Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/23/2007US7285443 Stacked semiconductor module
10/23/2007US7285442 Stackable ceramic FBGA for high thermal applications
10/23/2007US7285441 Field effect transistor and method of manufacturing the same
10/23/2007US7285439 Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method
10/23/2007US7285438 Solid-state imaging device and method for manufacturing solid-state imaging device
10/23/2007US7285437 Method of separating MEMS devices from a composite structure
10/23/2007US7285436 Method of manufacturing a semiconductor light-emitting device
10/23/2007US7285435 Active matrix organic electroluminescence display device and method for manufacturing the same
10/23/2007US7285433 Integrated devices with optical and electrical isolation and method for making
10/23/2007US7285432 Structure and method of fabricating organic devices
10/23/2007US7285430 Connection device and test system
10/23/2007US7285429 Mounting device for high frequency microwave devices
10/23/2007US7285428 Production method of electron source and image display
10/23/2007US7285378 Juxtaposed island manufacturing method by means of self-organised deposition on a substrate and structure obtained using said method
10/23/2007US7285377 Fabrication method for a damascene bit line contact plug
10/23/2007US7285373 Terpolymer or copolymer comprising comonomers of (meth)acrylic acid, (meth)acrylate monomer, olefin, and/or 2-(trifluoromethyl)acrylic acid derivative; triphenyl sulfonium nonaplate as a photoacid generator; adhesiveness with low dependency to substrate, etch resistance, transparency, resolution
10/23/2007US7285369 Positive resist composition and pattern formation method using the same
10/23/2007US7285228 Device and method for anisotropic plasma etching of a substrate, a silicon body in particular
10/23/2007US7285196 Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals
10/23/2007US7285195 Electric field reducing thrust plate
10/23/2007US7285175 Adhesive sheet stamping device, adhesive sheet stamping method
10/23/2007US7285145 Slurry of high viscosity solvent admixed with an abrasive polishing agent; viscosity of the slurry is high enough to generate mechanical force between the slurry and the surface
10/23/2007US7285037 Systems including differential pressure application apparatus
10/23/2007US7285036 Pad assembly for electrochemical mechanical polishing
10/23/2007US7285010 TDI detecting device, a feed-through equipment and electron beam apparatus using these devices
10/23/2007US7284945 Transporting apparatus
10/23/2007US7284941 Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
10/23/2007US7284760 Holding device for disk-shaped objects
10/23/2007US7284690 Article to be processed having ID, and production method thereof
10/23/2007US7284686 Mounting method of bump-equipped electronic component and mounting structure of the same
10/23/2007US7284596 Heatsink assembly and method of manufacturing the same
10/23/2007US7284560 Liquid processing apparatus
10/23/2007US7284441 Pressure sensors circuits
10/23/2007US7284326 Method for manufacturing a micro-electromechanical nozzle arrangement on a substrate with an integrated drive circutry layer
10/23/2007US7284324 Method of making photolithographically-patterned out-of-plane coil structures
10/23/2007US7284318 Apparatus for mounting semiconductor chips
10/18/2007WO2007118251A2 Modulation of step function phenomena by varying nanoparticle size
10/18/2007WO2007118196A1 Multi-step anneal of thin films for film densification and improved gap-fill
10/18/2007WO2007118031A2 Silicon oxynitride gate dielectric formation using multiple annealing steps
10/18/2007WO2007118026A2 Step coverage and pattern loading for dielectric films
10/18/2007WO2007118006A2 Method of forming mixed rare earth nitride and aluminum nitride films by atomic layer deposition
10/18/2007WO2007118004A1 Semiconductor device with gate dielectric containing aluminum and mixed rare earth elements
10/18/2007WO2007117994A2 Process for reducing a size of a compact eeprom device
10/18/2007WO2007117991A1 Semiconductor device with gate dielectric containing mixed rare earth elements
10/18/2007WO2007117989A2 Method of forming mixed rare earth oxynitride and aluminum oxynitride films by atomic layer deposition
10/18/2007WO2007117977A2 Memory cell with reduced size and standby current
10/18/2007WO2007117931A2 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
10/18/2007WO2007117909A1 Method of forming an atomic layer thin film out of the liquid phase
10/18/2007WO2007117896A1 Method for replacing a nitrous oxide based oxidation process with a nitric oxide based oxidation process for substrate processing
10/18/2007WO2007117893A2 Shallow trench avoidance in integrated circuits
