Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/13/2007US20070287210 Method for assembling a semiconductor laser module
12/13/2007US20070287209 Method for manufacturing light-emitting device
12/13/2007US20070287207 Method for manufacturing semiconductor device
12/13/2007US20070287206 Method for Manufactuing a Semiconductor Integrated Circuit Device
12/13/2007US20070287205 Method of measuring minority carrier diffusion length and method of manufacturing silicon wafer
12/13/2007US20070287204 A method for locating a sub-surface feature using a scatterometer
12/13/2007US20070287203 Method and system of beam energy control
12/13/2007US20070287202 Method for Producing Nano-Scale Low-Dimensional Quantum Structure, and Method for Producing Integrated Circuit Using the Method for Producing the Structure
12/13/2007US20070287201 Power Supply Regulating Apparatus, Semiconductor Manufacturing Apparatus, Method For Controlling Power To Heater, And Method For Manufacturing Semiconductor Device
12/13/2007US20070287200 Variable overlap of dummy shapes for improved rapid thermal anneal uniformity
12/13/2007US20070287199 Base oxide engineering for high-K gate stacks
12/13/2007US20070287102 Pattern formation method
12/13/2007US20070287078 Reticle, semiconductor die and method of manufacturing semiconductor device
12/13/2007US20070287076 Extreme Ultraviolet; stress compensation layer between substrate and reflection layer; for fine semiconductor device photolithography; precision; molybdenum and silicon films; silicon wafers
12/13/2007US20070287011 Incorporation of functionalizing molecules in nanopatterned epitaxial graphene electronics
12/13/2007US20070286985 Ceramic Block With Built in Electrode and Method of Manufacture Thereof
12/13/2007US20070286952 Method and Structure of Strain Control of Sige Based Photodetectors and Modulators
12/13/2007US20070286712 Workpiece stocker with circular configuration
12/13/2007US20070286711 Carrier unit of substrate transfer apparatus
12/13/2007US20070286710 Semiconductor manufacturing process modules
12/13/2007US20070286709 Heat treatment apparatus, heat treatment method, and recording medium recording program for practicing the method
12/13/2007US20070286550 Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof
12/13/2007US20070285991 Semiconductor memory
12/13/2007US20070285984 Data processing device
12/13/2007US20070285983 Semiconductor memory device and manufacturing method of the same
12/13/2007US20070285962 Phase change memory device and fabrication method thereof
12/13/2007US20070285869 Method of determining the correct average bias compensation voltage during a plasma process
12/13/2007US20070285640 Exposure apparatus and method
12/13/2007US20070285635 Exposure apparatus, removal method, and device manufacturing method
12/13/2007US20070285592 System for displaying image and laser annealing method for ltps
12/13/2007US20070285584 Method of forming resistance film and image display device thereby
12/13/2007US20070285543 Solid-state imaging device and method of manufacturing the same
12/13/2007US20070285254 Wireless Ic Tag and Method for Manufacturing Same
12/13/2007US20070285146 Semiconductor device with pump circuit
12/13/2007US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
12/13/2007US20070284759 Method For Producing Sheet With Ic Tags, Apparatus For Producing Sheet With Ic Tags, Sheet With Ic Tags, Method For Fixing Ic Chips, Apparatus For Fixing Ic Chips, And Ic Tag
12/13/2007US20070284755 Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
12/13/2007US20070284754 Power MOSFET contact metallization
12/13/2007US20070284753 Top layers of metal for high performance IC's
12/13/2007US20070284752 Top layers of metal for high performance IC's
12/13/2007US20070284751 Top layers of metal for high performance IC's
12/13/2007US20070284750 Top layers of metal for high performance IC's
12/13/2007US20070284749 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same
12/13/2007US20070284746 Nano-electrode-array for integrated circuit interconnects
12/13/2007US20070284744 Apparatus for an improved air gap interconnect structure
12/13/2007US20070284739 Top layers of metal for high performance IC's
12/13/2007US20070284738 Wiring board method for manufacturing the same, and semiconductor device
12/13/2007US20070284729 Semiconductor structure and method for forming the same
12/13/2007US20070284728 Flip-chip bonding structure using multi chip module-deposited substrate
