Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/08/2007DE102006019921A1 Transistor mit eingebetteter Schicht mit Zugverformung mit geringem Abstand zu der Gateelektrode und ein Verfahren zur Herstellung des Transistors Transistor having embedded layer with tensile strain at a small distance to the gate electrode and a process for producing the transistor
11/08/2007DE102006019902A1 Verfahren zur Bestimmung eines Flächeninhalts einer Oberfläche eines Grabens sowie Verwendung zur Herstellung eines Grabenkondensators A method for determining a surface area of ​​a surface of a trench, as well as use for the preparation of a capacitor grave
11/08/2007DE102006012739B3 Leistungstransistor und Leistungshalbleiterbauteil Power transistor and power semiconductor component
11/08/2007DE102005059035B4 Isolationsgrabenstrukturen für hohe Spannungen Isolation grave structures for high voltages
11/08/2007DE102005046280B4 Halbleiterbauteil mit einem Halbleiterchip sowie Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip and method for producing
11/08/2007DE102005042071B4 Verfahren zum Herstellen einer Halbleiterstruktur A method of fabricating a semiconductor structure
11/08/2007DE102004012555B4 Verfahren zur Ausbildung einer integrierten Schaltung mit Grabenisolation A method of forming an integrated circuit with grave insulation
11/08/2007DE102004004532B4 Halbleitervorrichtung Semiconductor device
11/08/2007DE10104555B4 Lagervorrichtung zum Einsatz in Reinumgebungen Storage device for use in clean environments
11/08/2007CA2649797A1 Nanostructures and a method for the manufacture of the same
11/08/2007CA2636313A1 Semiconductor device and manufacturing method therefor
11/07/2007EP1852948A1 Laser light source control method, laser light source device, and exposure apparatus
11/07/2007EP1852909A1 Process for integrating a non-volatile memory cell into a HV CMOS process
11/07/2007EP1852908A1 Implantation process using sub-stoichiometric, oxygen doses at diferent energies
11/07/2007EP1852907A1 Electrostatic chuck and processing apparatus
11/07/2007EP1852906A2 Sheet to form a protective film for chips and process for producing semiconductor chips
11/07/2007EP1852905A1 Method of selective etching and silicon single crystal substrate
11/07/2007EP1852904A1 Dielectric film and method for forming the same
11/07/2007EP1852903A2 Compositions for preparing materials with a low dielectric constant
11/07/2007EP1852902A1 Seal material for semiconductor production apparatus
11/07/2007EP1852901A1 Method for manufacturing a layered structure
11/07/2007EP1852900A1 Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
11/07/2007EP1852899A1 Method for manufacturing semiconductor wafer and method for mirror chamfering semiconductor wafer
11/07/2007EP1852898A1 Cmp polishing method, cmp polishing apparatus, and process for producing semiconductor device
11/07/2007EP1852897A1 Nitride semiconductor material and method for manufacturing nitride semiconductor crystal
11/07/2007EP1852896A1 Diamond substrate and method for fabricating the same
11/07/2007EP1852895A1 Diamond substrate and method for fabricating the same
11/07/2007EP1852894A1 Exposure method and apparatus, and electronic device manufacturing method
11/07/2007EP1852893A2 Capacitor and method of manufacturing the same
11/07/2007EP1852763A1 Xy stage
11/07/2007EP1852694A2 Monitoring substrate processing using reflected radiation
11/07/2007EP1852691A2 Monitoring substrate processing using reflected radiation
11/07/2007EP1852481A1 Silane containing polishing composition for CMP
11/07/2007EP1852480A1 Method of processing a surface of group III nitride crystal and group III nitride crystal substrate
11/07/2007EP1852236A1 Production method for 3-d mold, production method for finely machined product, production method for fine-pattern molded product, 3-d mold, finely machined product, fine-pattern molded product and optical component
11/07/2007EP1852220A1 Substrate holding apparatus
11/07/2007EP1851804A2 Power electronic device of multi-drain type integrated on a semiconductor substrate and relative manufacturing process
11/07/2007EP1851799A1 Integrated circuit chip package and method
11/07/2007EP1851798A1 Microelectronic assemblies having compliancy
11/07/2007EP1851797A1 Device and method for fabricating double-sided soi wafer scale package with through via connections
11/07/2007EP1851796A2 Integrated circuit capacitor and method of manufacturing same
11/07/2007EP1851795A2 Selective plasma re-oxidation process using pulsed rf source power
11/07/2007EP1851794A1 Plasma pre-treating surfaces for atomic layer deposition
11/07/2007EP1851793A1 Method of fabrication a shallow trench isolation structure with oxide sidewall spacers
11/07/2007EP1851792A1 Method of forming sti regions in electronic devices
