Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/20/2007US20070290300 Semiconductor device and method for manufacturing same
12/20/2007US20070290299 Laser Processing Method And Semiconductor Chip
12/20/2007US20070290296 Fuse Structures and Methods of Forming the Same
12/20/2007US20070290295 Integrated circuit fuse structures including spatter shields and methods of forming the same
12/20/2007US20070290283 Solar cell and manufacturing method thereof
12/20/2007US20070290280 Semiconductor device having silicide thin film and method of forming the same
12/20/2007US20070290279 Semiconductor device including groove pattern around effective chip and method for fabricating the same
12/20/2007US20070290275 Semiconductor integrated circuit device having deposited layer for gate insulation
12/20/2007US20070290269 Device with gates configured in loop structures
12/20/2007US20070290268 Method of fabricating semiconductor device
12/20/2007US20070290264 Semiconductor device and a method of manufacturing the same
12/20/2007US20070290263 Semiconductor device and method for manufacturing the same
12/20/2007US20070290260 Trench Type Mosfet And Method Of Fabricating The Same
12/20/2007US20070290259 Method for manufacturing a semiconductor device including an impurity-doped silicon film
12/20/2007US20070290258 Field effect transistors including source/drain regions extending beneath pillars
12/20/2007US20070290255 Source lines for NAND memory devices
12/20/2007US20070290252 Programmable memory device, integrated circuit including the programmable memory device, and method of fabricating same
12/20/2007US20070290250 Multiple dielectric finfet structure and method
12/20/2007US20070290247 Method of Forming Gate Insulating Film, Semiconductor Device and Computer Recording Medium
12/20/2007US20070290246 Image Sensor and Image Sensor Integrated Type Active Matrix Type Display Device
12/20/2007US20070290244 Method for processing a scratched surface, particularly a glass plate of a semiconductor wafer
12/20/2007US20070290243 Ultrashallow photodiode using indium
12/20/2007US20070290241 Solid state image pickup device and manufacturing method thereof
12/20/2007US20070290240 Semiconductor device and method of manufacturing the semiconductor device
12/20/2007US20070290239 Method of fabricating semiconductor device
12/20/2007US20070290233 Reprogrammable Fuse Structure and Method
12/20/2007US20070290231 Method of manufacturing a bipolar transistor and bipolar transistor thereof
12/20/2007US20070290230 Nitride Semiconductor Device And Production Method Thereof
12/20/2007US20070290223 Semiconductor memory device and method of manufacturing the same
12/20/2007US20070290219 Light emitting device and method of manufacturing the same
12/20/2007US20070290215 Light-emitting semiconductor device protected against reflector metal migration, and method of fabrication
12/20/2007US20070290211 Bipolar Semiconductor Device and Process for Producing the Same
12/20/2007US20070290210 Semiconductor device and method of fabricating a ltps film
12/20/2007US20070290208 Semiconductor device and manufacturing method thereof
12/20/2007US20070290207 Semiconductor device and method for manufacturing semiconductor device
12/20/2007US20070290200 Thin film semiconductor device, method of manufacturing the same and display
12/20/2007US20070290199 copolymers comprising rare earth metal complexes; light-emitting devices; improved semi-conductive properties and/or mechanical flexibility
12/20/2007US20070290193 Field effect transistor devices and methods
12/20/2007US20070289946 Method for polishing a substrate surface
12/20/2007US20070289867 Apparatus for enhanced electrochemical deposition
12/20/2007US20070289610 Method for processing interior of vapor phase deposition apparatus, method for depositing thin film and method for manufacturing semiconductor device
12/20/2007US20070289604 Substrate Processing Apparatus
12/20/2007US20070289531 Batch-type deposition apparatus having a gland portion
12/20/2007US20070289127 Coreless cavity substrates for chip packaging and their fabrication
12/20/2007DE60127252T2 Epitaktischer siliziumwafer frei von selbstdotierung und rückseitenhalo Epitaxial silicon wafer itself free from doping and, back halo
12/20/2007DE19943405B4 Verfahren zur Herstellung eines lateral monolithisch integrierten Lichtemissions-Halbleiterbauelements und Lichtemissions-Halbleiterbauelement A process for preparing a laterally monolithically integrated light emitting semiconductor device and the light emitting semiconductor component
12/20/2007DE19649508B4 Halter für Halbleiterplatten Holders for semiconductor wafers
12/20/2007DE10355573B4 Verfahren zum Erhöhen der Produktionsausbeute durch Steuern der Lithographie auf der Grundlage elektrischer Geschwindigkeitsdaten A method for increasing the production yield by controlling the lithography on the basis of electrical speed data
12/20/2007DE10344862B4 Grabenkondensator-Speicherzellenstruktur und Verfahren zum Ausbilden einer Grabenkondensator-Speicherzellenstruktur Grave capacitor memory cell structure and method of forming a grave capacitor memory cell structure
12/20/2007DE10306315B4 Halbleitervorrichtung und entsprechendes Herstellungsverfahren A semiconductor device and manufacturing method thereof
12/20/2007DE10239081B4 Verfahren zur Herstellung einer Halbleitereinrichtung A process for producing a semiconductor device
12/20/2007DE10207131B4 Verfahren zur Bildung einer Hartmaske in einer Schicht auf einer flachen Scheibe A method of forming a hard mask in a layer on a flat disc
