| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 12/06/2007 | US20070278526 Methods of Making Semiconductor-Based Electronic Devices on a Wire and Articles That Can Be Made Using Such Devices |
| 12/06/2007 | US20070278517 HETERO-INTEGRATED STRAINED SILICON n- AND p- MOSFETS |
| 12/06/2007 | US20070278514 Semiconductor Component Comprising A Temporary Field Stopping Area, And Method For The Production Thereof |
| 12/06/2007 | US20070278513 Semiconductor light emitting device and method of fabricating the same |
| 12/06/2007 | US20070278507 Field effect transistor and method for fabricating the same |
| 12/06/2007 | US20070278503 Lighting device and lighting method |
| 12/06/2007 | US20070278495 Thin film transistor formed on flexible substrate and method of manufacturing the same |
| 12/06/2007 | US20070278494 Single-crystal layer on a dielectric layer |
| 12/06/2007 | US20070278492 Thin film transistor array panel and method of manufacturing the same |
| 12/06/2007 | US20070278484 Method and test structure for estimating electromigration effects caused by porous barrier materials |
| 12/06/2007 | US20070278478 Ambipolar, Light-Emitting Field-Effect Transistors |
| 12/06/2007 | US20070278447 Slurry for chemical-mechanical planarization of sapphire and method for manufacturing the same |
| 12/06/2007 | US20070278425 Method of operating emitter for electron-beam projection lithography system |
| 12/06/2007 | US20070278405 Multi-tip surface cantilever probe |
| 12/06/2007 | US20070278279 Method and Apparatus for Producing a Chip-Substrate Connection |
| 12/06/2007 | US20070278075 Capacitance Type Mems Device, Manufacturing Method Thereof, And High Frequency Device |
| 12/06/2007 | US20070278067 Methods and apparatus for transporting substrate carriers |
| 12/06/2007 | US20070277931 Semiconductor substrate processing apparatus, method, and medium |
| 12/06/2007 | US20070277930 Substrate Cleaning Apparatus and Substrate Processing Unit |
| 12/06/2007 | US20070277929 Method and Device for Detaching a Component Which is Attached to a Flexible Film |
| 12/06/2007 | DE60221790T2 Verfahren und vorrichtung zur effizienten und genauen filterung und interpolation Method and apparatus for efficient and accurate filtering and interpolation |
| 12/06/2007 | DE19936626B4 Resistentfernungsmittel und Resistentfernungsverfahren Resist remover and resist removal method |
| 12/06/2007 | DE19841402B4 Verfahren zur Herstellung eines Kondensators eines Halbleiterbauelementes A method for manufacturing a capacitor of a semiconductor device |
| 12/06/2007 | DE19740950B4 Halbleiterspeicher und Verfahren zum Herstellen desselben Of the same semiconductor memory and method of manufacturing |
| 12/06/2007 | DE112006000209T5 Bedampfungsvorrichtung und Filmausbildungsverfahren A steamer and film forming method |
| 12/06/2007 | DE10348191B4 Spindelantrieb für hohe Beschleunigungen und Verfahren zur Spindelbewegung Spindle drive for high acceleration and method for spindle movement |
| 12/06/2007 | DE10320561B4 Verfahren zur Herstellung einer leitfähigen Verbindung zwischen einem Halbleiterchip und einer äußeren Leiterstruktur A process for producing a conductive connection between a semiconductor chip and an outer lead structure |
| 12/06/2007 | DE10303942B4 Herstellungsverfahren für eine PN-Sperrschicht-Diodenvorrichtung, und eine PN-Sperrschicht-Diodenvorrichtung Manufacturing method of a PN junction diode device, and a PN-junction diode device |
| 12/06/2007 | DE10255850B4 Verfahren zur Herstellung von Halbleiterstrukturen unter Ausbildung einer Signalschicht zur Generierung charakteristischer optischer Plasmaemissionen und integrierter Schaltungschip A process for producing semiconductor structures with the formation of a signal layer to generate optical plasma emissions characteristic and integrated circuit chip |
| 12/06/2007 | DE102007025248A1 Elektronisches Bauelement, das mindestens zwei Halbleiterleistungsbauteile aufweist An electronic component having at least two semiconductor power components |
| 12/06/2007 | DE102007024142A1 Zusammensetzung zum chemisch-mechanischen Polieren von Siliziumoxid und Siliziumnitrid mit verbesserter Endpunkt-Detektion A composition for mechanical chemical polishing of silicon oxide and silicon nitride having improved endpoint detection |
| 12/06/2007 | DE102007023204A1 Verfahren zur Herstellung einer Siliziumcarbid-Halbleitervorrichtung A method of manufacturing a silicon carbide semiconductor device |
| 12/06/2007 | DE102006057378A1 Halbleiterbauelement mit fixierten Kanalionen Semiconductor component with fixed ion channel |
