Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/19/2007CN101090072A Method for removing defect on back side of chip
12/19/2007CN101090071A 等离子体掺杂方法 Plasma doping method
12/19/2007CN101090070A 等离子体掺杂方法 Plasma doping method
12/19/2007CN101090069A 等离子体掺杂方法 Plasma doping method
12/19/2007CN101090068A 等离子体掺杂方法 Plasma doping method
12/19/2007CN101090067A Manufacturing method of semiconductor device
12/19/2007CN101090066A Resistor element adjusting method, resistor element and current generating device
12/19/2007CN101090065A Process including silo-chloro passivation for etching tungsten silicide overlying polysilicon
12/19/2007CN101090064A Liquid processing apparatus and method
12/19/2007CN101090063A Liquid processing apparatus
12/19/2007CN101090062A Method of storing gan substrate, stored substrate and semiconductor device and method of its manufacture
12/19/2007CN101090061A Method and apparatus for cleaning substrates
12/19/2007CN101090025A Helix induction element with multilayer structure
12/19/2007CN101089758A Automatic methods and systems for manufacturing recipe feedback control
12/19/2007CN101089733A A method of characterising the transmission losses of an optical system
12/19/2007CN101089731A Fabrication apparatus and method of fabricating a soft mold using same
12/19/2007CN101089730A Method for raising fine quality of semiconductor chip
12/19/2007CN101089707A Orientation control electrode arrangement for an active matrix vertical alignment LCD
12/19/2007CN101089692A Multi-domain vertical orientation mode liquid crystal display device and substrate manufacturing method thereof
12/19/2007CN101089677A Silicon-base liquid crystal display device and its manufacturing and detection method
12/19/2007CN101089643A Ball grid array package element investigating method and socket set of true system
12/19/2007CN101089642A Method of accelerating hot carrier injection investigating
12/19/2007CN101089220A Process kit and target for substrate processing chamber
12/19/2007CN101088893A 输送系统 Delivery system
12/19/2007CN101088717A Wireless 3D displacement correcting system for mechanical arm
12/19/2007CN100356822C 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/19/2007CN100356687C Latch circuit
12/19/2007CN100356674C 升压时钟生成电路及半导体装置 When the boost clock generation circuit and semiconductor device
12/19/2007CN100356642C C-MgxZn1-xO/MgO multi-quantum sink heterogeneous structural materials and producing process thereof
12/19/2007CN100356594C Method for improving ohmic contact alloy of gallium nitrate based semiconductor LED
12/19/2007CN100356590C Light emitting element and method for manufacturing thereof
12/19/2007CN100356589C Baking oven for photovoltaic devices
12/19/2007CN100356585C Longitudinal quantum polka-dot floating grid tip structure, preparing method and storage thereof
12/19/2007CN100356584C Film transistor and manufacturing method thereof
12/19/2007CN100356583C Thin-film semiconductor device and its manufacturing method
12/19/2007CN100356582C Semiconductor device with silicide film and method of manufacturing the same
12/19/2007CN100356581C Semiconductor device and method of manufacturing the same
12/19/2007CN100356579C Semiconductor device and its manufacturing method
12/19/2007CN100356578C Nitride based transistors on semi-insulating silicon carbide substrates
12/19/2007CN100356577C Double-gate transistor with enhanced carrier mobility
12/19/2007CN100356574C Method for making a colour image sensor with recessed contact apertures prior to thinning
12/19/2007CN100356572C Flash memory unit and mfg. method
12/19/2007CN100356570C Floating gate of flash memory cell and method for making same and a flash memory cell
12/19/2007CN100356569C Semiconductor device and its manufacturing method
12/19/2007CN100356568C Semiconductor device and electronic apparatus capable of detecting open wire using weak current
12/19/2007CN100356566C Semiconductor device with micro electromechanical system
12/19/2007CN100356565C Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system
12/19/2007CN100356563C Semiconductor device and its manufacture
12/19/2007CN100356562C Semiconductor apparatus and method of fabricating the same
12/19/2007CN100356560C Semiconductor device and method of manufacturing the device
12/19/2007CN100356559C Crystal coated packing structure and its mfg method
12/19/2007CN100356554C Integrated radiating base plate and making method thereof
