Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/19/2007EP1602129B1 Split fin heat sink
12/19/2007EP1593141B1 End point detection in time division multiplexed etch processes
12/19/2007EP1496518B1 Storage device using resistance varying storage element and reference resistance value decision method for the device
12/19/2007EP1419523A4 Dummy structures to reduce metal recess in electropolishing process
12/19/2007EP1377394B1 Label sheet for cleaning, method of manufacturing a label sheet, conveying member having cleaning function and method of cleaning a substrate processing equipment
12/19/2007EP1292970A4 Thin film forming method
12/19/2007EP1218938B1 Method for providing a dopant level for polysilicon for flash memory devices
12/19/2007EP1215310B1 p-TYPE SINGLE CRYSTAL ZINC OXIDE HAVING LOW RESISTIVITY AND METHOD FOR PREPARATION THEREOF
12/19/2007EP1196944B1 Apparatus and method for transferring a workpiece
12/19/2007EP1176641B1 Front-and-back electrically conductive substrate and method for manufacturing same
12/19/2007EP1135545B1 Removing oxides or other reducible contaminants from a substrate by plasma treatment
12/19/2007EP1114441B1 Method of forming non-oxygen precipitating czochralski silicon wafers
12/19/2007EP1030355B1 Press contact semiconductor device
12/19/2007CN200994226Y Green laser microscope precision trimming machine
12/19/2007CN200993960Y Chip push-out suction nozzle device
12/19/2007CN200993959Y Soldered ball implanting device
12/19/2007CN200993656Y Conducting device for detection carrier
12/19/2007CN200993525Y Kiln for producing lithiumion cell positive electrode material
12/19/2007CN200991808Y Rotary thermal table device
12/19/2007CN200991807Y 3-D guiding device
12/19/2007CN200991679Y Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus
12/19/2007CN101091420A Surface wave excitation plasma generator and surface wave excitation plasma processing system
12/19/2007CN101091264A Switching device, drive and manufacturing method for the same, integrated circuit device and memory device
12/19/2007CN101091260A Semiconductor device and method for producing the same
12/19/2007CN101091259A Semiconductor device having strip- shaped channel and method for manufacturing such a device
12/19/2007CN101091257A Method and process intermediate for electrostatic discharge protection in flat panel imaging detectors
12/19/2007CN101091256A Electronic device and process for forming same
12/19/2007CN101091253A Semiconductor memory and manufacturing method thereof
12/19/2007CN101091244A Metal gate transistor for cmos process and method for making
12/19/2007CN101091243A Single mask via method and device
12/19/2007CN101091242A Method for obtaining a thin layer having a low density of holes
12/19/2007CN101091241A Substrate processing apparatus
12/19/2007CN101091240A Semiconductor device and manufacturing method therefor
12/19/2007CN101091239A Method for forming a semiconductor device having a notched control electrode and structure thereof
12/19/2007CN101091238A Silicon wafer polishing method and silicon wafer producing method, apparatus for polishing disc-like work and silicon wafer
12/19/2007CN101091237A Epitaxial wafer manufacturing method and epitaxial wafer
12/19/2007CN101091236A Heater, heat treatment apparatus, and storage medium
12/19/2007CN101091235A Heat-treating apparatus
12/19/2007CN101091234A Method of producing a substrate for an optoelectronic application
12/19/2007CN101091233A Exposure apparatus, exposure method, and device production method
12/19/2007CN101091006A Seal structure of vacuum apparatus
12/19/2007CN101091005A Method for forming tantalum nitride film
12/19/2007CN101091004A Method for forming tantalum nitride film
12/19/2007CN101091003A Method for forming tantalum nitride film
12/19/2007CN101091002A Method for forming tantalum nitride film
12/19/2007CN101091001A Method for forming tantalum nitride film
12/19/2007CN101091000A Method for forming tantalum nitride film
12/19/2007CN101090985A Al-ni-b alloy wiring material and element structure using the same
12/19/2007CN101090598A Plasma processing apparatus and plasma processing method
12/19/2007CN101090597A Method for determining plasma characteristics
