Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/06/2007US7291523 Method of manufacturing a semiconductor device
11/06/2007US7291522 Semiconductor devices and methods of making
11/06/2007US7291521 Self correcting suppression of threshold voltage variation in fully depleted transistors
11/06/2007US7291520 Piezoelectric element and liquid jet head using the piezoelectric element
11/06/2007US7291519 Methods of forming transistor constructions
11/06/2007US7291518 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
11/06/2007US7291517 Method for removing resin mask layer and method for manufacturing solder bumped substrate
11/06/2007US7291516 Low temperature melt-processing of organic-inorganic hybrid
11/06/2007US7291513 Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy
11/06/2007US7291512 Electrostatic/electrostrictive actuation of elastomer structures using compliant electrodes
11/06/2007US7291511 Method of manufacturing vibration gyro sensor element, vibration gyro sensor element, and method of adjusting vibration direction
11/06/2007US7291510 Method for manufacturing semiconductor device
11/06/2007US7291509 Method for fabricating a plurality of semiconductor chips
11/06/2007US7291508 Laser probe points
11/06/2007US7291506 Magnetic memory device and method of manufacturing the same
11/06/2007US7291505 Method of manufacturing a ferroelectric device
11/06/2007US7291446 Method and system for treating a hard mask to improve etch characteristics
11/06/2007US7291283 Combined wet etching method for stacked films and wet etching system used for same
11/06/2007US7291280 Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride
11/06/2007US7291279 Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage
11/06/2007US7291278 Electrode forming method
11/06/2007US7291227 Processing equipment
11/06/2007US7291215 Coating liquid for forming porous silica
11/06/2007US7291188 Stable polishing performance for a long time and capable of improving the polishing rate without employing a dressing treatment
11/06/2007US7291057 Apparatus for polishing a substrate
11/06/2007US7291055 Wafer polishing method and apparatus
11/06/2007US7290948 Substrate processing apparatus and substrate processing method
11/06/2007US7290847 IC chip, print apparatus, and heat generation warning method
11/06/2007US7290551 Washing device and its work conveying method
11/01/2007WO2007124472A2 Patterning sub-lithographic features with variable widths
11/01/2007WO2007124415A2 Crystallographic preferential etch to define a recessed-region for epitaxial growth
11/01/2007WO2007124294A2 Neural network methods and apparatuses for monitoring substrate processing
11/01/2007WO2007124282A1 Silicon structures with improved resistance to radiation events
11/01/2007WO2007124209A2 Stressor integration and method thereof
11/01/2007WO2007124203A2 Methods and apparatus for a synthetic anti-ferromagnet structure with reduced temperature dependence
11/01/2007WO2007124197A2 Method for forming silicon oxynitride materials
11/01/2007WO2007124073A2 Polyol photosensitizers, carrier gas uv laser ablation sensitizers, and other additives and methods for making and using same
11/01/2007WO2007123819A2 Method for making lens features
11/01/2007WO2007123803A1 Junction barrier schottky rectifiers and methods of making thereof
11/01/2007WO2007123778A1 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
11/01/2007WO2007123762A2 Damage assessment of a wafer using optical metrology
11/01/2007WO2007123677A2 Apparatus and method for confined area planarization
11/01/2007WO2007123663A2 Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
11/01/2007WO2007123616A2 Organic barc etch process capable of use in the formation of low k dual damascene integrated circuits
11/01/2007WO2007123576A1 Pressure regulation in remote zones
11/01/2007WO2007123496A1 Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template
11/01/2007WO2007123378A1 Plasma reactor having plasma chamber coupled with magnetic flux channel
11/01/2007WO2007123238A1 System for specifying equipment causing failure
11/01/2007WO2007123235A1 Polishing liquid for cmp and method of polishing
11/01/2007WO2007123212A1 METHOD FOR DEPOSITING Ti FILM