| 12/06/2007 | DE102006026295A1 Aqueous dispersions of conjugated polymers, e.g. polyacetylene, used for the production of coatings by ink-jet printing, e.g. antistatic coatings, strip conductors, opto-electronic components and solar cells |
| 12/06/2007 | DE102006026023A1 Semiconductor component, has plastic compound arranged between another plastic compound and edge sides of adhesive layer and chip and upper side of chip such that latter plastic compound does not have physical contact to chip and layer |
| 12/06/2007 | DE102006025868A1 Contact wire for contacting two contact surfaces, has contour of cross-sectional surface of contact wire, which has form deviating from circular shape and square shape with two different long sides |
| 12/06/2007 | DE102006025867A1 Bond connection for contact surfaces in e.g. integrated circuit, has bond wires that are arranged one upon other and connected with each other, where one of the bond wires is broader and/or thinner than other bond wire |
| 12/06/2007 | DE102006025866A1 Bond wedge for ultrasonic-ribbon-bonding device, has bond side facing bonding-ribbons and elevations tapered in bond-ribbons direction, which are provided adjacent to bond side in longitudinal direction of bond-ribbon |
| 12/06/2007 | DE102006025408A1 Verfahren zur Steigerung des Transistorsleitungsvermögens durch Dotierstoffaktivierung nach der Silizidierung A method for increasing the transistor conducting power by dopant after the silicidation |
| 12/06/2007 | DE102006025405A1 Metallisierungsschicht eines Halbleiterbauelements mit unterschiedlich dicken Metallleitungen und Verfahren zur Herstellung Metallization layer of a semiconductor device including metal lines of different thicknesses and methods for making |
| 12/06/2007 | DE102006025365A1 Verfahren und Teststruktur zum Abschätzen von Elektromigrationseffekten, die durch poröse Barrierenmaterialien hervorgerufen werden The method and test structure for estimating electromigration effects, which are caused by porous barrier materials |
| 12/06/2007 | DE102006025364A1 Verfahren zum Vergrößern des Transistordurchlassstromes durch Vertiefen eines Isolationsgrabens A method for increasing transistor drive current through an isolation trench depth |
| 12/06/2007 | DE102006025361A1 Ausstoßeinheit zum Abtrennen von Bauelementen aus einer im Wesentlichen ebenen Anordnung von Bauelementen Discharge unit for separating components from a substantially level arrangement of components |
| 12/06/2007 | DE102006025352A1 Verfahren und System zum Bestimmen der Auslastung von Prozessanlagen in einer Fertigungsumgebung auf der Grundlage von Eigenschaften eines automatisierten Materialhandhabungssystems Method and system for determining the utilization of process equipment in a manufacturing environment based on properties of an automated material handling system |
| 12/06/2007 | DE102006025351A1 Leakage current testing structure for manufacturing of microstructures, has circuit elements formed above substrate with connecting structure, which connects both circuit elements with both testing arrangements and both sounding areas |
| 12/06/2007 | DE102006024943A1 Entwurf und Verfahren für die Befestigung eines Dies auf einem Leiterrahmen in einem Halbleiterbauelement Design and method for attaching a die to a lead frame in a semiconductor device |
| 12/06/2007 | DE102006024741A1 Semiconductor device manufacturing method, involves providing semiconductor substrate available with surface, and layer pile comprising conductive layer on substrate surface |
| 12/06/2007 | DE102006023998A1 Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen Electronic circuitry and methods for producing such |
| 12/06/2007 | DE102006023607A1 Seitenwand-Distanzstruktur, Verfahren zur Ausbildung von Seitenwand-Distanzstrukturen und Feldeffekttransistoren sowie Strukturierungsverfahren Sidewall spacer structure, methods of forming sidewall spacer and field effect transistors and patterning methods |
| 12/06/2007 | DE102006023196B3 Verfahren und Vorrichtung zum Einstellen von gerätespezifischen Auswerteparametern Method and apparatus for setting the device-specific evaluation parameters |
| 12/06/2007 | DE102006000267A1 Electrical testing device production method, involves flat aligning of front side of printed circuit board, which is directed against aligning aid, where attaching positions are processed for alignment in level parallel to clamped front |
| 12/06/2007 | DE102005052053B4 Verfahren zur Herstellung einer Ätzstoppschicht für eine Metallisierungsschicht mit verbesserter Ätzselektivität und besserem Einschlussverhalten A process for producing an etch stop layer for a metallization layer with improved etch selectivity and better inclusion behavior |
