Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/13/2007US7294883 Nonvolatile memory cells with buried channel transistors
11/13/2007US7294881 Nonvolatile semiconductor memory having a charge accumulation layer connected to a gate
11/13/2007US7294880 Semiconductor non-volatile memory cell with a plurality of charge storage regions
11/13/2007US7294878 Semiconductor memory device and method of manufacturing the same
11/13/2007US7294876 FeRAM device and method for manufacturing the same
11/13/2007US7294874 Laser irradiation method, method for manufacturing a semiconductor device, and a semiconductor device
11/13/2007US7294872 Solid state image pickup device and its manufacture method
11/13/2007US7294871 Top layers of metal for high performance IC's
11/13/2007US7294870 Top layers of metal for high performance IC's
11/13/2007US7294864 Flip chip type nitride semiconductor light-emitting diode
11/13/2007US7294861 Phosphor tape article
11/13/2007US7294859 Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices
11/13/2007US7294858 Semiconductor device and method of manufacturing the same
11/13/2007US7294857 Polysilicon thin film transistor array panel and manufacturing method thereof
11/13/2007US7294855 Contact structure of semiconductor device, manufacturing method thereof, thin film transistor array panel including contact structure, and manufacturing method thereof
11/13/2007US7294854 Thin film transistor array panel and liquid crystal display including the panel
11/13/2007US7294853 Substrate for mounting a semiconductor
11/13/2007US7294852 Transparent conductive films and processes for forming them
11/13/2007US7294844 Lithographic apparatus, device manufacturing method, and device manufactured thereby
11/13/2007US7294833 Method of alignment for efficient defect review
11/13/2007US7294827 Electronic module with light-blocking features
11/13/2007US7294606 Substrate and method for the formation of continuous magnesium diboride and doped magnesium diboride wire
11/13/2007US7294590 System and method for removing charges with enhanced efficiency
11/13/2007US7294589 Laser irradiation apparatus
11/13/2007US7294588 In-situ-etch-assisted HDP deposition
11/13/2007US7294587 Component built-in module and method for producing the same
11/13/2007US7294586 Method of processing a substrate, heating apparatus, and method of forming a pattern
11/13/2007US7294585 Compositions for preparing low dielectric materials
11/13/2007US7294584 Siloxane-based resin and a semiconductor interlayer insulating film using the same
11/13/2007US7294583 Methods for the use of alkoxysilanol precursors for vapor deposition of SiO2 films
11/13/2007US7294582 Low temperature silicon compound deposition
11/13/2007US7294581 Method for fabricating silicon nitride spacer structures
11/13/2007US7294580 Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition
11/13/2007US7294579 Method for forming contact opening
11/13/2007US7294578 Use of a plasma source to form a layer during the formation of a semiconductor device
11/13/2007US7294577 Method of manufacturing a silicide layer
11/13/2007US7294576 Tunable selectivity slurries in CMP applications
11/13/2007US7294575 Chemical mechanical polishing process for forming shallow trench isolation structure
11/13/2007US7294574 Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement
11/13/2007US7294573 Method for controlling poly 1 thickness and uniformity in a memory array fabrication process
11/13/2007US7294572 Method of forming contact
11/13/2007US7294571 Concave pattern formation method and method for forming semiconductor device
11/13/2007US7294570 Contact integration method
11/13/2007US7294569 Semiconductor device fabrication method and semiconductor device fabrication system for minimizing film-thickness variations
11/13/2007US7294568 Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures
11/13/2007US7294567 Semiconductor contact device and method
11/13/2007US7294566 Method for forming wiring pattern, method for manufacturing device, device, electro-optic apparatus, and electronic equipment
11/13/2007US7294565 Method of fabricating a wire bond pad with Ni/Au metallization
11/13/2007US7294564 Method for forming a layered semiconductor technology structure and corresponding layered semiconductor technology structure
11/13/2007US7294563 Semiconductor on insulator vertical transistor fabrication and doping process
11/13/2007US7294562 Semiconductor substrate, method of manufacturing the same, semiconductor device, and method of manufacturing the same
