| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 12/18/2007 | US7309624 Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame |
| 12/18/2007 | US7309623 Method of fabricating a stacked die in die BGA package |
| 12/18/2007 | US7309622 Integrated circuit package system with heat sink |
| 12/18/2007 | US7309621 Method to fabricate a nanowire CHEMFET sensor device using selective nanowire deposition |
| 12/18/2007 | US7309620 Use of sacrificial layers in the manufacture of high performance systems on tailored substrates |
| 12/18/2007 | US7309619 Light-emitting element, production method thereof, and light-emitting apparatus |
| 12/18/2007 | US7309618 Method and apparatus for real time metal film thickness measurement |
| 12/18/2007 | US7309617 MRAM memory cell with a reference layer and method for fabricating |
| 12/18/2007 | US7309616 Laser annealing of complex metal oxides (CMO) memory materials for non-volatile memory integrated circuits |
| 12/18/2007 | US7309563 Patterning using wax printing and lift off |
| 12/18/2007 | US7309534 Three layers, each composed of gallium, aluminum, and/or indium nitrides; second layer includes greater defects in crystal structure, such as a dislocation density, than those of the first and third layers; formed from melt including an alkali or alkaline-earth metal; high quality |
| 12/18/2007 | US7309529 Structure and method for improved adhesion between two polymer films |
| 12/18/2007 | US7309514 Electron beam modification of CVD deposited films, forming low dielectric constant materials |
| 12/18/2007 | US7309449 Substrate processing method |
| 12/18/2007 | US7309448 Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material |
| 12/18/2007 | US7309447 Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold |
| 12/18/2007 | US7309413 Providing electrical contact to the surface of a semiconductor workpiece during processing |
| 12/18/2007 | US7309407 Method and apparatus for forming an electrical contact with a semiconductor substrate |
| 12/18/2007 | US7309406 Method and apparatus for plating and polishing semiconductor substrate |
| 12/18/2007 | US7309395 System for forming composite polymer dielectric film |
| 12/18/2007 | US7309394 Ultraviolet light-emitting device in which p-type semiconductor is used |
| 12/18/2007 | US7308999 Die bonding apparatus |
| 12/18/2007 | US7308757 Intermediate product manufacturing apparatus, and intermediate product manufacturing method |
| 12/18/2007 | US7308756 Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method |
| 12/18/2007 | CA2432334C Silicon nanoparticle electronic switches |
| 12/18/2007 | CA2244505C Heat sink for semiconductors and manufacturing process thereof |
| 12/13/2007 | WO2007143730A2 Semiconductor device with high current performance packaging |
| 12/13/2007 | WO2007143708A1 Variable overlap of dummy shapes for improved rapid thermal anneal uniformity |
| 12/13/2007 | WO2007143661A2 Thermally enchanced bga packages and methods |
| 12/13/2007 | WO2007143466A1 Semiconductor device fabricated using a metal microstructure control process |
| 12/13/2007 | WO2007143387A2 Conductive hard mask to protect patterned features during trench etch |
| 12/13/2007 | WO2007143289A1 Engineering strain in thick strained-soi substrates |
| 12/13/2007 | WO2007143269A1 Die level metal density gradient for improved flip chip package reliability |
| 12/13/2007 | WO2007143129A2 Microelectromechanical systems having stored charge and methods for fabricating and using same |
| 12/13/2007 | WO2007143072A2 Wet etch suitable for creating square cuts in si and resulting structures |
| 12/13/2007 | WO2007143058A2 Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same |
| 12/13/2007 | WO2007143029A1 Porous materials derived from polymer composites |
| 12/13/2007 | WO2007143009A2 Self aligned gate and guard ring structure for use in a sit |
| 12/13/2007 | WO2007142975A2 Resonating conductive traces and methods of using same for bonding components |
| 12/13/2007 | WO2007142969A1 Isolation structures for integrated circuits and modular methods of forming the same |
| 12/13/2007 | WO2007142911A2 Semiconductor on insulator structure made using radiation annealing |
| 12/13/2007 | WO2007142910A2 Producing soi structure using high-purity ion shower |
| 12/13/2007 | WO2007142894A2 Apparatus and method of forming a mosfet with atomic layer deposited gate dielectric |
| 12/13/2007 | WO2007142802A2 Method of wafer-to-wafer bonding |
| 12/13/2007 | WO2007142612A1 Apparatus and method for cleaning, etching, activation and subsequent treatment of glass surfaces, glass surfaces coated by metal oxides, and surfaces of other sio2-coated materials |
| 12/13/2007 | WO2007142603A1 An integrated shadow mask and method of fabrication thereof |
| 12/13/2007 | WO2007142439A1 Method of transferring substrate using vacuum absorption |
| 12/13/2007 | WO2007142413A1 Method of fabricating cantilever type probe and method of fabricating probe card using the same |