| 12/06/2007 | DE102005000997B4 Integrierte Halbleiterschaltungen mit gestapelten Knotenkontaktstrukturen und Verfahren zum Herstellen solcher Vorrichtungen Integrated semiconductor circuits stacked with node contact structures and methods for making such devices |
| 12/06/2007 | DE102004011996B4 Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken Apparatus for simultaneous double-side grinding of disk-shaped workpieces |
| 12/05/2007 | EP1863097A1 Method for modulating the effective work function |
| 12/05/2007 | EP1863096A1 Semiconductor device and method of manufacturing the same |
| 12/05/2007 | EP1863090A1 Semiconductor device and method for manufacturing semiconductor device |
| 12/05/2007 | EP1863089A1 Non-active electrically structures of integrated electronic circuit |
| 12/05/2007 | EP1863083A2 Method for producing semiconductor substrate |
| 12/05/2007 | EP1863082A2 Method of producing semiconductor substrate |
| 12/05/2007 | EP1863081A2 Dielectric material separated-type, high breakdown voltage semiconductor circuit device, and production method thereof |
| 12/05/2007 | EP1863080A2 Semiconductor integrated circuits with high breakdown voltage |
| 12/05/2007 | EP1863079A2 Apparatus with filet radius joints |
| 12/05/2007 | EP1863078A2 Method for determining the electrically active dopant density profile in ultra-shallow junction (USJ) structures |
| 12/05/2007 | EP1863077A2 Substrate, substrate inspecting method and methods of manufacturing an element and a substrate |
| 12/05/2007 | EP1863076A1 Method for evaluating semiconductor wafer dopant contamination |
| 12/05/2007 | EP1863075A1 Group iii nitride semiconductor device and epitaxial substrate |
| 12/05/2007 | EP1863074A2 Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal substrate with epitaxial layer and semiconductor device |
| 12/05/2007 | EP1863073A1 Polishing pad |
| 12/05/2007 | EP1863072A1 Method for modulating the effective work function |
| 12/05/2007 | EP1863071A1 Shot shape measuring method, mask |
| 12/05/2007 | EP1863070A1 Exposure apparatus and method for manufacturing device |
| 12/05/2007 | EP1863069A2 Ferroelectric capacitor, method of manufacturing ferroelectric capacitor, and ferroelectric memory |
| 12/05/2007 | EP1862855A1 Photosensitive resin composition |
| 12/05/2007 | EP1862790A1 Defective particle measuring apparatus and defective particle measuring method |
| 12/05/2007 | EP1862711A2 Processing apparatus and processing method |
| 12/05/2007 | EP1862280A1 Method for cutting brittle material substrate and substrate cutting system |
| 12/05/2007 | EP1862259A1 Workpiece centering apparatus and method of centering workpiece |
| 12/05/2007 | EP1861916A2 Mettalic dispersion and formation of compound film for photovoltaic device active layer |
| 12/05/2007 | EP1861875A2 Integrated circuit capacitor having antireflective dielectric |
| 12/05/2007 | EP1861874A2 Method for reducing dielectric overetch when making contact to conductive features |
| 12/05/2007 | EP1861873A1 Method of producing a hetero-structure comprising at least one thick layer of semiconductor material |
| 12/05/2007 | EP1861872A1 Method for linking a chip and a substrate |
| 12/05/2007 | EP1861871A1 Treatment of items |
| 12/05/2007 | EP1861870A2 Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
| 12/05/2007 | EP1861869A1 Vapor phase treatment of dielectric materials |
| 12/05/2007 | EP1861868A2 Method and apparatus for monitoring plasma conditions in an etching plasma processing facility |
| 12/05/2007 | EP1861867A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| 12/05/2007 | EP1861865A1 Diamond based substrate for electronic devices |
| 12/05/2007 | EP1861864A1 Pitch reduced patterns relative to photolithography features |
| 12/05/2007 | EP1861697A1 Quantum dot template for fast and simultaneous detection of different infectious agents |
| 12/05/2007 | EP1581667B1 Support system for a treatment apparatus |
| 12/05/2007 | EP1554033A4 Improved semiconductor stress buffer coating edge bead removal compositions and method for their use |
| 12/05/2007 | EP1538672B1 Semiconductor device |
| 12/05/2007 | EP1523697B1 Method for the production of photoresist structures |
| 12/05/2007 | EP1470432B1 Predictive, adaptive power supply for an integrated circuit under test |
| 12/05/2007 | EP1453991A4 Electrolytic processing apparatus and method |
| 12/05/2007 | EP1371089B1 Fabrication method of soi semiconductor devices |
| 12/05/2007 | EP1365445B1 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium |
| 12/05/2007 | EP1258033B1 Tungsten gate electrode method |