| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/13/2007 | US20070284602 Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management |
| 12/13/2007 | US20070284599 Process for producing group III nitride semiconductor stacked structure |
| 12/13/2007 | US20070284587 Flexible electronic device and production method of the same |
| 12/13/2007 | US20070284583 Semiconductor device and method of manufacturing the same |
| 12/13/2007 | US20070284581 Method of fabricating pmos thin film transistor |
| 12/13/2007 | US20070284579 Strained Si formed by anneal |
| 12/13/2007 | US20070284577 Semiconductor device including fuses and method of cutting the fuses |
| 12/13/2007 | US20070284576 Semiconductor circuit arrangement and associated method for temperature detection |
| 12/13/2007 | US20070284573 Gate controlled field emission triode and process for fabricating the same |
| 12/13/2007 | US20070284569 Charge Coupled Device |
| 12/13/2007 | US20070284567 Polarization recycling devices and methods |
| 12/13/2007 | US20070284526 Inspection apparatus for circuit pattern |
| 12/13/2007 | US20070284409 Highly compliant plate for wafer bonding |
| 12/13/2007 | US20070284338 Chemical mechanical polishing method |
| 12/13/2007 | US20070284044 Method and apparatus for measuring electron density of plasma and plasma processing apparatus |
| 12/13/2007 | US20070283888 Plasma Reactor for the Treatment of Large Size Substrates |
| 12/13/2007 | US20070283887 Microwave Plasma Processing Apparatus |
| 12/13/2007 | US20070283886 Apparatus for integration of barrier layer and seed layer |
| 12/13/2007 | US20070283591 EUV-lithography apparatus having a chamber for cleaning an optical element |
| 12/13/2007 | DE60219034T2 Vorrichtungen zum abtrennen von substraten und zugehörige verfahren Procedural devices to separate from substrates and related |
| 12/13/2007 | DE4413821B4 Phasenschiebemaske und Verfahren zu deren Herstellung Phase-shifting mask and a process for their preparation |
| 12/13/2007 | DE112006000274T5 Filmbildungsvorrichtung, Filmbildungsverfahren, Herstellungsverfahren und Titanfilm Film forming apparatus, film forming method, manufacturing method, and titanium film |
| 12/13/2007 | DE112006000261T5 Verfahren zur Herstellung eines kapazitiven Elements und Ätzverfahren Process for the preparation of a capacitive element and etching |
| 12/13/2007 | DE10326351B4 Vorrichtung mit Elektroden für die Bildung einer Kugel am Ende eines Drahts Apparatus with electrodes for the formation of a ball at the end of a wire |
| 12/13/2007 | DE10258761B4 Verfahren zur Herstellung eines Kontaktlochs A process for producing a contact hole |
| 12/13/2007 | DE10240921B4 Verfahren und Anordnung zum selektiven Metallisieren von 3-D-Strukturen Method and apparatus for selective metallization of 3-D structures |
| 12/13/2007 | DE10222959B4 Mikro-elektromechanisches Bauelement und Verfahren zur Herstellung von mikro-elektromechanischen Bauelementen Micro-electro-mechanical device and method for the production of micro-electro-mechanical components |
| 12/13/2007 | DE102007026365A1 Semiconductor device e.g. diode, for use in module, has conducting layer having concentration of silicon that changes over depth so that concentration is reduced in depth between surfaces contacting substrate and other conducting layer |
| 12/13/2007 | DE102006056990A1 Langlebiges Graphitverbindungselement und Verfahren zum Herstellen desselben Of the same durable graphite connecting element and method for producing |
| 12/13/2007 | DE102006048752A1 Verfahren zum Herstellen von Vorrichtungen, Positionierungsverfahren, Dicingverfahren und Dicingvorrichtung A method for making devices, positioning method, and dicing Dicingvorrichtung |
| 12/13/2007 | DE102006027880A1 Isolationsschichtmaterial für die Mikroelektronik Insulation layer material for microelectronics |
| 12/13/2007 | DE102006027283A1 Semiconductor component producing method, involves applying wiring structure with conductive strips and contact connection surfaces on upper side of carrier wafer, and applying semiconductor chips on upper side of carrier wafer |
| 12/13/2007 | DE102006026528A1 Solar cell or silicon wafer`s mono or polycrystalline silicon slices checking device, has drive arm highly movable and arranged at two locating pins, and retaining plate guided over equalizing springs at fastening plate |
