Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/22/2007US20070267666 Methods of fabricating image sensors and image sensors fabricated thereby
11/22/2007US20070267660 Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants
11/22/2007US20070267655 Semiconductor device having MIS structure and its manufacture method
11/22/2007US20070267654 In-situ defect reduction techniques for nonpolar and semipolar (Al,Ga, In)N
11/22/2007US20070267579 Photomask correction method using composite charged particle beam, and device used in the correction method
11/22/2007US20070267565 Time-Resolved Measurement Apparatus
11/22/2007US20070267387 Processing Method of Silicon Wafer
11/22/2007US20070267145 Sample table and plasma processing apparatus provided with the same
11/22/2007US20070267144 Heating and Cooling Plate for a Vacuum Chamber
11/22/2007US20070267142 Method And Apparatus For The Treatment Of A Semiconductor Wafer
11/22/2007US20070267138 Methods for Fabricating Three-Dimensional All Organic Interconnect Structures
11/22/2007US20070267136 Method for Manufacturing an Electronics Module
11/22/2007US20070267041 Apparatuses and methods for cleaning test probes
11/22/2007US20070266948 Device for Controlling Electron Temperature in an Ecr Plasma
11/22/2007US20070266947 Plasma generating device
11/22/2007US20070266780 Scanning Probe Microscope
11/22/2007US20070266642 Abrasive, method of polishing target member and process for producing semiconductor device
11/22/2007US20070266641 Method of polishing a tungsten-containing substrate
11/22/2007US20070266640 Includes aqueous dispersion solution of fumed silica; efficiently polishing semiconductor device such as wafer at high polishing speed without causing flaw
11/22/2007US20070266551 ABS through aggressive stitching
11/22/2007DE60126589T2 Thermisches kontrollsystem für substrate Thermal control system for substrates
11/22/2007DE202007012384U1 Kammartiger Halter einer Halterungsvorrichtung für scheibenartige Substrate wie Solarzellenwafer Comb-like holder of a mounting device for disk-like substrates such as solar cell wafers
11/22/2007DE19625638B4 Drahtbondingkopf und Verfahren zum Ultraschallbonden eines Drahtes Drahtbondingkopf and method of ultrasonic bonding a wire
11/22/2007DE19511596B4 Verfahren zum Ätzen von Halbleiterwafern A method of etching semiconductor wafers
11/22/2007DE112006000269T5 Werkzeug und Verfahren zum Bändchenbonden Tools and methods for ribbon bonding
11/22/2007DE112006000131T5 Verfahren und Struktur zum Ausbilden eines integrierten räumlichen Lichtmodulators A method and structure for forming an integrated spatial light modulator
11/22/2007DE112005003336T5 Verfahren zum Herstellen magnetischer mehrfachgeschichteter Filme A method for producing magnetic multiple layered films
11/22/2007DE10341564B4 Kondensatoranordnung und Verfahren zur Herstellung derselben Capacitor arrangement and method for manufacturing the same
11/22/2007DE10241589B4 Verfahren zur Lötstopp-Strukturierung von Erhebungen auf Wafern A method for solder resist patterning of bumps on wafers
11/22/2007DE10228717B4 Verfahren zum Isolieren aktiver Bereiche von Halbleiterspeicherelementen und zum Isolieren von Elementgebieten eines Halbleiterwafers A method of isolating active regions of semiconductor memory elements and for isolating element regions of a semiconductor wafer
11/22/2007DE10222608B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
11/22/2007DE102007021000A1 Halbleiteranordnungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same
11/22/2007DE102007007080A1 Mustererzeugungsverfahren und Einrichtung zum Schreiben mit geladenen Teilchen Pattern generation method and means for writing with charged particles
11/22/2007DE102006061594A1 Flüssigkristallanzeigevorrichtung und Herstellungsverfahren A liquid crystal display device and manufacturing method
11/22/2007DE102006059152A1 Substratträger und Einrichtungsschnittstelle und Vorrichtung, die solches enthält Substrate carrier and device interface and device including such
11/22/2007DE102006058814A1 Bearbeitungsvorrichtungen Processing devices
11/22/2007DE102006055068A1 Halbleitervorrichtung mit verbessertem Bipolartransistor mit isoliertem Gate und Verfahren zu ihrer Herstellung A semiconductor device with an improved insulated gate bipolar transistor, and methods for their preparation
11/22/2007DE102006028692A1 Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium Electrically conductive connection with insulating compound medium
11/22/2007DE102006023946A1 Wafer e.g. substrate, deformation reducing method for use during production of e.g. microprocessor, involves determining deformation state of wafer and/or comparable wafer of bulk with measuring unit and automatically generating data record
11/22/2007DE102006023731A1 Semiconductor structure, has low trench passing into semiconductor substrate and electrically insulating buried layer, and low impedance contact formed in low trench of insulation trench for contacting buried layer
11/22/2007DE102006023497A1 Verfahren und Vorrichtung zur Behandlung einer Halbleiterscheibe Method and apparatus for treating a semiconductor wafer
11/22/2007DE102006022985A1 Schaltungsanordnung mit einer seriellen Testschnittstelle bzw. serielles Testbetriebsverfahren Circuitry with a serial test interface or serial test operating procedures
11/22/2007DE102006022808A1 Component e.g. semiconductor component, separating method, involves superimposing protection unit on main side of component, and separating component from another main side that is opposite to former main side
11/22/2007DE102006022508A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einer in einer Doppelgrabenstruktur angeordneten metallischen Gateelektrode A process for producing a semiconductor device with a arranged in a double structure grave metallic gate electrode
