Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/08/2007WO2007125675A2 Microphone manufacturing method
11/08/2007WO2007125634A1 Cleaning agent for copper wiring
11/08/2007WO2007125617A1 Semiconductor device and process for producing the same
11/08/2007WO2007125278A1 Nanostructures and a method for the manufacture of the same
11/08/2007WO2007125224A1 Method for continuous mechano-chemical polishing (mcp) of a multilayer material
11/08/2007WO2007111876A3 Determining ion beam parallelism using refraction method
11/08/2007WO2007103036A3 Method of semiconductor package singulation
11/08/2007WO2007098215A8 Method for growth of semipolar (al,in,ga,b)n optoelectronic devices
11/08/2007WO2007096581A3 Radio frequency integrated circuit manufacturing
11/08/2007WO2007092176A3 Methods for fabricating and filling conductive vias and conductive vias so formed
11/08/2007WO2007067551A3 Techniques for reducing effects of photoresist outgassing
11/08/2007WO2007065658A3 Method for dry chemical treatment of substrates and use thereof
11/08/2007WO2007035182A3 Field enhanced electrodes for additive-injection non-thermal plasma (ntp) processor
11/08/2007WO2007027436A3 Processing thin wafers
11/08/2007WO2007021654A3 Apparatus for developing photoresist and method for operating the same
11/08/2007WO2007018813A3 Wide and narrow trench formation in high aspect ratio mems
11/08/2007WO2006118789A3 Integrated circuit and method of manufacture
11/08/2007WO2006113754A3 Underfill dispense at substrate aperture
11/08/2007WO2006104583A3 Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation
11/08/2007WO2006093938A3 Junction-isolated vias
11/08/2007WO2005059960A3 Segmented radio frequency electrode apparatus and method for uniformity control
11/08/2007US20070260948 Driver IC and inspection method for driver IC and output device
11/08/2007US20070260848 Power mangement integrated circuit
11/08/2007US20070260419 Image Plane Measurement Method, Exposure Method, Device Manufacturing Method, and Exposure Apparatus
11/08/2007US20070259609 Cmp Conditioner
11/08/2007US20070259585 Display Device and Method of Fabricating the Same
11/08/2007US20070259535 Radial temperature control for lattice-mismatched epitaxy
11/08/2007US20070259534 In-situ formation of oxidized aluminum nitride films
11/08/2007US20070259532 Producing Method of Semiconductor Device and Substrate Processing Apparatus
11/08/2007US20070259531 Method For Producing A Polished Semiconductor
11/08/2007US20070259530 Method for producing a layer structure
11/08/2007US20070259529 Forming integrated circuit devices
11/08/2007US20070259528 Method for Providing Mixed Stacked Structures, with Various Insulating Zones and/or Electrically Conductiong Zones Vertically Localized
11/08/2007US20070259527 Automatic process control of after-etch-inspection critical dimension
11/08/2007US20070259526 Surface finishing of SOI substrates using an EPI process
11/08/2007US20070259525 Cmp process
11/08/2007US20070259524 fine pattern in a semiconductor device includes forming a first polymer layer over an etch target layer, the first polymer layer including a carbon-rich polymer layer, forming a second polymer layer over the first polymer layer, the second polymer layer including a silicon-rich polymer layer, patterning
11/08/2007US20070259523 Method of fabricating high speed integrated circuits
11/08/2007US20070259522 Fabrication method of semiconductor integrated circuit device
11/08/2007US20070259521 Display substrate and method for manufacturing the same
11/08/2007US20070259520 Beveled trench forming device for concrete slab foundations
11/08/2007US20070259519 Interconnect metallization process with 100% or greater step coverage
11/08/2007US20070259518 Method and apparatus for diverting void diffusion in integrated circuit conductors
11/08/2007US20070259517 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects
11/08/2007US20070259516 Multilayer interconnect structure containing air gaps and method for making
11/08/2007US20070259515 Method for manufacturing wafer-level packages for flip chips capable of preventing adhesives from absorbing water
11/08/2007US20070259514 Interconnection Structure, Electronic Component and Method of Manufacturing the Same
11/08/2007US20070259513 Methods of forming contact openings
11/08/2007US20070259512 Method of manufacturing a semiconductor device
11/08/2007US20070259511 Method of implanting a substrate and an ion implanter for performing the method
11/08/2007US20070259510 Semiconductor device, semiconductor layer and production method thereof
11/08/2007US20070259509 Method of thinning a wafer