11/13/2007US7294561 Internal gettering in SIMOX SOI silicon substrates
11/13/2007US7294560 Method of assembling one-dimensional nanostructures
11/13/2007US7294559 Wafer dicing process for optical electronic packing
11/13/2007US7294558 Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid
11/13/2007US7294557 Method of increasing the area of a useful layer of material transferred onto a support
11/13/2007US7294556 Method of forming trench isolation in the fabrication of integrated circuitry
11/13/2007US7294555 Method of forming trench in semiconductor device using polish stop layer and anti-reflection coating
11/13/2007US7294554 Method to eliminate arsenic contamination in trench capacitors
11/13/2007US7294553 Plasma-enhanced chemical vapour deposition process for depositing silicon nitride or silicon oxynitride, process for producing one such layer arrangement, and layer arrangement
11/13/2007US7294552 Electrical contact for a MEMS device and method of making
11/13/2007US7294551 Semiconductor device and method for manufacturing the same
11/13/2007US7294550 Method of fabricating metal oxide semiconductor device
11/13/2007US7294549 Vertical floating gate transistor
11/13/2007US7294548 Semiconductor device and fabricating method thereof
11/13/2007US7294547 SONOS memory cell having a graded high-K dielectric
11/13/2007US7294546 Capacitor for a semiconductor device and method of fabricating same
11/13/2007US7294545 Selective polysilicon stud growth
11/13/2007US7294544 Method of making a metal-insulator-metal capacitor in the CMOS process
11/13/2007US7294543 DRAM (Dynamic Random Access Memory) cells
11/13/2007US7294542 Method of fabricating a semiconductor device having CMOS transistors and a bipolar transistor
11/13/2007US7294541 Method of fabricating gate dielectric layer and method of fabricating semiconductor device
11/13/2007US7294540 Method for manufacturing a nitride based semiconductor device
11/13/2007US7294539 Semiconductor substrate, semiconductor device, method of manufacturing semiconductor substrate, and method of manufacturing semiconductor device
11/13/2007US7294538 Method of polycrystallization, method of manufacturing polysilicon thin film transistor, and laser irradiation device therefor
11/13/2007US7294537 Method of fabricating thin film transistor with multiple gates using super grain silicon crystallization
11/13/2007US7294536 Process for manufacturing an SOI wafer by annealing and oxidation of buried channels
11/13/2007US7294535 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
11/13/2007US7294534 Interconnect layout method
11/13/2007US7294533 Mold compound cap in a flip chip multi-matrix array package and process of making same
11/13/2007US7294532 Method for manufacturing semiconductor device
11/13/2007US7294531 Wafer level chip stack method
11/13/2007US7294530 Method for encapsulating multiple integrated circuits
11/13/2007US7294529 Method for embedding a component in a base
11/13/2007US7294528 Supercritical fluid-assisted deposition of materials on semiconductor substrates
11/13/2007US7294527 Method of forming a memory cell
11/13/2007US7294526 Nano optical sensors via molecular self-assembly
11/13/2007US7294525 High performance integrated inductor
11/13/2007US7294524 Method for fabricating image sensor without LTO-based passivation layer
11/13/2007US7294523 Method for fabricating CMOS image sensor
11/13/2007US7294522 CMOS image sensor and method for fabricating the same
11/13/2007US7294521 Method of fabricating vertical devices using a metal support film
11/13/2007US7294520 Method for fabricating a plurality of semiconductor bodies, and electronic semiconductor body
11/13/2007US7294519 Semiconductor light-emitting device and method of manufacturing the same
11/13/2007US7294518 Composition for stripping photoresist and method for manufacturing thin film transistor array panel using the same
11/13/2007US7294517 Light emitting device and method of fabricating the same
11/13/2007US7294516 Test patterns and methods of controlling CMP process using the same
11/13/2007US7294453 Electronic device manufacture
11/13/2007US7294440 Method to selectively correct critical dimension errors in the semiconductor industry
11/13/2007US7294437 Systems for modeling a transmitted electromagnetic field through a mask, to design a mask, and to create a library of corrections including edge corrections, edge-to-edge corrections, and corner corrections