Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/15/2007US20070261735 Liquid Amount Monitoring Apparatus, Semiconductor Manufacturing Apparatus Having the Liquid Amount Monitoring Apparatus Mounted Thereon, and Liquid Material/Liquid Amount Monitoring Method
11/15/2007US20070261639 Semiconductor manufacturing apparatus
11/15/2007US20070261635 Spray coating apparatus and fixtures
11/15/2007US20070261633 GaN crystal substrate and method of manufacturing the same, and method of manufacturing semiconductor device
11/15/2007US20070261574 Microcontact printing
11/15/2007US20070261490 Acceleration sensor and method of producing the same
11/15/2007US20070261233 Method and system for fabricating a semiconductor device
11/15/2007US20070261232 Method for trimming resistors
11/15/2007DE19652471B4 Verfahren zur Wasserstoffpassivierung von Verbindungshalbleitern Process for hydrogen passivation of compound semiconductors
11/15/2007DE112005002998T5 Transistoranordnung und Verfahren zur Herstellung derselben Transistor device and method of manufacturing the same
11/15/2007DE112004002491T5 Kontaktlose Flash-Speicheranordnung Contactless flash memory array
11/15/2007DE10342548B4 Schnelle Abscheidung von Borsilicatglasfilmen Rapid separation of Borsilicatglasfilmen
11/15/2007DE10335071B4 Verfahren zur Integrierung einer Ausrichtmarkierung und Grabenvorrichtung A method for integrating an alignment device and grave
11/15/2007DE10224559B4 Polierverfahren zur Entfernung von Eckmaterial von einem Halbleiterwafer A polishing method for removing corner material from a semiconductor wafer
11/15/2007DE10204644B4 Halbleitervorrichtung mit ferroelektrischem Kondensator A semiconductor device having a ferroelectric capacitor
11/15/2007DE102007021949A1 Bauteilmontageeinrichtung und Bauteilmontageverfahren Component mounting apparatus and component mounting method
11/15/2007DE102007021728A1 Exposure device for wafer dividing system, has transferring unit for transferring wafer from grinding unit to plasma etching system, where transferring unit removes appropriate section of resist layer
11/15/2007DE102007019686A1 Verbindungsstruktur, elektronisches Bauelement und Verfahren zur Herstellung derselben Connection structure, an electronic component and method of producing same
11/15/2007DE102007018010A1 Verfahren zum Plasmaätzen mit Mustermaske A method for plasma etching pattern mask
11/15/2007DE102007017963A1 Non-volatile memory device`s e.g. digital camera, memory cell, has select transistor gate of select transistor, and two memory cell transistor gates of memory cell transistors on substrate at opposite sides of select transistor
11/15/2007DE102006049156A1 Trockenätzgas für Halbleiterverfahren und Herstellungsverfahren hierfür Dry etching for semiconductor processes and manufacturing method thereof
11/15/2007DE102006023439A1 Halbleiterspeicherbauelement und Herstellungsverfahren für das Halbleiterspeicherbauelement The semiconductor memory device and manufacturing method for the semiconductor memory device
11/15/2007DE102006022748A1 Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation
11/15/2007DE102006022637A1 Verfahren und Vorrichtung zum Anfahren einer vorbestimmten Position eines sich in einer Verfahrrichtung bewegenden Trägerbandes Method and apparatus for starting a predetermined position of a moving in one direction of the carrier tape
11/15/2007DE102006022475A1 Verfahren zum Ausgleichen einer durch eine Temperaturänderung hervorgerufenen Positionsänderung einer Nadelkarte A method of compensating for a temperature change caused by a change in position of a probe card
11/15/2007DE102006022360A1 Abschirmvorrichtung Screening
11/15/2007DE102006022126A1 Electronic component e.g. silicon controlled rectifier, manufacturing method, involves doping portion of body regions by introducing dopant atoms into portion through intermediate region formed between separate gate regions
11/15/2007DE102006022089A1 Verfahren zur Herstellung einer Halbleiterscheibe mit einr profilierten Kante A method for manufacturing a semiconductor wafer with einr profiled edge
11/15/2007DE102006022067A1 Production of electronic component with semiconductor element bonded and fastened on a substrate, comprises applying a gold layer on the substrate surface and spray coating of the element and/or the surface with hardening/ curing component
11/15/2007DE102006021647A1 Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften Process for separating disk-shaped substrates using adhesive forces
11/15/2007DE102006021410A1 Verfahren zur Herstellung eines Mehrschichtgebildes A process for producing a multi-layer structure
11/15/2007DE102006019937A1 SOI-Transistor mit eingebetteter Verformungsschicht und einem reduzierten Effekt des potentialfreien Körpers und ein Verfahren zur Herstellung des Transistors SOI transistor with embedded deformable layer and a reduced effect of the floating body and a process for producing the transistor
11/15/2007DE102006008632B4 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
11/15/2007CA2650489A1 Semiconductor device having a semiconductor-on-insulator configuration and a superlattice and associated methods
11/14/2007EP1855326A1 AlGaAs LIGHT EMITTING DIODE HAVING DOUBLE HETERO JUNCTION AND METHOD FOR MANUFACTURING SAME
11/14/2007EP1855315A1 Electronic tag chip
11/14/2007EP1855314A1 Cassette conveyance method and cassette conveyance apparatus
11/14/2007EP1855313A1 Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film
11/14/2007EP1855312A1 PROCESS FOR PRODUCING SiC SINGLE-CRYSTAL SUBSTRATE
