328A Bipolar transistor with selfaligned silicide and extrinsic base
10/17/2007CN101057327A IC chip, antenna, and manufacturing method of the ic chip and the antenna
10/17/2007CN101057323A Trench capacitor with hybrid surface orientation substrate
10/17/2007CN101057322A Dram transistor with a gate buried in the substrate and method of forming thereof
10/17/2007CN101057321A Semiconductor IC device manufacturing method
10/17/2007CN101057320A Etch with uniformity control
10/17/2007CN101057319A Thermal control of dielectric components in a plasma discharge device
10/17/2007CN101057318A 激光加工方法 The laser processing method
10/17/2007CN101057317A Laser beam machining method and semiconductor chip
10/17/2007CN101057316A Position measurement method, position control method, measurement method, loading method, exposure method, exoposure apparatus, and device production method
10/17/2007CN101057315A Exposure equipment
10/17/2007CN101057314A Post-etch treatment to remove residues
10/17/2007CN101057183A Tracing method and apparatus
10/17/2007CN101056754A Resin-sealed mold and resin-sealed device
10/17/2007CN101055912A Light emitting device and method for producing light emitting device
10/17/2007CN101055910A A making method for the diameter-adjustable silicon quanta line array
10/17/2007CN101055909A LED production technology with the optical refraction and dispersion media
10/17/2007CN101055905A Manufacturing method of lighting device
10/17/2007CN101055904A Making method of dipping multi-crystal silicon solar battery p-n junction
10/17/2007CN101055895A CaTiO3 structure La-Mn oxide/zinc oxide heterogeneous p-n junction and its making method
10/17/2007CN101055894A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/17/2007CN101055893A Nonvolatile semiconductor memory device and method of manufacturing the same
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