Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/19/2007CN100356505C Fast semiconductor heat-treating facility with vertical heat treating chamber
12/19/2007CN100356478C 半导体存储装置 The semiconductor memory device
12/19/2007CN100356401C Manufacturing method of non-contact chip card and non-contact chip card
12/19/2007CN100356263C Liquid crystal display device
12/19/2007CN100356262C Glass production for decreasing glass pendant amount and production for liquid-crystal display device with thin-membrane transistor
12/19/2007CN100356259C Manufacturing method of film transistor liquid crystal display device
12/19/2007CN100356258C Method for making metallic reflective layer of silicon based LCD device
12/19/2007CN100356242C Method for making liquid crystal display device
12/19/2007CN100355858C Slurry for chemical-mechanical polishing copper damascene structures
12/19/2007CN100355846C Mixed-abrasive polishing composition and method for using the same
12/19/2007CN100355820C Chemical mechanical polishing compositions and methods relating thereto
12/19/2007CN100355819C Chemical mechanical polishing compositions and methods relating thereto
12/19/2007CN100355798C Manufacturing method of potishing pad use polyurethane foam and polyurethane foam
12/19/2007CN100355659C Method for of preparing noncracking titanium dioxide film
12/19/2007CN100355653C Silane polymer and method for forming silicon film
12/19/2007CN100355538C Automatic reference position teaching method, automatic positioning method, and automatic carrying method for disk-like object, automatic reference position teaching device, automatic positioning devi
12/19/2007CN100355525C Ultrasonic wire welding method and apparatus
12/19/2007CN100355491C Waterpower liquid
12/19/2007CA2591663A1 Metal-organic vaporizing and feeding apparatus, metal-organic chemical vapor deposition apparatus, metal-organic chemical vapor deposition method, gas flow rate regulator, semiconductor manufacturing apparatus, and semiconductor manufacturing method
12/18/2007USRE39939 Processing system
12/18/2007US7310754 Integrated test circuit, a test circuit, and a test method for performing transmission and reception processing to and from a first and a second macro block at a first frequency
12/18/2007US7310585 Method of inspecting integrated circuits during fabrication
12/18/2007US7310563 Fabrication system and fabrication method
12/18/2007US7310463 Optical structural body, its manufacturing method and optical element
12/18/2007US7310406 Inspection method and system for and method of producing component mounting substrate
12/18/2007US7310279 Semiconductor memory device and semiconductor integrated circuit
12/18/2007US7310256 Semiconductor memory device
12/18/2007US7310213 Semiconductor device provided with overheat protection circuit and electronic circuit using the same
12/18/2007US7310187 Projection objective, especially for microlithography, and method for adjusting a projection objective
12/18/2007US7310175 MEMS device and method of forming MEMS device
12/18/2007US7310152 Interferometer assemblies having reduced cyclic errors and system using the interferometer assemblies
12/18/2007US7310146 Mark position measuring method and apparatus
12/18/2007US7310140 Method and apparatus for inspecting a wafer surface
12/18/2007US7310076 Display apparatus
12/18/2007US7310045 RF tag, RF tag attitude detection apparatus, and RF tag attitude detection system
12/18/2007US7309998 Process monitor for monitoring an integrated circuit chip
12/18/2007US7309991 Scanning probe inspection apparatus
12/18/2007US7309925 Dicing die-bonding film
12/18/2007US7309924 UBM for fine pitch solder ball and flip-chip packaging method using the same
12/18/2007US7309922 Lower substrate, display apparatus having the same and method of manufacturing the same
12/18/2007US7309921 Semiconductor device
12/18/2007US7309920 Chip structure and process for forming the same
12/18/2007US7309919 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
12/18/2007US7309917 Multilayer board and a semiconductor device
12/18/2007US7309915 Semiconductor chip having pads with plural junctions for different assembly methods
12/18/2007US7309910 Micro lead frame packages and methods of manufacturing the same
12/18/2007US7309908 Standard cell, semiconductor integrated circuit device of standard cell scheme and layout design method for semiconductor integrated circuit device
12/18/2007US7309907 Semiconductor device card methods of initializing checking the authenticity and the identity thereof
12/18/2007US7309906 Apparatus and methods for providing highly effective and area efficient decoupling capacitance in programmable logic devices
12/18/2007US7309904 Semiconductor device, magnetic sensor, and magnetic sensor unit