11/01/2007WO2007123211A1 METHOD FOR DEPOSITING Ti FILM
11/01/2007WO2007123203A1 Method for producing oxide particle, slurry, polishing agent and method for polishing substrate
11/01/2007WO2007123199A1 Pressing head and pressing device
11/01/2007WO2007123198A1 Substrate treatment apparatus and substrate manufacturing method
11/01/2007WO2007123197A1 Apparatus for processing substrate and process for producing substrate
11/01/2007WO2007123195A1 Jig for transferring solder bump and method for forming solder bump
11/01/2007WO2007123189A1 Exposure apparatus, exposure method, and device production method
11/01/2007WO2007123168A1 Process for producing polishing pad
11/01/2007WO2007123151A1 Method of remedying damage on insulating film
11/01/2007WO2007123150A1 Probe card and glass substrate drilling method
11/01/2007WO2007123116A1 Pressure sensitive adhesive layer for cleaning, process for producing the same, cleaning sheet, delivery member with cleaning function, and method of cleaning off foreign matter
11/01/2007WO2007123102A1 Film forming apparatus and barrier film manufacturing method
11/01/2007WO2007123093A1 Single crystal sapphire substrate
11/01/2007WO2007123076A1 Drop coating apparatus
11/01/2007WO2007123032A1 Vertical substrate conveyance device and film deposition equipment
11/01/2007WO2007123026A1 Work clamp and wire bonding apparatus
11/01/2007WO2007123007A1 Sheet cutting apparatus and sheet cutting method
11/01/2007WO2007122994A1 Substrate cleaning apparatus, substrate cleaning method, and substrate treatment apparatus
11/01/2007WO2007122977A1 Material of the resist-protecting membrane for immersion lithography
11/01/2007WO2007122929A1 Radiation-sensitive insulating resin composition
11/01/2007WO2007122925A1 Electronic component, electronic component device using same, and method for manufacturing same
11/01/2007WO2007122902A1 Substrate treating device managing method
11/01/2007WO2007122868A1 Method for forming bump and device for forming bump
11/01/2007WO2007122856A1 Apparatus for cooling optical element, and exposure apparatus
11/01/2007WO2007122821A1 Semiconductor device
11/01/2007WO2007122800A1 Field effect transistor
11/01/2007WO2007122790A1 Field effect transistor
11/01/2007WO2007122752A1 Method of removing conductive metal oxide thin-film and apparatus therefor
11/01/2007WO2007122699A1 Semiconductor integrated circuit and rewritable tag
11/01/2007WO2007122669A1 COMPOUND SEMICONDUCTOR WAFER HAVING POLYCRYSTALLINE SiC SUBSTRATE, COMPOUND SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THESE
11/01/2007WO2007122667A1 Semiconductor device and its manufacturing method
11/01/2007WO2007122646A1 Process for manufacturing a power semiconductor device and corresponding power semiconductor device
11/01/2007WO2007122567A1 Non-volatile memory device
11/01/2007WO2007122507A1 Hybrid wafers
11/01/2007WO2007122438A1 A method for producing a thin semiconductor chip
11/01/2007WO2007122181A1 Handling device
11/01/2007WO2007122083A1 Dynamic memory cell structures
11/01/2007WO2007122062A1 Device and method for heating a substrate
11/01/2007WO2007122061A1 Apparatus for laser annealing of large substrates and method for laser annealing of large substrates
11/01/2007WO2007122038A1 Method for pyrometrically measuring the temperature of the melt material in monocrystal cultivation systems
11/01/2007WO2007121992A1 Housing with an electric circuit
11/01/2007WO2007121735A2 Composite substrate, and method for the production of a composite substrate
11/01/2007WO2007103147A3 U-shaped transistor and corresponding manufacturing method
11/01/2007WO2007100873A9 Hybrid wafer -holding pin
11/01/2007WO2007089223A3 Ultralow dielectric constant layer with controlled biaxial stress
11/01/2007WO2007087155A3 Systems and methods for forming additional metal routing in semiconductor devices
11/01/2007WO2007081624A3 Notch stop pulsing process for plasma processing system
11/01/2007WO2007076251A3 Semiconductor device fabricated using disassociated chlorohydrocarbon
11/01/2007WO2007062345A3 Method and system for iteratively, selectively tuning a parameter of a doped workpiece using a pulsed laser
11/01/2007WO2007044181A3 Coated substrates and methods for their preparation