12/19/2007CN100356553C Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent
12/19/2007CN100356552C Production of dynamic random access memory
12/19/2007CN100356551C Dynamic random access storage unit and its manufacturing method
12/19/2007CN100356550C Cmos图像传感器及其制造方法 Cmos image sensor and its manufacturing method
12/19/2007CN100356549C Method of cutting semiconductor wafer and protective sheet used in the cutting method
12/19/2007CN100356548C Via reactive ion etching process
12/19/2007CN100356547C Manufacturable cowp metal cap process for copper interconnects
12/19/2007CN100356546C Semiconductor device and method fabricating the same
12/19/2007CN100356545C Method and structure for lowering contact electric resistance in double inlay structure of semiconductor device
12/19/2007CN100356544C Method for forming STI structures with controlled step height
12/19/2007CN100356543C Semiconductor device and method for producing the same
12/19/2007CN100356542C Method of fabricating semiconductor probe with resistive tip
12/19/2007CN100356541C Apparatus and method for cleaning probe card contacts
12/19/2007CN100356540C Electronic component mounting apparatus and electronic component mounting method
12/19/2007CN100356539C RFID tag and method of manufacturing the same
12/19/2007CN100356538C Joining method and joining device
12/19/2007CN100356537C Method of manufacturing semiconductor device
12/19/2007CN100356536C Method of microelectrode connection and connected structure of use thereof
12/19/2007CN100356535C Flexible wiring base material and process for producing the same
12/19/2007CN100356534C Semiconductor packing structure and production thereof
12/19/2007CN100356533C Central welding pad memory body stacking encapsulating assembly and encapsulating process thereof
12/19/2007CN100356532C Liquid resin dropping packaging method
12/19/2007CN100356531C Apparatus for picking up semiconductor chip and picking up method thereof
12/19/2007CN100356530C Mfg. method for semiconductor device
12/19/2007CN100356529C Printing apptsl for conductive material, cleaning method of printing mask, and cleaning program of printing mask
12/19/2007CN100356528C Method for making MOS transistor with source-drain on insulating layer
12/19/2007CN100356527C Method for making MOS transistor with source-drain on insulating layer
12/19/2007CN100356526C Method of manufacturing transistor
12/19/2007CN100356525C Strained finFETs and method of manufacture
12/19/2007CN100356524C Method for producing semi-insulating resistivity in high purity silicon carbide crystals
12/19/2007CN100356523C Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
12/19/2007CN100356522C Method for preparing titanium silicide nano line by chemical gas phase deposition method
12/19/2007CN100356521C Ordered two-phase dielectric film, and semiconductor device containing the same
12/19/2007CN100356520C System and method for identifying dummy features on a mask layer
12/19/2007CN100356519C Precursor containing a nitrogen compound bound to hfcl4 for hafnium oxide layer and method for forming hafnium oxide film using the precursor
12/19/2007CN100356518C Deposition method for dielectric layer
12/19/2007CN100356517C Semiconductor substrate and thin processing method for semiconductor substrate
12/19/2007CN100356516C Single-layer polishing pad and method of producing the same
12/19/2007CN100356515C Polishing pad and semiconductor substrate manufacturing method using the polishing pad
12/19/2007CN100356514C Method for forming polycrystalline silicon-germanium layer
12/19/2007CN100356513C Semi conductor element having reduced spacing and its forming method
12/19/2007CN100356512C Method of manufacturing wiring board
12/19/2007CN100356511C Film forming method and substrate board treatment method
12/19/2007CN100356510C Semiconductor device and manufacturing method for the same
12/19/2007CN100356509C Method for forming polycrystalline silicon film
12/19/2007CN100356508C LSI package, heat radiator and interface module for installation of heat radiator
12/19/2007CN100356507C Direct bonding method for indium phosphide and gallium arsenide materials
12/19/2007CN100356506C Crystal mask, amorphous silicon crystallization method and method of manufacturing array base plate using same
1 ... 2777 2778 2779 2780 2781 2782 2783 2784 2785 2786 2787 2788 2789 2790 2791 2792 2793 2794 2795 2796 2797 ... 6590