11/07/2007EP1851791A2 Method of manufacturing a hermetic chamber with electrical feedthroughs
11/07/2007EP1851790A1 Method for reducing the trap density in a semiconductor wafer
11/07/2007EP1851789A2 Thermal oxidation of a sige layer and applications thereof
11/07/2007EP1851788A2 Plasma gate oxidation process using pulsed rf source power
11/07/2007EP1851787A1 Method of forming vias in silicon carbide and resulting devices and circuits
11/07/2007EP1851507A2 Methods and systems for determining overlay error based on target image symmetry
11/07/2007EP1851296A1 Compositions for processing of semiconductor substrates
11/07/2007EP1851286A2 Novel polishing slurries and abrasive-free solutions having a multifunctional activator
11/07/2007EP1851282A1 Bonding of air-plasma treated thermoplastics
11/07/2007EP1851002A1 Polishing apparatus and polishing method
11/07/2007EP1773959B1 Method of polishing a tungsten-containing substrate
11/07/2007EP1735838A4 Optical devices featuring textured semiconductor layers
11/07/2007EP1668687A4 Fabrication of conductive metal layer on semiconductor devices
11/07/2007EP1665278A4 Nanotube-based switching elements with multiple controls and circuits made from same
11/07/2007EP1609188A4 Nanotube-on-gate fet structures and applications
11/07/2007EP1588362B1 Method of manufacturing an optical data storage medium, optical data storage medium and apparatus for performing said method
11/07/2007EP1565931B1 Strained finfet cmos device structures
11/07/2007EP1546222A4 Photoresists, fluoropolymers and processes for 157 nm microlithography
11/07/2007EP1425110A4 A method of depositing an inorganic film on an organic polymer
11/07/2007EP1287553A4 Chip scale surface mounted device and process of manufacture
11/07/2007EP1264349A4 A die attachment surface having pedestals for receiving components and method of using the attachment
11/07/2007EP1190450B1 Electrostatic discharge protection of integrated circuits
11/07/2007EP1166337B1 Device for manufacturing semiconductor products
11/07/2007EP1094921A4 Transferring substrates with different holding end effectors
11/07/2007EP1051745B1 A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
11/07/2007EP1040517B1 Semiconductor component and manufacturing method for semiconductor component
11/07/2007EP1029942B1 Vacuum device
11/07/2007EP0960435B1 Methods for minimizing as-deposited stress in tungsten silicide films
11/07/2007EP0850490B1 Process and device for testing a chip
11/07/2007EP0642699B1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
11/07/2007CN200972855Y Special adhesive solid clamp for caustic plane probe chip
11/07/2007CN200972854Y Auxiliary tool for thermocouple wire stuffing
11/07/2007CN200970715Y Polishing parts used for electrochemical mechinery polishing
11/07/2007CN200970672Y Frame type integrated frame-bridge welder
11/07/2007CN101069282A Method for forming self-aligned dual fully silicided gates in CMOS devies
11/07/2007CN101069281A Method for forming self-aligned dual salicide in CMOS technologies
11/07/2007CN101069280A A method of forming an interconnect structure on an integrated circuit die
11/07/2007CN101069279A Semiconductor device and its manufacturing method
11/07/2007CN101069278A Method for enhancing field oxide and integrated circuit with enhanced field oxide
11/07/2007CN101069277A A probe card manufacturing method including sensing probe and the probe card, probe card inspection system
11/07/2007CN101069276A Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method
11/07/2007CN101069275A Fine particles depositing device and method, and preparing method for light emitting element
11/07/2007CN101069274A Semiconductor device manufacturing method, semiconductor device, plasma nitriding treatment method, control program and computer storage medium
11/07/2007CN101069273A Method of forming a component having dielectric sub-layers
11/07/2007CN101069272A Etching method and etching apparatus
11/07/2007CN101069271A Process for producing abrasive, abrasive produced by the same, and process for producing silicon wafer
11/07/2007CN101069270A Supply mechanism for the chuck of an integrated circuit dicing device
11/07/2007CN101069269A Multiple mask and method for producing differently doped regions
11/07/2007CN101069268A Heat treatment apparatus, computer program and storage medium
11/07/2007CN101069267A Optical integrator, illumination optical device, exposure device, and exposure method
11/07/2007CN101069266A Exposure device and device manufacturing method
11/07/2007CN101069265A Exposure apparatus, exposure method and device manufacturing method
11/07/2007CN101069264A Selective epitaxy process with alternating gas supply
11/07/2007CN101069222A 显示装置 Display device
11/07/2007CN101069088A Surface inspection apparatus and surface inspection method