Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/20/2007US20070293025 Protect diodes for hybrid-orientation substrate structures
12/20/2007US20070293024 Method of crystallizing amorphous silicon and device fabricated using the same
12/20/2007US20070293023 Method of fabricating suspended structure
12/20/2007US20070293022 Method of and apparatus for detaching semiconductor chips from a tape
12/20/2007US20070293021 Wafer dividing method
12/20/2007US20070293020 Singulating semiconductor wafers to form semiconductor chips
12/20/2007US20070293019 Methods of die sawing and structures formed thereby
12/20/2007US20070293018 Method of fabricating semiconductor device with shallow trench isolation
12/20/2007US20070293017 Method of fabricating shallow trench isolation structure
12/20/2007US20070293016 Semiconductor structure including isolation region with variable linewidth and method for fabrication therof
12/20/2007US20070293015 III-Nitride device and method with variable epitaxial growth direction
12/20/2007US20070293014 Method for forming metal-insulator-metal capacitor of semiconductor device
12/20/2007US20070293013 Method of forming a bipolar transistor and semiconductor component thereof
12/20/2007US20070293012 Reduction of slip and plastic deformations during annealing by the use of ultra-fast thermal spikes
12/20/2007US20070293011 Field effect transistor device with channel fin structure and method of fabricating the same
12/20/2007US20070293010 BURIED BIASING WELLS IN FETs (Field Effect Transistors)
12/20/2007US20070293009 Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
12/20/2007US20070293008 Trench drain with sloping rails
12/20/2007US20070293007 Semiconductor device and method for fabricating the same
12/20/2007US20070293006 Method for fabricating a charg trapping memory device
12/20/2007US20070293005 Parts combining structure, and electronic apparatus
12/20/2007US20070293004 Integrated CMOS and bipolar devices method and structure
12/20/2007US20070293003 Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
12/20/2007US20070293002 Method of fabricating a high-voltage transistor with an extended drain structure
12/20/2007US20070293001 Silicon carbide Schottky diode and method of making the same
12/20/2007US20070293000 Metal resistor, resistor material and method
12/20/2007US20070292999 Transistors Having Implanted Channel Layers and Methods of Fabricating the Same
12/20/2007US20070292998 Thin film transistor array substrate and method for manufacturing the same
12/20/2007US20070292997 Method for manufacturing semiconductor device
12/20/2007US20070292996 Method and structure to process thick and thin fins and variable fin to fin spacing
12/20/2007US20070292995 Reverse blocking semiconductor device and a method for manufacturing the same
12/20/2007US20070292994 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
12/20/2007US20070292993 Manufacturing Method of Semiconductor Device
12/20/2007US20070292992 Method of aligning a contactless semiconductor device interface
12/20/2007US20070292991 Method for quantification of analytes in a titanium, tin or silcon tetrachloride sample
12/20/2007US20070292990 Semiconductor multi-package module having wire bond interconnect between stacked packages
12/20/2007US20070292989 Semiconductor device and a method of assembling a semiconductor device
12/20/2007US20070292988 Manufacturing method of wiring substrate
12/20/2007US20070292987 Method Of Fabricating Strained Thin Film Semiconductor Layer
12/20/2007US20070292985 Phase change memory with nanofiber heater
12/20/2007US20070292983 Methods for Manufacturing a Sensor Assembly
12/20/2007US20070292982 Method for Manufacturing Transparent Windows in Molded Semiconductor Packages
12/20/2007US20070292981 Structure for protecting feataures during the removal of sacrificial materials and a method of manufacture therefor
12/20/2007US20070292980 Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
12/20/2007US20070292979 Semiconductor device and method of fabricating the same
12/20/2007US20070292978 Method for manufacturing gallium nitride light emitting diode devices
12/20/2007US20070292977 Method for monitoring temperature in thermal process
12/20/2007US20070292976 Method and device for the independent extraction of carrier concentration level and electrical junction depth in a semiconductor substrate
12/20/2007US20070292975 Transfer molding apparatus and method for manufacturing semiconductor device
