Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/13/2007US7294381 spliced film carrier tape
11/13/2007US7294308 Penetrable cap
11/13/2007US7294282 Method for fabricating an actuator system
11/13/2007US7294244 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
11/13/2007US7294241 Method to form alpha phase Ta and its application to IC manufacturing
11/13/2007US7294224 Magnet assembly for plasma containment
11/13/2007US7294217 Oxidizing a surface of the at least one metallic interconnect element;forming on at least one of interconnect elements, bonding surface layer comprising copper nitride to inhibit oxidation of underlying metallic layers; forming an electrically conductive bond
11/13/2007US7294207 Gas-admission element for CVD processes, and device
11/13/2007US7294205 Method for reducing the intrinsic stress of high density plasma films
11/13/2007US7294201 Method of manufacturing crystal of III-V compound of the nitride system, crystal substrate of III-V compound of the nitride system, crystal film of III-V compound of the nitride system, and method of manufacturing device
11/13/2007US7294200 Method for producing nitride semiconductor crystal, and nitride semiconductor wafer and nitride semiconductor device
11/13/2007US7294199 Nitride single crystal and producing method thereof
11/13/2007US7294196 Silicon single crystal wafer, an epitaxial wafer and a method for producing a silicon single crystal
11/13/2007US7294155 Coating apparatus, thin film forming method, thin film forming apparatus, and semiconductor device manufacturing method, electro-optic device and electronic instrument
11/13/2007US7294043 CMP apparatus and process sequence method
11/13/2007US7293986 Vestibule assembly for a heat treatment furnace
11/13/2007US7293950 Universal modular wafer transport system
11/13/2007US7293811 Ultra low contact area end effector
11/13/2007US7293686 Bonding apparatus
11/13/2007US7293642 Methods and apparatus for transporting substrate carriers
11/13/2007US7293571 Substrate proximity processing housing and insert for generating a fluid meniscus
11/13/2007US7293526 Plasma reaction chamber liner consisting essentially of osmium
11/13/2007CA2280115C Low temperature method and compositions for producing electrical conductors
11/13/2007CA2199948C Self-aligned field-effect transistor for high frequency applications
11/13/2007CA2176880C Scaled adaptive lithography
11/08/2007WO2007127947A2 Substrate processing chamber with dielectric barrier discharge lamp assembly
11/08/2007WO2007127866A2 An integrated thermal unit having vertically arranged bake and chill plates
11/08/2007WO2007127816A2 Method for forming c4 connections on integrated circuit chips and the resulting devices
11/08/2007WO2007127769A2 High performance 3d fet structures, and methods for forming the same using preferential crystallographic etching
11/08/2007WO2007127670A2 Buffer-layer treatment of mocvd-grown nitride structures
11/08/2007WO2007127552A2 Semiconductor die package including multiple dies and a common node structure
11/08/2007WO2007127533A2 Method for forming a semiconductor device having a fin and structure thereof
11/08/2007WO2007127515A2 Piezoelectric mems switches and methods of making
11/08/2007WO2007127407A2 Active mask lithography
11/08/2007WO2007127294A2 Exhaust system
11/08/2007WO2007127197A2 Mask structure for manufacture of trench type semiconductor device
11/08/2007WO2007127074A2 Semiconductor on glass insulator made using improved thinning process
11/08/2007WO2007127068A1 Load lock control
11/08/2007WO2007126970A2 Friction materials made with resins containing polar functional groups
11/08/2007WO2007126966A2 Insulator system for a terminal structure of an ion implantation system
11/08/2007WO2007126956A2 Damascene interconnection having porous low k layer with improved mechanical properties
11/08/2007WO2007126911A1 Method of reducing interconnect line to line capacitance by using a low k spacer
11/08/2007WO2007126909A1 Epitaxial silicon germanium for reduced contact resistance in field-effect transistors
11/08/2007WO2007126907A1 Semiconductor device comprising soi transistors and bulk transistors and a method of forming the same
11/08/2007WO2007126807A1 An soi transistor having a reduced body potential and a method of forming the same
11/08/2007WO2007126670A1 Substrate having conductive traces isolated by laser to allow electrical inspection
11/08/2007WO2007126495A1 Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions
11/08/2007WO2007126488A2 Method for fabricating a semiconductor component including a high capacitance per unit area capacitor
11/08/2007WO2007126482A2 Methods for forming thin oxide layers on semiconductor wafers
11/08/2007WO2007126469A2 Method for conditioning a process chamber
11/08/2007WO2007126468A1 Post-etch treatment system for removing residue on a substrate
11/08/2007WO2007126463A2 Low-temperature dielectric formation for devices with strained germanium-containing channels
11/08/2007WO2007126460A1 Sequential oxide removal using fluorine and hydrogen
11/08/2007WO2007126445A2 Method and system for patterning a dielectric film
11/08/2007WO2007126412A2 Methods of making spatially aligned nanotubes and nanotube arrays
11/08/2007WO2007126393A2 An improved net table
11/08/2007WO2007126289A1 Substrate transfer equipment and high speed substrate processing system using the same
11/08/2007WO2007126245A1 Apparatus for thinning a substrate and thinning system having the same
11/08/2007WO2007126228A1 Manufacturing method for susceptor and susceptor using this method
11/08/2007WO2007126158A1 Semiconductor light emitting element and wafer
11/08/2007WO2007126094A1 Semiconductor light-emitting device
11/08/2007WO2007126093A1 Integrated semiconductor light-emitting device and its manufacturing method
11/08/2007WO2007126092A1 Integrated semiconductor light emitting device and method for manufacturing same
11/08/2007WO2007126091A1 Etching method, etching mask and method for manufacturing semiconductor device using the same
11/08/2007WO2007126071A1 Magnetic thin film, magnetoresistive element using the same, and magnetic device
11/08/2007WO2007126050A1 Protective agent
11/08/2007WO2007126030A1 Oxide crystal fine particle and polishing slurry including the fine particle
11/08/2007WO2007126016A1 Film position adjusting method, memory medium and substrate processing system
11/08/2007WO2007125993A1 Electroconductive particle placement sheet and anisotropic elctroconductive film
11/08/2007WO2007125991A1 Foam solder and electronic component
11/08/2007WO2007125971A1 Method of forming resist pattern
11/08/2007WO2007125956A1 Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
11/08/2007WO2007125941A1 Method and system for classifying defect distribution, method and system for specifying causative equipment, computer program and recording medium
11/08/2007WO2007125938A1 Apparatus and method for correcting xy coordinates in sample pattern inspecting apparatus
11/08/2007WO2007125932A1 Photoelectric conversion element and manufacturing method of photoelectric conversion element
11/08/2007WO2007125921A1 Photosensitive resin composition and photosensitive film
11/08/2007WO2007125914A1 Method for manufacturing gallium nitride crystal and gallium nitride wafer
11/08/2007WO2007125899A1 Organic thin-film transistor
11/08/2007WO2007125887A1 Process information managing device and program
11/08/2007WO2007125886A1 Process information managing device and program
11/08/2007WO2007125885A1 Group management system, process information management device, control device, and program
11/08/2007WO2007125884A1 Group management system, process information management device, and program
11/08/2007WO2007125879A1 Electroconductive paste for solar battery electrode
11/08/2007WO2007125863A1 Soi wafer manufacturing method
11/08/2007WO2007125853A1 Measuring and inspecting method, measuring and inspecting apparatus, exposing method, device manufacturing method and device manufacturing apparatus
11/08/2007WO2007125851A1 Method for etching of silicon
11/08/2007WO2007125841A1 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
11/08/2007WO2007125837A1 METHOD FOR DEPOSITING Ti FILM
11/08/2007WO2007125836A1 METHOD FOR DEPOSITING Ti FILM
11/08/2007WO2007125834A1 Mold release film for semiconductor resin mold
11/08/2007WO2007125830A1 Adhesive tape
11/08/2007WO2007125821A1 Heat resisting vacuum insulating material and heating device
11/08/2007WO2007125818A1 Polymer and photosensitive resin composition comprising the same
11/08/2007WO2007125817A1 Photosensitive resin composition
11/08/2007WO2007125789A1 Connection structure and method of producing the same
11/08/2007WO2007125771A1 Soi wafer manufacturing method
11/08/2007WO2007125758A1 Method for manufacturing liquid crystal display device, and exposure device
11/08/2007WO2007125756A1 Apparatus for inspecting fine structure and method for inspecting fine structure
11/08/2007WO2007125748A1 Film forming method, film forming device, and storage medium
11/08/2007WO2007125707A1 Liquid vaporization apparatus