10/18/2007WO2007117873A1 Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
10/18/2007WO2007117851A1 Flash memory device with enlarged control gate structure, and methods of making same
10/18/2007WO2007117829A2 Method for bonding a semiconductor substrate to a metal substrate
10/18/2007WO2007117819A2 Molded semiconductor package with integrated through hole heat spreader pin(s)
10/18/2007WO2007117805A2 Method of separating semiconductor dies
10/18/2007WO2007117802A2 Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features
10/18/2007WO2007117779A2 Semiconductor device with a multi-plate isolation structure
10/18/2007WO2007117775A2 Semiconductor fabrication process using etch stop layer to optimize formation of source/drain stressor
10/18/2007WO2007117774A2 Method of separating a structure in a semiconductor device
10/18/2007WO2007117742A2 Batch processing system and method for performing chemical oxide removal
10/18/2007WO2007117741A2 A reduced contaminant gas injection system and method of using
10/18/2007WO2007117737A2 Dynamic metrology sampling with wafer uniformity control
10/18/2007WO2007117736A2 Dynamic metrology sampling for a dual damascene process
10/18/2007WO2007117698A2 Composition including material, methods of depositing material, articles including same and systems for depositing material
10/18/2007WO2007117672A2 Methods of depositing nanomaterial & methods of making a device
10/18/2007WO2007117668A2 Methods and articles including nanomaterial
10/18/2007WO2007117503A2 Preparing nanoparticles and carbon nanotubes
10/18/2007WO2007117312A2 Power device utilizing chemical mechanical planarization
10/18/2007WO2007117265A2 Stably passivated group iv semiconductor nanoparticles and methods and compositions thereof
10/18/2007WO2007117198A1 Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such
10/18/2007WO2007117107A1 Treating method of mold
10/18/2007WO2007117097A1 Module
10/18/2007WO2007117094A1 Package handler
10/18/2007WO2007117035A1 Nitride semiconductor light emitting element and method for fabricating the same
10/18/2007WO2007116990A1 Components joining method and components joining structure
10/18/2007WO2007116982A1 Semiconductor device, and its manufacturing method
10/18/2007WO2007116979A1 Resin composition for encapsulating filler, method of flip chip mounting with the same, and product of flip chip mounting
10/18/2007WO2007116969A1 Processing apparatus and processing method
10/18/2007WO2007116964A1 Semiconductor device and its manufacturing method, dry etching method, method for preparing wiring material, and etching apparatus
10/18/2007WO2007116940A1 Processing apparatus
10/18/2007WO2007116917A1 Production method for 3-d semiconductor device
10/18/2007WO2007116856A1 Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
10/18/2007WO2007116851A1 Substrate processing apparatus, substrate processing method and storage medium
10/18/2007WO2007116799A1 Reflow method, pattern forming method and production method of liquid crystal display unit-use tft element
10/18/2007WO2007116795A1 Electrically connecting apparatus
10/18/2007WO2007116780A1 Reference voltage generating circuit and power supply device using the same
10/18/2007WO2007116770A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
10/18/2007WO2007116768A1 Semiconductor device manufacturing method and substrate processing apparatus
10/18/2007WO2007116758A1 Semiconductor device and method for manufacturing semiconductor device
10/18/2007WO2007116752A1 Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method
10/18/2007WO2007116741A1 Recording system, recording device, and recording control signal generation device
10/18/2007WO2007116711A1 Measuring method, measuring device, processing device, pattern formation method, and device manufacturing method
10/18/2007WO2007116664A1 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition
10/18/2007WO2007116660A1 Organic thin film transistor device and method for manufacturing same
10/18/2007WO2007116649A1 Nickel ink
10/18/2007WO2007116644A1 Plasma cvd apparatus, method for forming thin film and semiconductor device
10/18/2007WO2007116608A1 Method for separating support plate
10/18/2007WO2007116600A1 Base substrate for epitaxial diamond film, method for manufacturing the base substrate for epitaxial diamond film, epitaxial diamond film manufactured by the base substrate for epitaxial diamond film, and method for manufacturing the epitaxial diamond film
10/18/2007WO2007116576A1 Laser irradiation device
10/18/2007WO2007116562A1 Reflective photomask blank, process for producing the same, reflective photomask and process for producing semiconductor device
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