12/20/2007US20070292974 Substrate Processing Method and Substrate Processing Apparatus
12/20/2007US20070292814 Heat Treatment Apparatus and Method of Manufacturing Substrates
12/20/2007US20070292808 Developing Solution Composition for Lithography and Method for Resist Pattern Formation
12/20/2007US20070292769 Method of Manufacturing Photomask Blank
12/20/2007US20070292767 Underlayer Coating Forming Composition For Lithography Containing Cyclodextrin Compound
12/20/2007US20070292632 Substrate Holding Device, Substrate Processing System And Liquid Crystal Display Device
12/20/2007US20070292628 Method of Forming Metal Oxide Using an Atomic Layer Deposition Process
12/20/2007US20070292613 Thin Film Dielectrics With Perovskite Structure and Preparation Thereof
12/20/2007US20070292598 Substrate Processing Method and Substrate Processing Apparatus
12/20/2007US20070292316 Reaction chamber for oxy-fluoridation
12/20/2007US20070292245 Stage assembly with secure device holder
12/20/2007US20070292244 Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
12/20/2007US20070292077 Beam steering element with built-in detector and system for use thereof
12/20/2007US20070291809 Semiconductor optical device and manufacturing method thereof
12/20/2007US20070291539 Nonvolatile semiconductor memory device and manufacturing method thereof
12/20/2007US20070291532 Semiconductor integrated circuit device and magnetic memory device capable of maintaining data integrity
12/20/2007US20070291448 Interposer containing bypass capacitors for reducing voltage noise in an ic device
12/20/2007US20070291242 Exposure apparatus
12/20/2007US20070291239 Exposure Apparatus and Device Manufacturing Method
12/20/2007US20070291206 Methods of fabricating active device array substrate and fabricating color filter substrate
12/20/2007US20070291146 Semiconductor Chip
12/20/2007US20070290703 High Resolution Analytical Probe Station
12/20/2007US20070290700 Wafer probe station having a skirting component
12/20/2007US20070290697 Microstructured pattern inspection method
12/20/2007US20070290377 Three Dimensional Six Surface Conformal Die Coating
12/20/2007US20070290374 Component with Encapsulation Suitable for Wlp and Production Method
12/20/2007US20070290370 Device configured to have a nanowire formed laterally between two electrodes and methods for forming the same
12/20/2007US20070290369 Resin Paste For Die Bonding And Its Use
12/20/2007US20070290368 Top layers of metal for high performance IC's
12/20/2007US20070290362 Integrated inductors and compliant interconnects for semiconductor packaging
12/20/2007US20070290360 Electrode Pad on Conductive Semiconductor Substrate
12/20/2007US20070290359 Inexpensive method of fabricating a higher performance capacitance density mimcap integrable into a copper interconnect scheme
12/20/2007US20070290358 Top layers of metal for high performance IC's
12/20/2007US20070290357 Top layers of metal for high performance IC's
12/20/2007US20070290356 Top layers of metal for high performance IC's
12/20/2007US20070290355 Top layers of metal for high performance IC's
12/20/2007US20070290354 Top layers of metal for high performance IC's
12/20/2007US20070290353 Top layers of metal for high performance IC's
12/20/2007US20070290352 Top layers of metal for high performance IC's
12/20/2007US20070290351 Top layers of metal for high performance IC's
12/20/2007US20070290350 Top layers of metal for high performance IC's
12/20/2007US20070290349 Top layers of metal for high performance IC's
12/20/2007US20070290348 Top layers of metal for high performance IC's
12/20/2007US20070290347 Semiconductive device having resist poison aluminum oxide barrier and method of manufacture
12/20/2007US20070290345 Structure and method for producing multiple size interconnections
12/20/2007US20070290344 Printed circuit board for package of electronic components and manufacturing method thereof
12/20/2007US20070290341 Semiconductor package and method of mounting the same
12/20/2007US20070290325 Surface mounting structure and packaging method thereof
12/20/2007US20070290320 Carrier for stacked type semiconductor device and method of fabricating the same
12/20/2007US20070290309 System and Method for Hermetically Sealing a Package
12/20/2007US20070290306 Wiring substrate and manufacturing method thereof, and semiconductor apparatus
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