Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/22/2007WO2007133292A2 Synchronous data commnication
11/22/2007WO2007133288A1 Sensing devices from molecular electronic devices utilizing hexabenzocoronenes
11/22/2007WO2007133277A2 Ballistic ranging methods and systems for inclined shooting
11/22/2007WO2007133276A2 In vivo autonomous camera with on-board data storage or digital wireless transmission
11/22/2007WO2007133011A1 Method and apparatus for detecting in-plane position in a planar stage by measuring air gap displacement
11/22/2007WO2007132933A1 Method for producing polishing composition
11/22/2007WO2007132913A1 Method of measuring nitrogen content, method of forming silicon oxynitride film and process for producing semiconductor device
11/22/2007WO2007132887A1 Film forming method and film forming apparatus
11/22/2007WO2007132884A1 Semiconductor device manufacturing method and substrate processing apparatus
11/22/2007WO2007132881A1 Double sided adhesive tape for fixing polishing pad
11/22/2007WO2007132880A1 Image binarizing method, image processing device, and computer program
11/22/2007WO2007132879A1 Semiconductor device, semiconductor device manufacturing method and semiconductor manufacturing apparatus
11/22/2007WO2007132862A1 Projection optical system, exposure method, exposure apparatus, and method for manufacturing device
11/22/2007WO2007132855A1 Polishing pad
11/22/2007WO2007132854A1 Polishing pad
11/22/2007WO2007132845A1 Organic semiconductor device and method for manufacturing same
11/22/2007WO2007132824A1 Heating apparatus
11/22/2007WO2007132758A1 Substrate treating method, program, computer-readable storage medium, and substrate treating system
11/22/2007WO2007132757A1 Cleaning method and vacuum processing apparatus
11/22/2007WO2007132711A1 Top-flange protective cover for container for receiving thin plate, and container for receiving thin plate, using the same
11/22/2007WO2007132700A1 Pattern forming method
11/22/2007WO2007132698A1 Reticle case
11/22/2007WO2007132644A1 Method of selectively forming atomically flat plane on diamond surface, diamond substrate produced by the method, and semiconductor element employing the same
11/22/2007WO2007132637A1 Apparatus for adhering adhesive tape
11/22/2007WO2007132619A1 Imaging optical system, exposure system, and device production method
11/22/2007WO2007132610A1 Exposure apparatus
11/22/2007WO2007132609A1 Substrate processing method, substrate processing apparatus and recording medium
11/22/2007WO2007132508A1 Illumination device
11/22/2007WO2007132483A1 Igbt transistor with protection against parasitic component activation and manufacturing process thereof
11/22/2007WO2007132320A2 Template having a varying thickness
11/22/2007WO2007132266A1 Improvements in semiconductor processing
11/22/2007WO2007131867A1 Dual wired integrated circuit chips
11/22/2007WO2007131635A1 Method and device for processing a semiconductor wafer by etching
11/22/2007WO2007131547A1 Semiconductor control device for a cvd or rtp process
11/22/2007WO2007131334A1 Multi-pixel light emitting module
11/22/2007WO2007112261A3 Semiconductor device made by multiple anneal of stress inducing layer
11/22/2007WO2007112181A3 Method of monitoring a semiconductor processing system using a wireless sensor network
11/22/2007WO2007111830A3 Different transistor gate oxides in an integrated circuit
11/22/2007WO2007109485A3 Method for forming ultra thin low leakage multigate devices
11/22/2007WO2007101099A3 High-throughput printing of chalcogen layer and the use of an inter-metallic material
11/22/2007WO2007100787A9 Nanoparticles having sub-nanometer features
11/22/2007WO2007098236A3 Contact formation
11/22/2007WO2007093741A3 Mos transistor with adjustable threshold
11/22/2007WO2007092868A3 Method for preparing a metal feature surface prior to electroless metal deposition
11/22/2007WO2007092800A3 Low ph post-cmp residue removal composition and method of use
11/22/2007WO2007087127A3 Introduction of metal impurity to change workfunction of conductive electrodes
11/22/2007WO2007085996A3 Mos device and method of fabricating a mos device
11/22/2007WO2007064342A3 Phosphor deposition method and apparatus
11/22/2007WO2007054844A3 Vertical insulated gate field-effect transistor and method of manufacturing the same
11/22/2007WO2007050471A3 Method for forming solder contacts on mounted substrates