12/19/2007CN101090144A Technology for package of high power luminous element and its structure
12/19/2007CN101090141A Preparation method of hybridization electrode of electric insulation salt modulation
12/19/2007CN101090140A Preparation method for nuclear case structure hybridization electrode
12/19/2007CN101090137A An apparatus and associated method for making a floating gate cell in a virtual ground array
12/19/2007CN101090136A In film transistor, method of manufacturing the same, and organic light-emitting diode display using the same
12/19/2007CN101090135A High voltage devices and its making method
12/19/2007CN101090134A Silicon-base plane side grid single electronic transistor and manufacturing method thereof
12/19/2007CN101090133A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/19/2007CN101090132A 显示装置及其制造方法 Display device and manufacturing method
12/19/2007CN101090131A 显示装置及其制造方法 Display device and manufacturing method
12/19/2007CN101090130A Self-aligned, embedded phase change ram and manufacturing method
12/19/2007CN101090129A Semiconductor device and method for making the same
12/19/2007CN101090128A LED array microdisplay device and manufacturing method
12/19/2007CN101090124A 半导体器件 Semiconductor devices
12/19/2007CN101090123A Film transistor with copper wire structure and its manufacturing method
12/19/2007CN101090121A Semiconductor device and a manufacturing method thereof
12/19/2007CN101090120A A nand memory device with inversion bit lines and methods for making the same
12/19/2007CN101090119A An apparatus and associated method for making a virtual ground array structure that uses inversion bit lines
12/19/2007CN101090117A Semiconductor storage device and manufacturing method thereof
12/19/2007CN101090116A Semiconductor device including cmis transistor
12/19/2007CN101090115A Semiconductor device and its making method
12/19/2007CN101090108A Composite semiconductor device and method of manufacturing the same
12/19/2007CN101090107A Package structure of crystal particle and manufacturing method thereof
12/19/2007CN101090102A Semiconductor device and method of manufacturing the same
12/19/2007CN101090100A Chip structure with lug and manufacturing method thereof
12/19/2007CN101090099A Solder lug and manufacturing method thereof
12/19/2007CN101090098A Semiconductor device and method for manufacturing the same
12/19/2007CN101090095A Active assembly multiple substrate and its manufacturing method
12/19/2007CN101090094A Method of manufacturing semiconductor device
12/19/2007CN101090093A 显示装置及其制造方法 Display device and manufacturing method
12/19/2007CN101090092A Separation method for surface adhesive integrated circuit product and its mould
12/19/2007CN101090091A Method for making semiconductor device
12/19/2007CN101090090A Unlanded via process without plasma damage
12/19/2007CN101090089A Methods for forming an isolation structure in a silicon substrate
12/19/2007CN101090088A Filling method for isolation groove
12/19/2007CN101090087A Clamping device for a wafer
12/19/2007CN101090086A Counterforce process device for platform
12/19/2007CN101090085A Movable transfer chamber and substrate-treating apparatus including the same
12/19/2007CN101090084A Apparatus with filet radius joints
12/19/2007CN101090083A Chip detection method
12/19/2007CN101090082A Multifunction bonding device for semiconductor chip
12/19/2007CN101090081A Manufacturing method of semiconductor device
12/19/2007CN101090080A Package method for multi-chip stack and its package structure
12/19/2007CN101090079A Package method for preventing chip interference and its package structure
12/19/2007CN101090078A Semiconductor package structure and method for manufacturing the semiconduct package structure
12/19/2007CN101090077A Semiconductor package and its manufacturing method
12/19/2007CN101090076A Process for producing a film carrier tape for mounting an electronic part
12/19/2007CN101090075A Manufacturing method for vertical built-in capacity substrate and its structure
12/19/2007CN101090074A Printed circuit board for package of electronic components and manufacturing method thereof
12/19/2007CN101090073A Method for producing film transistor, film transistor and display unit
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