Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/06/2007WO2007139685A1 Improved semiconductor seal ring
12/06/2007WO2007139594A1 Microelectronic element chips
12/06/2007WO2007139487A1 Schottky diode with incorporated pn- junctions
12/06/2007WO2007139329A1 Valve for preventing reverse-flow
12/06/2007WO2007139315A1 Stripper composition for photoresist
12/06/2007WO2007139270A1 Cleaning method of apparatus for depositing metal containing film
12/06/2007WO2007139239A1 Reverse side cleaning device of an object
12/06/2007WO2007139231A1 Semiconductor device
12/06/2007WO2007139225A1 Surface inspection device
12/06/2007WO2007139218A1 Compound semiconductor epitaxial substrate and method for producing the same
12/06/2007WO2007139205A1 Semiconductor device and ic label, ic tag, and ic card having the same
12/06/2007WO2007139159A1 Device for supplying organic metal compound
12/06/2007WO2007139146A1 Semiconductor device and method for manufacturing the same
12/06/2007WO2007139142A1 Plasma cvd method, method for forming silicon nitride film, method for manufacturing semiconductor device and plasma cvd method
12/06/2007WO2007139141A1 Method for forming insulating film and method for manufacturing semiconductor device
12/06/2007WO2007139140A1 Plasma cvd method, method for forming silicon nitride film and method for manufacturing semiconductor device
12/06/2007WO2007139101A1 Electronic component mounting structure
12/06/2007WO2007139052A1 Substrate transfer apparatus
12/06/2007WO2007139049A1 Heat treatment method, heat treatment apparatus and substrate processing apparatus
12/06/2007WO2007139041A1 Method for forming metal compound layer, method for manufacturing semiconductor device, and apparatus for forming metal compound layer
12/06/2007WO2007139017A1 Liquid recovery member, substrate holding member, exposure apparatus and device manufacturing method
12/06/2007WO2007139009A1 Oxide semiconductor, thin film transistor, and their production methods
12/06/2007WO2007139004A1 Composition for forming insulating films, process for production thereof, silica-base insulating films, and process for the formation of the films
12/06/2007WO2007138991A1 Semiconductor device
12/06/2007WO2007138975A1 Polishing composition and polishing method
12/06/2007WO2007138958A1 Electrical circuit
12/06/2007WO2007138937A1 Semiconductor device and manufacturing method thereof
12/06/2007WO2007138927A1 Thermocompression bonding head and mounting device using the same
12/06/2007WO2007138922A1 Electronic component, semiconductor package and electronic device
12/06/2007WO2007138921A1 Etching solution for substrate
12/06/2007WO2007138913A1 Substrate container
12/06/2007WO2007138893A1 Positive resist composition and method for formation of resist pattern
12/06/2007WO2007138873A1 Resist composition for immersion exposure, and method for formation of resist pattern
12/06/2007WO2007138848A1 Bonded wafer manufacturing method
12/06/2007WO2007138841A1 Method of film deposition, apparatus for film deposition, memory medium, and semiconductor device
12/06/2007WO2007138834A1 Exposure apparatus and exposure method
12/06/2007WO2007138828A1 Method for evaluating soi wafer
12/06/2007WO2007138805A1 Illuminating optical apparatus, exposure apparatus, and device manufacturing method
12/06/2007WO2007138797A1 Positive resist composition and method of forming resist pattern
12/06/2007WO2007138786A1 Method for reducing thickness of substrate, lamination system, and substrate thickness reduction system
12/06/2007WO2007138765A1 Manufacturing method of multilayer wiring substrate, and multilayer wiring substrate
12/06/2007WO2007138754A1 Semiconductor device, method for manufacturing same, and display
12/06/2007WO2007138747A1 Resist film peeling method, mask blank manufacturing method and transfer mask manufacturing method
12/06/2007WO2007138711A1 Electronic device system having multi-power supply integrated circuit
12/06/2007WO2007138710A1 Semiconductor device
12/06/2007WO2007138693A1 Semiconductor device and method for manufacturing same
12/06/2007WO2007138692A1 Semiconductor device and method for manufacturing same
12/06/2007WO2007138671A1 Automatic workpiece working device
12/06/2007WO2007138063A1 Method for reducing the surface roughness of a semiconductor substrate
12/06/2007WO2007137969A1 Semiconductor integrated circuit devices having high-q wafer back-side capacitors
12/06/2007WO2007137946A2 Trench widening without merging