| 12/13/2007 | DE102006026467A1 Wafer sharpening device, has sharpening element for sharpening part of wafer surface and wafer contact element that is arranged such that it deeply moves another part of wafer surface, if sharpening element sharpens former part |
| 12/13/2007 | DE102006026331A1 Wafers adjusting device, has two holding devices fixed relative to each other, where one of holding devices has gel foil for holding associated wafer, and clamping units provided relative to each other for fixing holding devices |
| 12/13/2007 | DE102006025959A1 Leistungshalbleiteranordnung mit gelöteter Clip-Verbindung und Verfahren zur Herstellung einer solchen A power semiconductor device with brazed clip connection and methods for producing such |
| 12/13/2007 | DE102006025903A1 Process control for producing electronic and micro mechanical components, involves automatic initial adjustment of parameter set at working station, where batch of micro-mechanical components is formed at working station |
| 12/13/2007 | DE102006025865A1 Element e.g. substrate, bonding method, involves applying liquid glass solder or glass solder suspension on one of elements, where sealing glass suspension is utilized as glass solder sealing glass or glass solder suspension |
| 12/13/2007 | DE102006025671A1 Verfahren zur Herstellung von dünnen integrierten Halbleitereinrichtungen A process for the production of thin semiconductor integrated devices |
| 12/13/2007 | DE102006025553A1 Verfahren zum Herstellen einer elektronischen Baueinheit, zugehörige Baueinheit und Baugruppe mit mindestens einer solchen Baueinheit A method of manufacturing an electronic assembly, and related assembly module having at least one such assembly |
| 12/13/2007 | DE102006023167B3 Bonddraht, Herstellungsverfahren für einen Bonddraht und Wedge-Wedge-Drahtbondverfahren Bonding wire, manufacturing method of a bonding wire and wedge-wedge wire bonding method |
| 12/13/2007 | DE102005052798B4 Anordnung mit Leistungshalbleitermodulen und mit Vorrichtung zu deren Positionierung sowie Verfahren zur Oberflächenbehandlung der Leistungshalbleitermodule Arrangement with power semiconductor modules and apparatus for its positioning as well as method for surface treatment of the power semiconductor modules |
| 12/13/2007 | DE102004036520B4 Bauelementanordnung mit einer Auswerteschaltung zur Detektion eines Verschleißes von Anschlussverbindungen und Verfahren zur Detektion eines Verschleißes von Anschlussverbindungen The component arrangement having an evaluation circuit for the detection of wear of terminal compounds and methods for the detection of wear of connections |
| 12/13/2007 | DE102004024924B4 Verfahren zum Herstellen polykristallinen Siliciums, Verfahren zum Herstellen einer Ausrichtungsmarkierung, sowie Verfahren zum Herstellen eines Schaltelements A method for producing polycrystalline silicon, methods of making an alignment mark, as well as methods for producing a switching element |
| 12/13/2007 | DE10129954B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 12/13/2007 | DE10124144B4 Verfahren zur Eliminierung morphologischer und kristallografischer Defekte in Halbleiteroberflächen Method for eliminating morphological and crystallographic defects in semiconductor surfaces |
| 12/12/2007 | EP1865714A1 Drive method for driving element having capacity impedance, drive device, and imaging device |
| 12/12/2007 | EP1865554A1 Semiconductor memory device and method for operation |
| 12/12/2007 | EP1865551A2 Method of limiting lacunary distribution in a heterostructure |
| 12/12/2007 | EP1865550A1 Flip chip mounting method and method for connecting substrates |
| 12/12/2007 | EP1865549A1 Flip chip mounting method and bump forming method |
| 12/12/2007 | EP1865548A1 Method for producing silicon oxide film, control program thereof, recording medium and plasma processing apparatus |
| 12/12/2007 | EP1865547A1 Ashing apparatus, ashing method, and impurity doping apparatus |
| 12/12/2007 | EP1865546A1 Abrasive for semiconductor integrated circuit device, method of polishing therewith and process for producing semiconductor integrated circuit device |
| 12/12/2007 | EP1865545A1 Adhesive tape for wafer dicing and chip manufacturing method using same |
| 12/12/2007 | EP1865544A1 Plasma doping method and apparatus |
