Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/21/2007CN101075443A Method for producing pattern magnetic-recording medium with continuous inverse-impression direct transfer
11/21/2007CN101075272A Cell arrangement method for designing semiconductor integrated circuit
11/21/2007CN101075132A Method for controlling administration robot by statistical process
11/21/2007CN101075099A Modulator
11/21/2007CN101075097A Photo-etching equipment and method for manufacturing device
11/21/2007CN101075095A Infiltration photo-etching system, infiltration photo-etching method for patterned semiconductor integrate circuit
11/21/2007CN101075094A Method for producing COB-DRAM bit line with nitrogen-oxygen-nitrogen SAC structure
11/21/2007CN101075093A Method for producing COB DRAM bit line for preventing it from collapse
11/21/2007CN101075092A Method for improving SAC etching process tolerance in COB DRAM manufacture
11/21/2007CN101075087A Semiconductor device and method of designing the semiconductor device
11/21/2007CN101075054A Array base plate for liquid-crystal display device and its production
11/21/2007CN101075048A LCD array substrate with patterned buffer layer
11/21/2007CN101075045A Semi-transmissive type liquid-crystal display device and method of fabricating the same
11/21/2007CN101075033A Transmissible reflective type diode substrate and a method for fabricating the same
11/21/2007CN101074980A Method for inspecting LED chip
11/21/2007CN101074932A Image inspection method and image inspection apparatus employing the same
11/21/2007CN101074489A 硅晶片 Silicon wafer
11/21/2007CN101074485A Method of manufacturing electronic component
11/21/2007CN101074478A Method for forming CVD film
11/21/2007CN101074475A Organic-molecular beam depositer for producing organic/inorganic thin film
11/21/2007CN101074473A Ceramic coating member for semiconductor processing apparatus
11/21/2007CN101074170A Production of silicon-based zirconium-titanium acid lead-ferroelectric thick film
11/21/2007CN101074069A Substrate transportation method and apparatus
11/21/2007CN101073880A Grinding pad and its production
11/21/2007CN101073878A Method for polishing chemical machinery
11/21/2007CN101073851A System for monitoring and analyzing energy exchanger of thermal-ultrasonic reversed bonding machine
11/21/2007CN100350745C Semiconductor integrated circuit, logic operation circuit, and flip flop
11/21/2007CN100350728C Transistor circuit and booster circuit
11/21/2007CN100350639C Nitride semiconductor LED and fabrication method thereof
11/21/2007CN100350638C Nitride semiconductor and fabrication method thereof
11/21/2007CN100350632C Semiconductor display device
11/21/2007CN100350629C Semiconductor element and multicrystalline silicon thin film transistor there of and its producing method
11/21/2007CN100350628C Semiconductor element and display device using same
11/21/2007CN100350627C Semiconductor device and its mfg. method
11/21/2007CN100350626C Semiconductor device with trench structure
11/21/2007CN100350625C Imbedded grating semiconductor devices
11/21/2007CN100350621C Image sensor mould set and producing method thereof
11/21/2007CN100350620C Image sensor and sealing method thereof
11/21/2007CN100350619C Image sensor and sealing method thereof
11/21/2007CN100350618C 半导体装置 Semiconductor device
11/21/2007CN100350617C Semiconductor element and semiconductor device using said element
11/21/2007CN100350616C Bitline structure and method for production thereof
11/21/2007CN100350615C Semiconductor device and method of fabricating the same
11/21/2007CN100350614C Electrodes for RRAM memory cells
11/21/2007CN100350613C Programmable memory address and decode circuits with ultra thin vertical body transistors
11/21/2007CN100350612C Non-volatile memory cell and fabrication method thereof
11/21/2007CN100350611C 半导体集成电路器件 The semiconductor integrated circuit device
11/21/2007CN100350610C Semiconductor and its manufacture
11/21/2007CN100350607C Semiconductor device and producing method thereof
11/21/2007CN100350605C Semiconductor device with alignment mark
11/21/2007CN100350604C Seiconductor interconnection with double-cover and its mfg. method
