Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/21/2007EP1170793B1 Support matrix with a bonding channel for an integrated circuit and manufacturing method thereof
11/21/2007CN200979878Y A positioning device
11/21/2007CN200979877Y A silicon wafer transfer device
11/21/2007CN200977625Y Diamond circular saw blade for grinding crystal silicon
11/21/2007CN101076896A Method for forming substrate in bicmos technology
11/21/2007CN101076894A Semiconductor device and manufacturing method therefor
11/21/2007CN101076891A Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
11/21/2007CN101076889A Double-stress soi substrate
11/21/2007CN101076888A Semiconductor integrate circuit for forming double-metal complementary metal oxide
11/21/2007CN101076887A Electronic tag chip
11/21/2007CN101076886A Thermo-compression bonding tool and thermo-compression bonding device
11/21/2007CN101076885A Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate
11/21/2007CN101076884A Semiconductor device and production method therefor, wiring board and production method therefor, semiconductor package and electronic apparatus
11/21/2007CN101076883A Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
11/21/2007CN101076882A Bidirectional field-effect transistor and matrix converter
11/21/2007CN101076881A Using laser annealing to process solid phase extension recrystalizing
11/21/2007CN101076880A Method and apparatus for forming single layer nanometer structure and apparatus comprising the said single layer
11/21/2007CN101076879A 等离子体掺杂方法 Plasma doping method
11/21/2007CN101076878A Apparatus and method for thin film deposition
11/21/2007CN101076877A Substrate holding apparatus, exposure apparatus and device manufacturing method
11/21/2007CN101076876A Temperature regulation method and system for low flow rate liquid
11/21/2007CN101076759A Cleaning liquid for lithography and method for resist pattern formation
11/21/2007CN101076456A Method and device for regulating a set of plasma treatment step
11/21/2007CN101076220A 电感耦合等离子体处理装置和等离子体处理方法 Apparatus and plasma processing method of inductively coupled plasma processing
11/21/2007CN101076219A Decoupling reactive ion etching chamber containing multiple processing platforms
11/21/2007CN101075659A Method for manufacturing film transistor and film transistor and display device
11/21/2007CN101075650A Light-emitting diodes for crystal-coated package and its production
11/21/2007CN101075648A Method for radiating, packing and forming light-emitting diodes
11/21/2007CN101075642A Thin film transistor, method of manufacturing the thin film transistor, and display substrate having the thin film transistor
11/21/2007CN101075639A Semiconductor device and fabricating method thereof
11/21/2007CN101075638A Semiconductor device and method for fabricating the same
11/21/2007CN101075637A Field effect transistor based on borate-carbon-nitrogen nano-material and its production
11/21/2007CN101075636A Ferroelectric field effect transistor based on semiconductor nano-material and its production
11/21/2007CN101075634A Light emitting device and method of manufacturing the same
11/21/2007CN101075633A Flat panel display device and method for fabricating same
11/21/2007CN101075632A Phase change memory cell employing a gebite layer as a phase change material layer, phase change memory device including the same, electronic system including the same and method of fabricating the sa
11/21/2007CN101075630A Phase change memory device and manufacturing method
11/21/2007CN101075629A Nonvolatile memory device using oxygen-deficient metal oxide layer and method of manufacturing the same
11/21/2007CN101075625A Solid-state imaging device
11/21/2007CN101075624A Structure and method for packing crystal-coated viewfinder module
11/21/2007CN101075623A Picture pixel structure and its formation
11/21/2007CN101075622A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/21/2007CN101075621A Semiconductor device and its manufacturing method
11/21/2007CN101075620A Non-volatile memory integrated circuit device and method of fabricating the same
11/21/2007CN101075618A Nonvolatile memory unit array
11/21/2007CN101075617A Semiconductor component and method for manufacturing the same
11/21/2007CN101075616A Wire-type semiconductor device and method of fabricating the same
11/21/2007CN101075615A Semiconductor structure and method for manufacturing the same