| 12/12/2007 | EP1865543A1 Structure and manufacturing method of epitaxial layers of gallium nitride-based compound semiconductors |
| 12/12/2007 | EP1865542A1 Exposure apparatus, exposure method, and device production method |
| 12/12/2007 | EP1865541A1 Exposure method, exposure apparatus and device manufacturing method |
| 12/12/2007 | EP1865540A1 Exposure apparatus, exposure method, and device producing method |
| 12/12/2007 | EP1865539A1 Method for determining exposure conditions, exposure method, exposure device, and apparatus for producing device |
| 12/12/2007 | EP1865538A1 Multi-column electron beam exposure device |
| 12/12/2007 | EP1865537A1 Impurity introduction apparatus and method of impurity introduction |
| 12/12/2007 | EP1865536A2 Peeling tape adhering method and peeling tape adhering device |
| 12/12/2007 | EP1865535A2 Workpiece processing device |
| 12/12/2007 | EP1865381A1 Exposure apparatus, method for manufacturing exposure apparatus, and method for manufacturing microdevice |
| 12/12/2007 | EP1865093A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| 12/12/2007 | EP1865090A1 Deep-pot-shaped copper sputtering target and process for producing the same |
| 12/12/2007 | EP1864991A1 Organic ligands for semiconductor nanocrystals |
| 12/12/2007 | EP1864952A1 Crystallized glass, and method for producing crystallized glass |
| 12/12/2007 | EP1864743A1 Assembly and method of assembly by brazing of an object and a support |
| 12/12/2007 | EP1864337A1 Group iii nitride white light emitting diode |
| 12/12/2007 | EP1864332A2 Semiconductor power device and corresponding manufacturing process |
| 12/12/2007 | EP1864322A1 Side wall pore sealing for low-k dielectrics |
| 12/12/2007 | EP1864321A1 Method of manufacturing a semiconductor device having a buried doped region |
| 12/12/2007 | EP1864320A2 Integrated circuit fabrication |
| 12/12/2007 | EP1864319A2 Method of producing highly strained pecvd silicon nitride thin films at low temperature |
| 12/12/2007 | EP1864318A2 Asymmetric bidirectional transient voltage suppressor and method of forming same |
| 12/12/2007 | EP1864317A1 Hybrid fully soi-type multilayer structure |
| 12/12/2007 | EP1864186A2 Positive photoresist composition, thick film photoresist laminate, method for producing thick film resist pattern, and method for producing connecting terminal |
| 12/12/2007 | EP1864094A1 Transistor layout configuration for tight-pitched memory array lines |
| 12/12/2007 | EP1863874A1 Resin compositions and methods of use thereof |
| 12/12/2007 | EP1695383A4 Bipolar and cmos integration with reduced contact height |
| 12/12/2007 | EP1689657A4 Photochromic substrate container |
| 12/12/2007 | EP1637892B1 Electronic component handling device, and method for temperature application in electronic component handling device |
| 12/12/2007 | EP1560280B1 Thin film multilayer body, electronic device using such thin film multilayer body, actuator, and method for manufacturing actuator |
| 12/12/2007 | EP1559135A4 Heater module of rapid thermal processing apparatus |
| 12/12/2007 | EP1516358B1 Device for picking ic's from a wafer |
| 12/12/2007 | EP1493179B1 Silicon wafer and process for controlling denuded zone depth in an ideal oxygen precipitating silicon wafer |
| 12/12/2007 | EP1470570A4 Semiconductor component handling device having an electrostatic dissipating film |
| 12/12/2007 | EP1412453A4 Process for removing contaminant from a surface and composition useful therefor |
| 12/12/2007 | EP1405140A4 Resist compositions with polymers having 2-cyano acrylic monomer |
| 12/12/2007 | EP1386333A4 Capacitor having improved electrodes |
| 12/12/2007 | EP1356500B1 Pod load interface equipment adapted for implementation in a fims system |
| 12/12/2007 | EP1277222A4 Uniform charged particle exposure device and method using translatable stage and faraday cup |
| 12/12/2007 | EP1224692B1 Method for manufacturing a capacitor by forming a silicon electrode having hemispherical silicon grains |
| 12/12/2007 | EP1222056B1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 12/12/2007 | EP1146555B1 Production method for a semiconductor device |
| 12/12/2007 | EP1114440B1 Device and method for handling individual wafers |
| 12/12/2007 | EP1030369B1 Multichip module structure and method for manufacturing the same |