12/20/2007DE102007027519A1 Semiconductor device has semiconductor chip and current flows in thickness direction of semiconductor chip, and edge connecting section contains semiconductor area, of former conductive type, formed between active section and profile area
12/20/2007DE102007027443A1 Polishing device for polishing semiconductor wafer, has main polishing arrangement, which has multiple polishing tables, multiple polishing heads and multiple loading and unloading stations, which are coupled with main frame arrangement
12/20/2007DE102007022971A1 Kommunikationsgerät zur zweidimensionalen Diffusionssignalübertragung Communication device for two-dimensional diffusion signal transmission
12/20/2007DE102007017803A1 Vorrichtung und Verfahren zur Korrektur einer Halbleiterelement-Maske Apparatus and method for correcting a semiconductor element mask
12/20/2007DE102007001157A1 Method for manufacturing of semiconductor device, involves implanting doping substances in semiconductor substrate, where substrate has two areas, and implanted doping substrate is activated in substrate
12/20/2007DE102006033702B3 Producing package-on-package electronic circuits, involves sticking a chip on a bottom package to an interposer using radiation-curable thermoplastic adhesive, soldering on a top package and irradiating the adhesive
12/20/2007DE102006025669B3 Herstellungsverfahren für eine integrierte Halbleiterstruktur Manufacturing method of an integrated semiconductor structure
12/20/2007DE102006017359B3 Semiconductor wafers packing method involves producing structured surface charge on surface of auxiliary substrate, where structured exposing and coating compounds are applied on surface of auxiliary substrate
12/20/2007DE102005041256B4 Trenchtransistor Trench transistor
12/20/2007DE102005030465B4 Halbleiterstapelblock mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor stacking block with semiconductor chips and processes for making
12/20/2007DE102004032605B4 Halbleiterbauteil mit einem Halbleiterchip und elektrischen Verbindungselementen zu einer Leiterstruktur A semiconductor device comprising a semiconductor chip and electrical connecting elements to a printed circuit structure
12/20/2007DE102004017412B4 Elektrische Quantifizierung einer Verkürzung eines Leitbahnendes und Vorrichtung dafür Electrical quantification of shortening a Leitbahnendes and apparatus therefor
12/20/2007DE102004005685B4 Verfahren zum Herstellen einer elektronischen Komponente A method of manufacturing an electronic component
12/19/2007EP1868251A1 Semiconductor element and method for manufacturing same
12/19/2007EP1868247A1 High frequency MOS device and manufacturing process thereof
12/19/2007EP1868241A1 Submount and method for manufacturing same
12/19/2007EP1868240A2 Method for forming mulitlevel interconnects in semiconductor device
12/19/2007EP1868239A1 Semiconductor device with a trench isolation and method of manufacturing trenches in a semiconductor body
12/19/2007EP1868238A2 Clamping device for a wafer
12/19/2007EP1868237A2 Carrier unit of substrate transfer apparatus
12/19/2007EP1868236A1 Overhead traveling vehicle system and transportation method using the same
12/19/2007EP1868235A1 Method and apparatus for evaluating semiconductor wafer and semiconductor wafer manufacturing method
12/19/2007EP1868234A2 High withstand voltage semiconductor device and manufacturing method thereof
12/19/2007EP1868233A1 Method of manufacturing zones based on Si1-yGey with different Ge contents in the same substrate by germanium condensation
12/19/2007EP1868232A1 Method of manufacturing zones based on Si1-yGey with different Ge contents in the same substrate by germanium condensation
12/19/2007EP1868231A1 Bonded wafer manufacturing method, bonded wafer, and plane polishing apparatus
12/19/2007EP1868230A1 Soi wafer manufacturing method and soi wafer manufactured by same
12/19/2007EP1868229A1 Liquid processing apparatus
12/19/2007EP1868215A1 Magnetic semiconductor material
12/19/2007EP1868003A1 Burn-in sorter and sorting method using the same
12/19/2007EP1867687A1 Precursor composition for porous membrane and process for preparation thereof, porous membrane and process for production thereof, and semiconductor device
12/19/2007EP1867591A1 Conveying system
12/19/2007EP1867590A1 Conveying system
12/19/2007EP1867427A1 Laser machining method
12/19/2007EP1867013A1 Semiconductor saturable absorber reflector and method to fabricate thereof
12/19/2007EP1866969A2 Complementary asymmetric high voltage devices and method of fabrication
12/19/2007EP1866964A1 Memory element, memory device, and semiconductor device
12/19/2007EP1866963A2 Multilayer, multicomponent high-k films and methods for depositing the same
12/19/2007EP1866959A1 Flip-attached and underfilled semiconductor device and method
12/19/2007EP1866958A2 High speed substrate aligner apparatus
12/19/2007EP1866957A1 Selective wet etching of metal nitrides
12/19/2007EP1866956A2 Single wafer thermal cvd processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon
12/19/2007EP1866937A2 Integrated circuit transformer devices for on-chip millimeter-wave applications
12/19/2007EP1866672A2 Apparatus for optically-based sorting within liquid core waveguides
12/19/2007EP1866463A2 Line scan sequential lateral solidification of thin films
12/19/2007EP1866257A1 Quartz-type glass and process for its production
12/19/2007EP1866094A2 Environmental control in a reticle smif pod
12/19/2007EP1694885A4 Multi-chemistry plating system
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