Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/14/2007CN101073034A Method for imprint lithography at constant temperature
11/14/2007CN101072896A Method for forming anti-reflective coating
11/14/2007CN101072894A Method for deposition of metal layers from metal carbonyl precursors
11/14/2007CN101072658A Substrate holding device and polishing apparatus
11/14/2007CN101072657A Polishing pad and manufacturing method thereof
11/14/2007CN101072496A 产品处理系统 Product handling systems
11/14/2007CN101072472A Method of manufacturing printed circuit board for fine circuit formation
11/14/2007CN101072025A 半导体集成电路及其测试方法 Semiconductor integrated circuit and test methods
11/14/2007CN101071844A Bridge resistance random access memory device and method with a singular contact structure
11/14/2007CN101071830A Method for preparing dye sensitized solar cel electrode
11/14/2007CN101071829A Method for manufacturing dye sensitized nano crystal solar cell photo-anode membrane
11/14/2007CN101071827A Thin film transistor substrate and its manufacturing method
11/14/2007CN101071826A Low voltage high density trench-gated power device with uniformly doped channel and its edge termination technique
11/14/2007CN101071824A Semiconductor device, method of fabricating the same, and patterning mask utilizied by the method
11/14/2007CN101071823A Semiconductor element and its manufacturing method
11/14/2007CN101071822A Power semiconductor device
11/14/2007CN101071819A Backside illuminated sensing device and method for manufacturing same
11/14/2007CN101071818A Backside illuminated sensor and formation method thereof
11/14/2007CN101071817A Cover glass for semiconductor package and method for producing same
11/14/2007CN101071816A Poly-silicon thin film transistor array substrate and method for fabricating the same
11/14/2007CN101071815A Semiconductor device and a method of manufacturing the same
11/14/2007CN101071813A Structure and method for determining gradient field of process environment
11/14/2007CN101071807A Connecting module structure with passive element and its manufacturing method
11/14/2007CN101071805A System-level packaging module and its preparing method
11/14/2007CN101071799A Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
11/14/2007CN101071795A Semiconductor device of chip constitution and manufacturing method thereof
11/14/2007CN101071794A III-V crystal and production method
11/14/2007CN101071793A Flat panel display and fabrication method and thereof
11/14/2007CN101071792A Method of manufacturing a flash memory device
11/14/2007CN101071791A Cutting method of chip and apparatus
11/14/2007CN101071790A Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device
11/14/2007CN101071789A Multilayer interconnect structure containing air gaps and method for making
11/14/2007CN101071788A Method for forming metal wiring line, method for manufacturing active matrix substrate, device, electro-optical device, and electronic apparatus
11/14/2007CN101071787A Method of manufacturing semiconductor device
11/14/2007CN101071786A Method for achieving uniform chemical mechanical polishing in integrated circuit manufacturing
11/14/2007CN101071785A Substrate carrier capable of removing electrostatics
11/14/2007CN101071784A Probing apparatus and probing method
11/14/2007CN101071783A Component mounting apparatus and component mounting method
11/14/2007CN101071782A Method for compensating round angle of metal bump for semiconductor chip electric contact
11/14/2007CN101071781A Wafer level packaging method and its structure
11/14/2007CN101071780A Chip structure and its manufacturing process
11/14/2007CN101071779A Semiconductor package stacking structure and its preparing method
11/14/2007CN101071778A Method for making solder bump
11/14/2007CN101071777A Method of manufacturing a semiconductor device
11/14/2007CN101071776A Common drain dual semiconductor chip scale package and method of fabricating same
11/14/2007CN101071775A Chemical etching method for zinc oxide ultraviolet focal-plane imaging array preparing process
11/14/2007CN101071774A Metal oxide semiconductor field effect transistor and its manufacturing method
11/14/2007CN101071773A Low-temperature polycrystalline silicon thin film transistor structure and its manufacturing method
11/14/2007CN101071772A Non-volatile memory and its making method
11/14/2007CN101071771A Insulation film deposition method for a semiconductor device