11/22/2007WO2007040856A3 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system
11/22/2007WO2007024720A3 Pretreatment processes within a batch ald reactor
11/22/2007WO2007024465A3 Aluminum sputtering while biasing wafer
11/22/2007WO2007022275A3 Siox:si sputtering targets and method of making and using such targets
11/22/2007WO2007008811A3 High speed substrate aligner apparatus
11/22/2007WO2007005438A3 Apparatuses and methods for detecting defects in semiconductor workpieces
11/22/2007WO2006135548A3 Method of forming an interlayer dielectric
11/22/2007WO2006130623A3 Defect reduction of non-polar and semi-polar iii-nitrides with sidewall lateral epitaxial overgrowth (sleo)
11/22/2007WO2006099102A3 Power semiconductor package
11/22/2007WO2006076210A3 Systems and methods for producing white-light light emitting diodes
11/22/2007WO2006060757A3 Eliminating printability of sub-resolution defects in imprint lithography
11/22/2007WO2006057829A3 Scratch resistant coated article and method of making
11/22/2007WO2006038975A3 Method and system for improving coupling between a surface wave plasma source and a plasma space
11/22/2007WO2006028731A3 Multiple-depth sti trenches in integrated circuit fabrication
11/22/2007WO2005076871A3 Lapping composition and method using same
11/22/2007WO2005070009A3 Enhancement mode iii-nitride fet
11/22/2007WO2005055276A3 Apparatus and method for inducing electrical property changes in carbon nanotubes
11/22/2007WO2004077529A3 Edge bead removal for spin-on materials containing low volatility solvents using carbon dioxide cleaning
11/22/2007WO2002063069A3 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
11/22/2007WO2000007220A3 Wet processing methods for the manufacture of electronic components using ozonated process fluids
11/22/2007US20070271057 Inspection method of semiconductor integrated circuit and semiconductor
11/22/2007US20070270089 Polishing device
11/22/2007US20070270087 Polishing device and method
11/22/2007US20070270086 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
11/22/2007US20070269994 Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
11/22/2007US20070269993 Method for forming poly-silicon film
11/22/2007US20070269992 Compressive nitride film and method of manufacturing thereof
11/22/2007US20070269991 Semiconductor nanocrystal-metal complex and method of preparing the same
11/22/2007US20070269990 Method of removing ion implanted photoresist
11/22/2007US20070269989 Inspection method of compound semiconductor substrate, compound semiconductor substrate, surface treatment method of compound semiconductor substrate, and method of producing compound semiconductor crystal
11/22/2007US20070269988 Method for forming contact opening
11/22/2007US20070269987 Polishing Liquid for Cmp Process and Polishing Method
11/22/2007US20070269986 Method, apparatus and system for use in processing wafers
11/22/2007US20070269985 Two-step chemical mechanical polishing process
11/22/2007US20070269984 Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate
11/22/2007US20070269983 Ald Apparatus and Method
11/22/2007US20070269982 Method and device to vary growth rate of thin films over semiconductor structures
11/22/2007US20070269981 Electroless treatment of noble metal barrier and adhesion layer
11/22/2007US20070269980 Methods for reducing contamination of semiconductor devices and materials during wafer processing
11/22/2007US20070269979 Method of forming a pattern and method of manufacturing a semiconductor device using the same
11/22/2007US20070269978 Process for improving copper line cap formation
11/22/2007US20070269977 Method of forming a multilayer wiring by the use of copper damascene technique
11/22/2007US20070269976 Method of manufacturing semiconductor device
11/22/2007US20070269975 System and method for removal of photoresist and stop layer following contact dielectric etch
11/22/2007US20070269974 Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer
11/22/2007US20070269973 Method of providing solder bumps using reflow in a forming gas atmosphere
11/22/2007US20070269972 Method of manufacturing a semiconductor device
11/22/2007US20070269971 Method for manufacturing semiconductor device
11/22/2007US20070269970 Structure and method for forming cmos devices with intrinsically stressed silicide using silicon nitride cap
11/22/2007US20070269969 Semiconductor structure pattern formation
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