12/06/2007WO2007137888A1 Ejection unit for removing components from an essentially planar arrangement of components
12/06/2007WO2007137742A1 Method for the production of an electronic subassembly, associated subassembly, and assembly comprising at least one such subassembly
12/06/2007WO2007137568A1 Flip-chip component and method for the production thereof
12/06/2007WO2007137508A1 Polishing slurry for subtle surface planarization and its using method
12/06/2007WO2007123496A8 Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template
12/06/2007WO2007120697A3 Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
12/06/2007WO2007115292A3 Method and structure for eliminating aluminum terminal pad material in semiconductor devices
12/06/2007WO2007112833B1 Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate
12/06/2007WO2007111779A3 Method of integrating peald ta-containing films into cu metallization
12/06/2007WO2007111694A3 Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
12/06/2007WO2007110832A3 Trench-gate semiconductor device and method of fabrication thereof
12/06/2007WO2007110719A3 Improved alkaline solutions for post cmp cleaning processes
12/06/2007WO2007108983A3 Strained silicon with elastic edge relaxation
12/06/2007WO2007106180A3 Photovoltaic contact and wiring formation
12/06/2007WO2007103088A3 Shared contact structures for integrated circuits
12/06/2007WO2007102870A3 Strained silicon mos device with box layer between the source and drain regions
12/06/2007WO2007095439A3 Electrochemical etching of circuitry for high density interconnect electronic modules
12/06/2007WO2007087213A3 Methods of implanting ions and ion sources used for same
12/06/2007WO2007087067A3 Remote plasma pre-clean with low hydrogen pressure
12/06/2007WO2007084782A3 Method for improved growth of semipolar (al,in,ga,b)n
12/06/2007WO2007082266A3 Semiconductor transistors with expanded top portions of gates
12/06/2007WO2007044035A3 Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers
12/06/2007WO2007038030A3 Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
12/06/2007WO2007037955A3 Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof
12/06/2007WO2007035234A3 Semiconductor stacked die/wafer configuration and packaging and method thereof
12/06/2007WO2007034117A3 Electroplating method for coating a substrate surface with a metal
12/06/2007WO2007034116A3 Electroplating composition for coating a substrate surface with a metal
12/06/2007WO2007027762A8 Metal interconnect structure for integrated ciruits and a design rule therefor
12/06/2007WO2007015957A3 Virtual body-contacted trigate
12/06/2007WO2007001854A3 Chemical die singulation technique
12/06/2007WO2006132751A3 High efficiency trap for deposition process
12/06/2007WO2006091512A3 Integrated circuit capacitor and method of manufacturing same
12/06/2007WO2006023741A3 Method to build a wirebond probe card in a many at a time fashion
12/06/2007WO2006002410A3 Compressive sige <110> growth mosfet devices
12/06/2007WO2005112102A3 Chemical-enhanced package singulation process
12/06/2007WO2005065089A3 Method of manufacturing a semiconductor component, and semiconductor component formed thereby
12/06/2007WO2005036597A3 Semiconductor device and making thereof
12/06/2007WO2005034201A3 Metal-insulator-metal capacitor and method of fabrication
12/06/2007US20070283313 Mask pattern generating method
12/06/2007US20070281849 Crystallized glass, and method for producing crystallized glass
12/06/2007US20070281592 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
12/06/2007US20070281498 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
12/06/2007US20070281497 Method to mitigate impact of uv and e-beam exposure on semiconductor device film properties by use of a bilayer film
12/06/2007US20070281496 Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen
12/06/2007US20070281495 Formation of high quality dielectric films of silicon dioxide for sti: usage of different siloxane-based precursors for harp ii - remote plasma enhanced deposition processes
12/06/2007US20070281494 Transparent Contact And Method For The Production Thereof
12/06/2007US20070281493 Methods of shaping vertical single crystal silicon walls and resulting structures
12/06/2007US20070281492 Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures
12/06/2007US20070281491 Residue free hardmask trim
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