11/14/2007CN101071770A Method for producing a semiconductor wafer with a profiled edge
11/14/2007CN101071769A Methods of forming a semiconductor device
11/14/2007CN101071768A Plasma doping method and method for fabricating semiconductor device using the same
11/14/2007CN101071767A Method for producing semiconductor substrate
11/14/2007CN101071766A Method for controlling tantalumoxide embedded film resistor precision for anode oxidation process
11/14/2007CN101071765A Thin film pattern layer structure and its manufacturing method
11/14/2007CN101071764A Probing apparatus and probing method
11/14/2007CN101071763A Method of gap-filling using amplitude modulation radiofrequency power and apparatus for the same
11/14/2007CN101071762A Electronic device manufacturing chamber and methods of forming the same
11/14/2007CN101071761A Panel washing machine and washing method
11/14/2007CN101071760A High efficiency buffer stocker
11/14/2007CN101071759A Handler for sorting packaged chips
11/14/2007CN101071758A Semiconductor device, annealing method, annealing apparatus and display apparatus
11/14/2007CN101071757A Annealing method
11/14/2007CN101071756A Methods of forming a diamond micro-channel structure and resulting devices
11/14/2007CN101071755A Decoupled chamber body
11/14/2007CN101071754A Method for forming fine pattern of semiconductor device
11/14/2007CN101071753A Method for manufacturing a narrow structure on an integrated circuit
11/14/2007CN101071752A High current ionic current implanted system and improved device and insulator thereof
11/14/2007CN101071454A Shallow trench avoidance in integrated circuits
11/14/2007CN101071310A Pneumatic control device and method
11/14/2007CN101071279A Lithographic apparatus, calibration method, device manufacturing method and computer program product
11/14/2007CN101071277A Developing method and method for fabricating semiconductor device using the developing method
11/14/2007CN101071276A Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
11/14/2007CN101071275A Double platform system for rotary exchange
11/14/2007CN101071274A Method for manufacturing semiconductor device using immersion lithography process with filtered air
11/14/2007CN101071272A Method for seeking target area for integrated circuit layout design
11/14/2007CN101071263A Apparatus for manufacturing display panel and method for manufacturing the same
11/14/2007CN101071262A Apparatus and method for inspecting mask for use in fabricating an integrated circuit device
11/14/2007CN101071241A Liquid crystal display device and method of fabricating the same
11/14/2007CN101071239A Display substrate, method of manufacturing the same and display apparatus having the same
11/14/2007CN101071238A Liquid crystal display device and method of fabricating the same
11/14/2007CN101071217A Liquid crystal display fabrication method
11/14/2007CN101071153A Method for designing a probe card
11/14/2007CN101071137A Heating device quick-change device for planar pressing structure
11/14/2007CN101071107A Image inspection device and image inspection method using the image inspection device
11/14/2007CN101071097A Analysis of a reactive gas such as silane for particle generating impurities
11/14/2007CN101070621A Low defect density, self-interstitial dominated silicon
11/14/2007CN101070619A GaN晶体衬底 GaN crystal substrate
11/14/2007CN101070614A Single-crystal zinc-oxide nano column array and preparing method
11/14/2007CN101070603A Method for making electrochemical oriented growth Al2O3 super-thin film substrate
11/14/2007CN101070602A Electrochemical method and equipment used for electrochemical method
11/14/2007CN101070454A Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate
11/14/2007CN101070453A Slurry and method for chemical mechanical polishing
11/14/2007CN101069879A Method for coating composition, semiconductor element and flat display
11/14/2007CN100349318C 燃料电池和电源片技术 Fuel cells and power chip technology
11/14/2007CN100349309C Method for producing plane type gas sensor substrate by semiconductor technology
11/14/2007CN100349303C Ic device and transistor device and micro-electronic device and their manufacture
11/14/2007CN100349301C Power semiconductor device
11/14/2007CN100349298C Non-volatile memory with improved coupling rate and its making method
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