11/21/2007CN101075613A Semiconductor device with pad switch
11/21/2007CN101075612A Light emitting device and method for fabricating the same
11/21/2007CN101075610A Semiconductor component and method for forming the same
11/21/2007CN101075609A Structure and method for packing LED chip
11/21/2007CN101075604A Structure and method for packing infrared receiving mould set and surface-adhered mould set
11/21/2007CN101075603A Structure and method for packing videwfinding mould set
11/21/2007CN101075596A Piled semiconductor packing structure and its production
11/21/2007CN101075595A Semiconductor wafer welding material projected block structure and its production
11/21/2007CN101075594A Semiconductor chip, method for manufacturing semiconductor chip and package of semiconductor chip
11/21/2007CN101075591A Chip packing structure, chip structure and method for forming chip
11/21/2007CN101075589A Structure and method for constructing air-tight microelectronic component
11/21/2007CN101075588A Semiconductor structure, semiconductor chip and manufacturing method thereof
11/21/2007CN101075587A Structure and method for packing semiconductor
11/21/2007CN101075586A Semiconductor component and its production
11/21/2007CN101075585A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
11/21/2007CN101075584A Method of manufacturing LCD apparatus by using halftone exposure method
11/21/2007CN101075583A Method for producing active component array base plate
11/21/2007CN101075582A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
11/21/2007CN101075581A Integrated field-effect transistor and schottky component and manufacturing method thereof
11/21/2007CN101075580A Method for cutting crystal wafer
11/21/2007CN101075579A Conducting-wire structure, pixel structure, display panel, photoelectric device and its forming method
11/21/2007CN101075578A Manufacturing method for integrated circuit
11/21/2007CN101075577A Method of manufacturing semiconductor device
11/21/2007CN101075576A Method for manufacturing semiconductor device
11/21/2007CN101075575A Method for forming connecting hole with high depth and width ratio
11/21/2007CN101075574A Method for producing shallow groove isolating structure of high-voltage assembly
11/21/2007CN101075573A Insulator with silica structure and manufacturing method thereof
11/21/2007CN101075572A Device clamp for reducing oxidation in wire bonding
11/21/2007CN101075571A Carrying tool, semiconductor device and transfer interface system
11/21/2007CN101075570A Inspection method of compound semiconductor substrate, compound semiconductor substrate, surface treatment method of compound semiconductor substrate, and method of producing compound semiconductor cr
11/21/2007CN101075569A Method for loading bonding parameter
11/21/2007CN101075568A Packing component of semiconductor and its production
11/21/2007CN101075567A Structure for connecting circuit set on surface of electronic device
11/21/2007CN101075566A Packer of semiconductor and its production
11/21/2007CN101075565A Packer of semiconductor and its production
11/21/2007CN101075564A Method for producing semiconductor structure of thin-film transistor and planar display device
11/21/2007CN101075563A Structure and method for forming semiconductor component
11/21/2007CN101075562A Method for manufacturing transistor structure
11/21/2007CN101075561A Method for producing non-volatile memory
11/21/2007CN101075560A Method for manufacturing semiconductor
11/21/2007CN101075559A Method of thin wafer
11/21/2007CN101075558A Method of silicon slices
11/21/2007CN101075557A Method for producing grid and etching conductive layer
11/21/2007CN101075556A Method for growing semiconductor crystal with third-family nitride as material on silicon substrate and its device
11/21/2007CN101075555A System for displaying image and method for laser annealing cryogenic polycrystalline silicon
11/21/2007CN101075554A Manufacturing method of semiconductor device
11/21/2007CN101075553A Substrate processing method and substrate processing apparatus
11/21/2007CN101075552A Method of removing ion implanted photoresist
11/21/2007CN101075551A Processing equipment assembly
11/21/2007CN101075550A Corrosion resistant member
11/21/2007CN101075549A Marking pen design for optical microscope
11/21/2007CN101075545A Electrostatic chuck device for cleaning ion implanter
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