11/08/2007US20070259508 Method of fabricating microconnectors
11/08/2007US20070259507 Manufacturing method of semiconductor device
11/08/2007US20070259506 Probe Needle, Method for Manufacturing the Probe Needle and Method for Constructing a Three-Dimensional Structure
11/08/2007US20070259505 Non-volatile memory devices and methods for forming the same
11/08/2007US20070259504 Dislocation-specific lateral epitaxial overgrowth to reduce dislocation density of nitride films
11/08/2007US20070259503 Method of fabricating a semiconductor device
11/08/2007US20070259502 Parasitic particle suppression in growth of III-V nitride films using MOCVD and HVPE
11/08/2007US20070259501 Integrating high performance and low power multi-gate devices
11/08/2007US20070259500 Structure Having Isolation Structure Including Deuterium Within A Substrate And Related Method
11/08/2007US20070259499 Method for manufacturing semiconductor device having recess gate
11/08/2007US20070259498 Method of fabricating metal-oxide-semiconductor transistor
11/08/2007US20070259497 Fabricating method of non-volatile memory
11/08/2007US20070259496 Fabrication method of non-volatile memory
11/08/2007US20070259495 A non-volatile memory device including nitrogen pocket implants and methods for making the same
11/08/2007US20070259494 Methods for Forming Resistors Including Multiple Layers for Integrated Circuit Devices
11/08/2007US20070259493 Method of fabricating memeory
11/08/2007US20070259492 Method for forming storage node contacts in semiconductor device
11/08/2007US20070259491 Semiconductor device and method for fabricating the same
11/08/2007US20070259490 Structure and method for latchup suppression
11/08/2007US20070259489 Method of forming transistor structure having stressed regions of opposite types
11/08/2007US20070259488 Single layer construction for ultra small devices
11/08/2007US20070259487 Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film
11/08/2007US20070259486 Semiconductor device and method for manufacturing the same
11/08/2007US20070259485 Electronic device including semiconductor fins and a process for forming the electronic device
11/08/2007US20070259484 Integrated Circuit Chip Packaging Assembly
11/08/2007US20070259483 Sawing Apparatus and a Control Method for Manufacturing Processes of Semiconductor Package
11/08/2007US20070259482 Method and apparatus for stacking electrical components using via to provide interconnection
11/08/2007US20070259481 Process for fabricating chip package structure
11/08/2007US20070259480 System and method of attaching an integrated circuit assembly to a printed wiring board
11/08/2007US20070259479 Forming phase change memory arrays
11/08/2007US20070259474 Method for forming high-resolution pattern having desired thickness or high aspect ratio using deep ablation
11/08/2007US20070259473 Process to form tft gate dielectric with crosslinked polymer
11/08/2007US20070259472 Semiconductor photo-detector, semiconductor photo-detection device, and production method thereof
11/08/2007US20070259471 MEMS device including a laterally movable portion with piezo-resistive sensing elements and electrostatic actuating elements on trench side walls, and methods for producing the same
11/08/2007US20070259470 Method of Creating a Predefined Internal Pressure Within a Cavity of a Semiconductor Device
11/08/2007US20070259469 Liquid detection method and apparatus
11/08/2007US20070259468 Processing Piezoelectric Material
11/08/2007US20070259467 Fabrication of vertical sidewalls on (110) silicon substrates for use in si/sige photodetectors
11/08/2007US20070259466 Light Emitting Element and Manufacturing Method Thereof
11/08/2007US20070259465 Integration of vacuum microelectronic device with integrated circuit
11/08/2007US20070259464 Dislocation-specific dielectric mask deposition and lateral epitaxial overgrowth to reduce dislocation density of nitride films
11/08/2007US20070259463 Wafer-level method for thinning imaging sensors for backside illumination
11/08/2007US20070259462 Carbon nanotube structures and methods of manufacture and use
11/08/2007US20070259461 Semiconductor wafer examination method and semiconductor chip manufacturing method
11/08/2007US20070259460 Semiconductor wafer examination method and semiconductor chip manufacturing method
11/08/2007US20070259459 Semiconductor wafer examination method and semiconductor chip manufacturing method
11/08/2007US20070259458 Semiconductor wafer examination method and semiconductor chip manufacturing method
11/08/2007US20070259457 Optical endpoint detection of planarization
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