11/21/2007CN100350603C Encapsulation of pin solder for maintaining accuracy in pin position
11/21/2007CN100350600C Semiconductor wafer package and its packaging method
11/21/2007CN100350599C Heat spreader ball grid array package its forming method
11/21/2007CN100350597C Strap for forming resin pull-rod and resin
11/21/2007CN100350596C DRAM and manufacturing method thereof
11/21/2007CN100350595C Method for fabricating CMOS image sensor
11/21/2007CN100350594C Method for cutting semiconductor wafer
11/21/2007CN100350593C Method of forming wiring pattern and method of manufacturing tft substrate using the same
11/21/2007CN100350592C Methods of fabricating semiconductor device having slope at lower sides of interconnection hole
11/21/2007CN100350591C Method for forming metal wire of semiconductor device
11/21/2007CN100350590C Semiconductor component with trench insulation and corresponding production method
11/21/2007CN100350589C Shallow trench isolation method forming round corners by cleaning
11/21/2007CN100350588C Structure of shallow ridge isolation area and dynamic DASD and its mfg method
11/21/2007CN100350587C 半导体测试系统 Semiconductor Test Systems
11/21/2007CN100350586C Test region layout for shallow trench isolation
11/21/2007CN100350585C Wafer measuring system
11/21/2007CN100350584C System and process for calibrating pyrometers in thermal processing chambers
11/21/2007CN100350583C Method for check identifying code exclusive logic
11/21/2007CN100350582C Method and system for observing all signals inside programmable digital IC chip
11/21/2007CN100350581C Integrated wiring and inverse packaged chip structure and process
11/21/2007CN100350580C Semiconductor wafer package and its packaging method
11/21/2007CN100350578C Packaging method for semiconductor wafer package
11/21/2007CN100350577C Gallium-indium-nitride-arsenide based epitaxial wafer and hetero-field effect transistor using the same, and its manufacturing method
11/21/2007CN100350576C Method of manufacturing an electronic device comprising a thin film transistor
11/21/2007CN100350575C Vertical dual gate field effect transistor
11/21/2007CN100350574C Method of CVD for forming silicon nitride film on substrate
11/21/2007CN100350573C Method and structure for forming adhesive force between dielectric layers
11/21/2007CN100350572C Passivation method of semiconductor components
11/21/2007CN100350571C Silex glass spraying component and manufacturing method thereof
11/21/2007CN100350570C Etching method for aluminum-molybdenum laminate film
11/21/2007CN100350569C Process gas introducng mechanism and plasma processing device
11/21/2007CN100350568C Cluster type asher equipment used for manufacture of semiconductor device
11/21/2007CN100350567C Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
11/21/2007CN100350566C Slot post-processing method and device
11/21/2007CN100350565C Surface treatment method, semiconductor device, method of fabricating semiconductor device, and treatment apparatus
11/21/2007CN100350564C Semiconductor chip with asymmetric edge contour and manufacturing method thereof
11/21/2007CN100350563C Processing method and device
11/21/2007CN100350562C Method for preparation of ferroelectric single crystal film structure using deposition method
11/21/2007CN100350561C Method for fabricating SIGE substrate materials on metastable insulator and substrate materials
11/21/2007CN100350560C Substrate treating apparatus and substrate treating method
11/21/2007CN100350558C Parallel probe driven scan plasma processing device and processing method
11/21/2007CN100350557C Semiconductor package and method for manufacturing the same
11/21/2007CN100350556C Processing apparatus
11/21/2007CN100350555C Substrate processing apparatus
11/21/2007CN100350554C Process for preparing a stabilized ideal oxygen precipitating silicon wafer
11/21/2007CN100350553C Method for forming polycrystalline silicon film
11/21/2007CN100350551C Apparatus and method of making slip-free wafer boat
11/21/2007CN100350545C Plasma reaction chamber component having improved temp uniformity
11/21/2007CN100350507C Semiconductor stroage device
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