11/14/2007EP1855311A1 Two-light flux interference exposure device, two-light flux interference exposure method, semiconductor light emitting element manufacturing method, and semiconductor light emitting element
11/14/2007EP1855310A2 Capacitor for semiconductor device, manufacturing method thereof, and electronic device employing the same
11/14/2007EP1855309A1 Method for manufacturing bonded wafer and bonded wafer
11/14/2007EP1855159A1 Composition for underlayer film of resist and process for producing the same
11/14/2007EP1855089A2 Monolithic sensor assembly or method for actuating a monolithic sensor assembly
11/14/2007EP1854156A2 Single or multi-color high efficiency light emitting diode (led) by growth over a patterned substrate
11/14/2007EP1854146A1 Thin film transistor panel
11/14/2007EP1854138A2 Embedded dram with increased capacitance and method of manufacturing same
11/14/2007EP1854137A1 Multilayer film
11/14/2007EP1854136A1 Temporary wafer bonding method for semiconductor processing
11/14/2007EP1854135A1 Method of bonding aluminum electrodes of two semiconductor substrates
11/14/2007EP1854134A2 Method and arrangement for contact-connecting semiconductor chips on a metallic substrate
11/14/2007EP1854133A2 Low cost, high volume lead frame production
11/14/2007EP1854132A2 A method for pattern metalization of substrates
11/14/2007EP1854131A2 Ultralow dielectric constant layer with controlled biaxial stress
11/14/2007EP1854130A2 Horizontal emitting, vertical emitting, beam shaped, distributed feedback (dfb) lasers by growth over a patterned substrate
11/14/2007EP1854129A1 Oled-device with patterned layer thickness
11/14/2007EP1854128A2 Method of integrating optical devices and electronic devices on an integrated circuit
11/14/2007EP1853973A1 Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material
11/14/2007EP1853676A1 Method of bonding substrates
11/14/2007EP1637893B1 Method and apparatus for testing electrical characteristics of object under test
11/14/2007EP1595278B1 Random-period chip transfer apparatus
11/14/2007EP1570513A4 Microelectronic packaging and components
11/14/2007EP1567034A4 Semiconductor component handling device having a performance film
11/14/2007EP1551886A4 Fluorinated polymers useful as photoresists, and processes for microlithography
11/14/2007EP1540714A4 Barrier coatings produced by atmospheric glow discharge
11/14/2007EP1451874B1 Method for the production of image sensors
11/14/2007EP1438722B1 Magnetic memory with write inhibit selection and the writing method for same
11/14/2007EP1430484B1 Magnetic memory with spin-polarized current writing, using amorphous ferromagnetic alloys, writing method for same
11/14/2007EP1412948B1 Magnetic memory unit and magnetic memory array
11/14/2007EP1382062B1 Method for minimizing tungsten oxide formation during selective sidewall oxidation of tungsten-silicon gates
11/14/2007EP1376665B1 Gaseous phase growing device
11/14/2007EP1305803B1 Integrated circuit with a temperature sensor
11/14/2007EP1179218B1 Semiconductor device and method of manufacturing same
11/14/2007EP1123639A4 Wafer level burn-in and test thermal chuck and method
11/14/2007EP1110248B1 Method for depositing layers of high quality semiconductor material
11/14/2007EP1103076B1 Zinc oxide films containing p-type dopant and process for preparing same
11/14/2007EP1095401B1 Method for anisotropic plasma etching of semiconductors
11/14/2007EP1090401B1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor
11/14/2007EP1074042B1 Synchronous multiplexed near zero overhead architecture for vacuum processes
11/14/2007EP1055163B1 High-speed precision positioning apparatus
11/14/2007EP1035583B1 Semiconductor element and fabricating method thereof
11/14/2007EP0980537B1 Optical scanner and image reader for reading images and decoding optical information including one and two dimensional symbologies at variable depth of field
11/14/2007EP0853342B1 Connecting structure between wiring board and plug member
11/14/2007EP0496891B2 Method and device for optical exposure
11/14/2007CN200976707Y Scaling channel structure based atmosphere pressure discharging cold plasma generators and array
11/14/2007CN200976353Y Upright type LED feeding system
11/14/2007CN200976343Y Device for clearing remnant glue on semiconductor element
11/14/2007CN200974321Y Multi-head injection circuit packaging mould for big material cakes
11/14/2007CN101073157A Semiconductor device and method for production thereof
11/14/2007CN101073153A Component mounting apparatus and component mounting method
11/14/2007CN101073149A Methodology for recovery of hot carrier induced degradation in bipolar devices
11/14/2007CN101073148A Method of producing an epitaxial layer on a semiconductor substrate and device produced with such a method
11/14/2007CN101073147A Device having enhanced stress state and related methods
11/14/2007CN101073146A Substrate treatment apparatus
11/14/2007CN101073145A Division starting poin forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam
11/14/2007CN101073144A Method and device for wafer scale packaging of optical devices using a scribe and break process
11/14/2007CN101073143A Method for forming a semiconductor arragement with gate sidewall spacers of specific dimensions
11/14/2007CN101073142A Reflective photomask blank, reflective photomask, and method for manufacturing semiconductor device using same
11/14/2007CN101073141A Gas supply integration unit
11/14/2007CN101073140A Method and device for treating substrates and corresponding nozzle unit
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