12/13/2007US20070284726 Integrated circuit package system with post-passivation interconnection and integration
12/13/2007US20070284722 Semiconductor device package utilizing proud interconnect material
12/13/2007US20070284717 Device embedded with semiconductor chip and stack structure of the same
12/13/2007US20070284716 Assembly Having Stacked Die Mounted On Substrate
12/13/2007US20070284714 Electronic Part And Method Of Producing The Same
12/13/2007US20070284712 Semiconductor integrated circuit device, and method of designing and manufacturing the same
12/13/2007US20070284710 Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
12/13/2007US20070284709 Semiconductor Device with Improved High Current Performance
12/13/2007US20070284702 Semiconductor device having a bonding pad and fuse and method for forming the same
12/13/2007US20070284701 Method of Forming a Component Having Dielectric Sub-Layers
12/13/2007US20070284699 Microfabricated Devices and Method for Fabricating Microfabricated Devices
12/13/2007US20070284696 Nitride Semiconductor Substrate
12/13/2007US20070284695 Apparatus and method for controlled particle beam manufacturing
12/13/2007US20070284694 Method of controlling grain size in a polysilicon layer and in semiconductor devices having polysilicon structure
12/13/2007US20070284684 Semiconductor device, magnetic sensor, and magnetic sensor unit
12/13/2007US20070284682 Mems process and device
12/13/2007US20070284681 Apparatus and method for protective covering of microelectromechanical system (mems) devices
12/13/2007US20070284680 Method for manufacturing semiconductor device and semiconductor device using the same
12/13/2007US20070284678 Methods of Manufacturing Metal-Silicide Features
12/13/2007US20070284677 Metal oxynitride gate
12/13/2007US20070284676 Semiconductor Device Having Multiple Work Functions and Method of Manufacture Therefor
12/13/2007US20070284672 Current limiting mosfet structure for solid state relays
12/13/2007US20070284671 Semiconductor device including cmis transistor
12/13/2007US20070284670 Semiconductor device and fabrication method therefor
12/13/2007US20070284668 CMOS S/D SiGe DEVICE MADE WITH ALTERNATIVE INTEGRATION PROCESS
12/13/2007US20070284661 Semiconductor memory device and method of manufacturing the same
12/13/2007US20070284659 Method of forming high voltage n-ldmos transistors having shallow trench isolation region with drain extensions
12/13/2007US20070284658 Laterally Diffused Metal Oxide Semiconductor Device and Method of Forming the Same
12/13/2007US20070284657 Semiconductor device having trench-type gate and its manufacturing method capable of simplifying manufacturing steps
12/13/2007US20070284656 Conductive hard mask to protect patterned features during trench etch
12/13/2007US20070284655 Semiconductor device and method for fabricating the same
12/13/2007US20070284651 Charge-trap type non-volatile memory devices and related methods
12/13/2007US20070284650 Memory device and a method of forming a memory device
12/13/2007US20070284649 Semiconductor device and method of manufacturing same
12/13/2007US20070284648 Non-volatile memory device and method of manufacturing the same
12/13/2007US20070284647 Semiconductor device and method of fabricating the same
12/13/2007US20070284645 Non-volatile memory devices having a multi-layered charge storage layer and methods of forming the same
12/13/2007US20070284643 Capacitor structure of semiconductor memory and method for preparing the same
12/13/2007US20070284642 Dielectric memory and manufacturing method thereof
12/13/2007US20070284641 Metal-insulator-metal-structured capacitor formed with polysilicon
12/13/2007US20070284639 Transistor and Method for Manufacturing the Same
12/13/2007US20070284638 Conductive container structures having a dielectric cap
12/13/2007US20070284636 Semiconductor memory device and method for fabricating the same
12/13/2007US20070284634 Semiconductor device and method of manufacturing the same
12/13/2007US20070284633 Curled semiconductor transistor
12/13/2007US20070284619 Semiconductor integrated circuit device
12/13/2007US20070284614 Ohmic contacts for semiconductor devices
12/13/2007US20070284613 Strain-inducing semiconductor regions
12/13/2007US20070284610 Switching Device, Drive And Manufacturing Method For The Same, Integrated Circuit Device And Memory Device
12/13/2007US20070284608 Reduction of dopant loss in a gate structure
12/13/2007US20070284607 Semiconductor Light Emitting Device Including Porous Layer
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