12/18/2007US7309901 Field effect transistors (FETs) with multiple and/or staircase silicide
12/18/2007US7309900 Thin-film transistor formed on insulating substrate
12/18/2007US7309899 Semiconductor device including a MOSFET with nitride side wall
12/18/2007US7309894 High voltage gate driver integrated circuit including high voltage junction capacitor and high voltage LDMOS transistor
12/18/2007US7309893 Semiconductor device and method of fabricating the same
12/18/2007US7309892 Semiconductor element and semiconductor memory device using the same
12/18/2007US7309890 SRAM cell structure and manufacturing method thereof
12/18/2007US7309889 Constructions comprising perovskite-type dielectric
12/18/2007US7309884 Semiconductor light receiving device and method of fabricating the same
12/18/2007US7309883 Semiconductor device capable of preventing current flow caused by latch-up and method of forming the same
12/18/2007US7309877 Semiconductor device, reflection type liquid crystal display device, and reflection type liquid crystal projector
12/18/2007US7309869 Lithographic apparatus, device manufacturing method and radiation system
12/18/2007US7309865 Electronic device having infrared sensing elements
12/18/2007US7309722 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
12/18/2007US7309662 Method and apparatus for forming a film on a substrate
12/18/2007US7309661 Method for forming gate of semiconductor device
12/18/2007US7309660 Buffer layer for selective SiGe growth for uniform nucleation
12/18/2007US7309659 Silicon-containing resist to pattern organic low k-dielectrics
12/18/2007US7309658 Molecular self-assembly in substrate processing
12/18/2007US7309657 Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board
12/18/2007US7309656 Method for forming step channel of semiconductor device
12/18/2007US7309655 Etching method in a semiconductor processing and etching system for performing the same
12/18/2007US7309654 Technique for reducing etch damage during the formation of vias and trenches in interlayer dielectrics
12/18/2007US7309653 Method of forming damascene filament wires and the structure so formed
12/18/2007US7309652 Method for removing photoresist layer and method for forming metal line in semiconductor device using the same
12/18/2007US7309651 Method for improving reliability of copper interconnects
12/18/2007US7309650 Memory device having a nanocrystal charge storage region and method
12/18/2007US7309649 Method of forming closed air gap interconnects and structures formed thereby
12/18/2007US7309648 Low profile, chip-scale package and method of fabrication
12/18/2007US7309647 Method of mounting an electroless nickel immersion gold flip chip package
12/18/2007US7309646 De-fluoridation process
12/18/2007US7309645 Semiconductor thin film crystallization method
12/18/2007US7309644 System and method of fabrication and application of thin-films with continuously graded or discrete physical property parameters to functionally broadband monolithic microelectronic optoelectronic/sensor/actuator device arrays
12/18/2007US7309642 Metallic quantum dots fabricated by a superlattice structure
12/18/2007US7309641 Etching is performed using a fluorocarbon compound with at least two carbon atoms, helium and oxygen as etching gas
12/18/2007US7309640 Method of fabricating an integrated circuit including hollow isolating trenches and corresponding integrated circuit
12/18/2007US7309639 Method of forming a metal trace with reduced RF impedance resulting from the skin effect
12/18/2007US7309638 Method of manufacturing a semiconductor component
12/18/2007US7309637 Method to enhance device performance with selective stress relief
12/18/2007US7309636 High-voltage metal-oxide-semiconductor device and method of manufacturing the same
12/18/2007US7309635 Phosphorous doping methods of manufacturing field effect transistors having multiple stacked channels
12/18/2007US7309634 Non-volatile semiconductor memory devices using prominences and trenches
12/18/2007US7309633 Semiconductor device including MOS field effect transistor having offset spacers or gate sidewall films on either side of gate electrode and method of manufacturing the same
12/18/2007US7309632 Method for fabricating a nonvolatile memory cell
12/18/2007US7309630 Method for forming patterned media for a high density data storage device
12/18/2007US7309629 Method for fabricating semiconductor device
12/18/2007US7309628 Method of forming a semiconductor device
12/18/2007US7309627 Method for fabricating a gate mask of a semiconductor device
12/18/2007US7309626 Quasi self-aligned source/drain FinFET process
12/18/2007US7309625 Method for fabricating metal oxide semiconductor with lightly doped drain