| 12/13/2007 | WO2007142399A1 Method of preventing generation of arc during rapid annealing by joule heating |
| 12/13/2007 | WO2007142395A1 Vacuum gate valve |
| 12/13/2007 | WO2007142351A1 Apparatus with mobile body, exposure apparatus, exposure method and device manufacturing method |
| 12/13/2007 | WO2007142350A1 Pattern formation method, pattern formation device, exposure method, exposure device, and device manufacturing method |
| 12/13/2007 | WO2007142329A1 Film forming apparatus, film forming method, computer program and storage medium |
| 12/13/2007 | WO2007142239A1 Semiconductor device |
| 12/13/2007 | WO2007142238A1 Semiconductor element, method for manufacturing the semiconductor element, electronic device and method for manufacturing the electronic device |
| 12/13/2007 | WO2007142209A1 Method for pattern formation and high-carbon-containing resin composition |
| 12/13/2007 | WO2007142204A1 Probe card |
| 12/13/2007 | WO2007142175A1 Method of bonding |
| 12/13/2007 | WO2007142172A1 Multi-layered wiring manufacturing method, multi-layered wiring structure, and multi-layered wiring manufacturing apparatus |
| 12/13/2007 | WO2007142138A1 Mram using 2t2mtj cell |
| 12/13/2007 | WO2007142107A1 Power ic device and method for manufacturing same |
| 12/13/2007 | WO2007142088A1 Method of forming resist pattern by nanoimprint lithography |
| 12/13/2007 | WO2007142058A1 Method for analyzing quartz member |
| 12/13/2007 | WO2007142056A1 Gas introduction device, method of manufacturing the same, and processing device device |
| 12/13/2007 | WO2007142026A1 Method of judging cop occurrence cause for single crystal silicon wafer |
| 12/13/2007 | WO2007142024A1 Single-crystal silicon wafer cop evaluation method |
| 12/13/2007 | WO2007142015A1 Excess voltage protection circuit, method of protecting a circuit from excess voltage, and semiconductor apparatus having the excess voltage protection ciruit |
| 12/13/2007 | WO2007142010A1 Semiconductor device and method for manufacturing the same |
| 12/13/2007 | WO2007142000A1 Precursor composition for porous membrane, process for preparation of the precursor composition, porous membrane, process for production of the porous membrane, and semiconductor device |
| 12/13/2007 | WO2007141990A1 Method for producing wafer |
| 12/13/2007 | WO2007141966A1 Device for mounting electronic part |
| 12/13/2007 | WO2007141931A1 Semiconductor device composed of chips and semiconductor examining method |
| 12/13/2007 | WO2007141870A1 Ring oscillator for temperature sensor, temperature sensor circuit and semiconductor device provided with such temperature sensor circuit |
| 12/13/2007 | WO2007141852A1 Exposure method and exposure apparatus |
| 12/13/2007 | WO2007141849A1 Semiconductor integrated circuit |
| 12/13/2007 | WO2007141836A1 Method for manufacturing inlet for ic tag |
| 12/13/2007 | WO2007141447A1 Device for the transport, storage and transfer of substrates |
| 12/13/2007 | WO2007141191A1 Method to prevent metal contamination by a substrate holder |
| 12/13/2007 | WO2007141048A1 Insulation layer material for microelectronics |
| 12/13/2007 | WO2007121114A3 Transfer tape strap process |
| 12/13/2007 | WO2007120959A3 Method for planarizing vias formed in a substrate |
| 12/13/2007 | WO2007120312A3 Sensing devices from molecular electronic devices |
| 12/13/2007 | WO2007118031A3 Silicon oxynitride gate dielectric formation using multiple annealing steps |
| 12/13/2007 | WO2007117805A3 Method of separating semiconductor dies |
| 12/13/2007 | WO2007109491A3 Selective deposition |
| 12/13/2007 | WO2007109428A3 Packaging method of chip or package equipped with bumps |
| 12/13/2007 | WO2007109117A3 Dry etch stop process for eliminating electrical shorting in mram device structures |
| 12/13/2007 | WO2007108932A8 Technique for preparing precursor films and compound layers for thin film solar cell fabrication and apparatus corresponding thereto |
| 12/13/2007 | WO2007106788A3 Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films |
| 12/13/2007 | WO2007106660A3 Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system |
| 12/13/2007 | WO2007102138A3 Barrier slurry compositions and barrier cmp methods |
| 12/13/2007 | WO2007095488A3 Apparatus and method for preventing haze growth on a surface of a substrate |
| 12/13/2007 | WO2007092551A3 Stress liner for integrated circuits |
| 12/13/2007 | WO2007079077A3 Germanium on glass and glass-ceramic structures |
| 12/13/2007 | WO2007069188A3 Mos transistor and a method of manufacturing a mos transistor |
| 12/13/2007 | WO2007048108A3 Monolithically-pumped erbium-doped waveguide amplifiers and lasers |
| 12/13/2007 | WO2007044530A3 Methods and apparatus for epitaxial film formation |
| 12/13/2007 | WO2007024469A3 Crack-free iii-v epitaxy on germanium on insulator (goi) substrates |
| 12/13/2007 | WO2007022277A3 Siox:si composite articles and methods of making same |
| 12/13/2007 | WO2007018495A3 Method for controlling dislocation positions in silicon germanium buffer layers |