11/22/2007DE102006022507A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einer in einer Doppelgrabenstruktur angeordneten metallischen Gateelektrode A process for producing a semiconductor device with a arranged in a double structure grave metallic gate electrode
11/22/2007DE102006022093A1 Verfahren und Vorrichtung zur Behandlung einer Halbleiterscheibe durch Ätzen Method and apparatus for treating a semiconductor wafer by etching,
11/22/2007DE102005057407B4 Verfahren zur Behandlung von Material mit mindestens einer Vertiefung mit mindestens einer Wandung bei der Herstellung von Halbleiterbauelementen A method for treating material with at least one recess with at least one wall in the manufacture of semiconductor devices
11/22/2007DE102005031836B4 Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben The semiconductor power module of the same with SiC power diode and methods for preparing
11/22/2007DE102005027356B4 Halbleiterleistungsbauteilstapel in Flachleitertechnik mit oberflächenmontierbaren Außenkontakten und ein Verfahren zur Herstellung desselben The same semiconductor power device stack in flat-wire technology with surface-mountable external contacts and a method for producing
11/22/2007DE10058031B4 Verfahren zur Bildung leicht dotierter Halogebiete und Erweiterungsgebiete in einem Halbleiterbauelement A method of forming lightly doped regions Halo and extension regions in a semiconductor device
11/22/2007DE10042388B4 Nichtflüchtiger ferroelektrischer Speicher Non-volatile ferroelectric memory
11/21/2007EP1858166A1 Semiconductor device
11/21/2007EP1858088A1 Nitride semiconductor device and method of growing nitride semiconductor crystal layer
11/21/2007EP1858084A2 Method of manufacturing quantum dots in a semiconductor device
11/21/2007EP1858075A1 Process for integrating on an inert substrate a device comprising at least a passive element and an active element and corresponding integrated device
11/21/2007EP1858074A2 Nonvolatile memory device using oxygen-deficient metal oxide layer and method of manufacturing the same
11/21/2007EP1858073A1 Semiconductor integrated circuit, semiconductor integrated circuit control method, and signal transmission circuit
11/21/2007EP1858072A1 Method of fabricating thin film transistor
11/21/2007EP1858071A1 Method for fabricating a semiconductor on insulator type wafer and semiconductor on insulator wafer
11/21/2007EP1858070A2 Method of manufacturing semiconductor device
11/21/2007EP1858069A1 Semiconductor device manufacturing method
11/21/2007EP1858068A2 Method of fabricating a thin film transistor
11/21/2007EP1858067A1 Semiconductor device and method for fabricating the same
11/21/2007EP1858066A2 Semiconductor devices
11/21/2007EP1858065A2 Method for manufacturing a semiconductor element with a metal gate electrode in a double trench structure
11/21/2007EP1858064A2 Method for manufacturing a semi-conductor element with a metal gate electrode assembled in a double trench structure
11/21/2007EP1858063A2 Manufacturing method of semiconductor device
11/21/2007EP1858062A2 Inspection method of compound semiconductor substrate, compound semiconductor substrate, surface treatment method of compound semiconductor substrate, and method of producing compound semiconductor crystal
11/21/2007EP1858061A1 Plasma treatment apparatus and semiconductor thin film manufacturing method using same
11/21/2007EP1858060A1 Surface protection film peeling method and surface protection film peeling device
11/21/2007EP1858059A1 Substrate cleaning method, substrate cleaning system and program storage medium
11/21/2007EP1858058A1 Fixation carrier, production method of fixation carrier, use method of fixation carrier, and substrate reception container
11/21/2007EP1857576A2 Method and device for treating a semi-conductor wafer
11/21/2007EP1856778A1 Planar oxidation method for producing a localised buried insulator
11/21/2007EP1856745A2 Systems and methods for producing white-light light emitting diodes
11/21/2007EP1856743A2 Power mos device
11/21/2007EP1856732A1 Activated carbon selective epitaxial process
11/21/2007EP1856731A1 Integrated circuit and method for its manufacture
11/21/2007EP1856730A1 Method for positioning a wafer
11/21/2007EP1856729A1 Method for establishing an electrical and mechanical connection between chip contact surfaces and antenna contact surfaces and transponder
11/21/2007EP1856728A2 A method of manufacturing semiconductor packages and packages made
11/21/2007EP1856726A1 Method for forming self-aligned, dual silicon nitride liner for cmos devices
11/21/2007EP1856725A1 Self-forming metal silicide gate for cmos devices
11/21/2007EP1856724A2 Method of making a nitrided gate dielectric
11/21/2007EP1856722A1 Methods of inserting or removing a species from a semiconductor substrate
11/21/2007EP1856721A2 NOVEL GeSiSn-BASED COMPOUNDS, TEMPLATES, AND SEMICONDUCTOR STRUCTURES
11/21/2007EP1856720A2 Method for producing a component
11/21/2007EP1856719A2 Boron-doped diamond semiconductor
11/21/2007EP1856718A1 Patterning method using coatings containing ionic components
11/21/2007EP1856717A2 Stabilized photoresist structure for etching process
11/21/2007EP1856716A2 Light emitting diodes (leds) with improved light extraction by roughening
11/21/2007EP1856229A2 Polishing slurries and methods for chemical mechanical polishing
11/21/2007EP1855833A2 Plasmas and methods of using them
11/21/2007EP1855794A2 Etching chamber with subchamber
11/21/2007EP1692724A4 Semiconductor memory device with increased node capacitance
11/21/2007EP1514304B1 Method for the production of an nrom memory cell arrangement
11/21/2007EP1374291B1 Deposition method over mixed substrates using trisilane
11/21/2007EP1374106B1 Wireless programmable logic devices
11/21/2007EP1365290B1 Resist composition
11/21/2007EP1303729B1 Item storage and retrieval system
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