Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/06/2007US20070281490 Electron beam writing data creating method and electron beam writing data creating apparatus
12/06/2007US20070281489 Methods for minimizing mask undercuts and notches for plasma processing system
12/06/2007US20070281488 Methods of fabricating intermediate semiconductor structures by selectively etching pockets of implanted silicon
12/06/2007US20070281487 Method for an integrated circuit contact
12/06/2007US20070281486 Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry composition
12/06/2007US20070281485 Method of and apparatus for semiconductor device
12/06/2007US20070281484 Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal substrate with epitaxial layer and semiconductor device
12/06/2007US20070281483 Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection
12/06/2007US20070281482 Method for CMP with variable down-force adjustment
12/06/2007US20070281481 Controlled growth of gallium nitride nanostructures
12/06/2007US20070281480 Method for fabricating semiconductor device having capacitor
12/06/2007US20070281479 Process including silo-chloro passivation for etching tungsten silicide overlying polysilicon
12/06/2007US20070281478 Plasma processing method and apparatus
12/06/2007US20070281477 Process for etching tungsten silicide overlying polysilicon particularly in a flash memory
12/06/2007US20070281476 Methods for forming thin copper films and structures formed thereby
12/06/2007US20070281475 Diethylsilane As A Silicon Source In The Deposition Of Metal Silicate Films
12/06/2007US20070281474 Manufacturing method of semiconductor device
12/06/2007US20070281473 Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
12/06/2007US20070281472 Method of increasing transistor performance by dopant activation after silicidation
12/06/2007US20070281471 Advanced Multilayered Coreless Support Structures and their Fabrication
12/06/2007US20070281470 Semiconductor device and method for manufacturing the same
12/06/2007US20070281469 Modified via bottom structure for reliability enhancement
12/06/2007US20070281468 Top layers of metal for high performance IC's
12/06/2007US20070281467 Top layers of metal for high performance IC's
12/06/2007US20070281466 Front-end processed wafer having through-chip connections
12/06/2007US20070281465 Semiconductor device and method for fabricating the same
12/06/2007US20070281464 Multi-layer circuit board with fine pitches and fabricating method thereof
12/06/2007US20070281463 Top layers of metal for high performance IC's
12/06/2007US20070281462 Method for manufacturing silicon carbide semiconductor device
12/06/2007US20070281461 Semiconductor device having a contact structure with a contact spacer and method of fabricating the same
12/06/2007US20070281460 Front-end processed wafer having through-chip connections
12/06/2007US20070281459 Multilayer Substrate Manufacturing Method
12/06/2007US20070281458 Top layers of metal for high performance IC's
12/06/2007US20070281457 Copper layer and a method for manufacturing said copper layer
12/06/2007US20070281456 Method of forming line of semiconductor device
12/06/2007US20070281455 Semiconductor device with bulb recess and saddle fin and method of manufacturing the same
12/06/2007US20070281454 Method of manufacturing semiconductor device for formation of pin transistor
12/06/2007US20070281453 Electronic component, laser device, optical writing device and image forming apparatus
12/06/2007US20070281452 Methods of forming carbon nanotubes and methods of fabricating integrated circuitry
12/06/2007US20070281451 Method for forming Schottky Diodes and Ohmic Contacts in the Same Integrated Circuit
12/06/2007US20070281450 Use of Scanning Theme Implanters and Annealers for Selective Implantation and Annealing
12/06/2007US20070281449 Substrate transportation method and apparatus
12/06/2007US20070281448 Novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide
12/06/2007US20070281447 Method of loading and/or unloading wafer in semiconductor manufacturing apparatus
12/06/2007US20070281446 Dual surface SOI by lateral epitaxial overgrowth
12/06/2007US20070281445 Method for Self-Supported Transfer of a Fine Layer by Pulsation after Implantation or Co-Implantation
12/06/2007US20070281444 Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method
12/06/2007US20070281443 Method of manufacturing devices, positioning method, dicing method and dicing apparatus
12/06/2007US20070281442 Power semiconductor
12/06/2007US20070281441 Semiconductor substrate and process for producing it
12/06/2007US20070281440 Producing SOI structure using ion shower
12/06/2007US20070281439 Techniques for Layer Transfer Processing
12/06/2007US20070281438 Methods and apparatus for RF shielding in vertically-integrated semiconductor devices
12/06/2007US20070281437 Image sensor applied with device isolation technique for reducing dark signals and fabrication method thereof
12/06/2007US20070281436 Trench liner for DSO integration
12/06/2007US20070281435 Engineering strain in thick strained-soi substrates
12/06/2007US20070281434 Capacitor of semiconductor device applying damascene process and method of fabricating the same
12/06/2007US20070281433 A method for reducing dislocation threading using a suppression implant
12/06/2007US20070281432 Transistor and method of providing interlocking strained silicon on a silicon substrate
12/06/2007US20070281431 Formation of fully silicided (fusi) gate using a dual silicide process
12/06/2007US20070281430 Electro-optical device and electronic apparatus
12/06/2007US20070281429 Method for fabricating semiconductor device
12/06/2007US20070281428 Semiconductor device having an oxide film formed on a semiconductor substrate sidewall of an element region and on a sidewall of a gate electrode
12/06/2007US20070281427 Bottom conductor for integrated MRAM
12/06/2007US20070281426 Method and apparatus transporting charges in semiconductor device and semiconductor memory device
12/06/2007US20070281425 Method and apparatus transporting charges in semiconductor device and semiconductor memory device
12/06/2007US20070281424 Semiconductor device and method of its formation
12/06/2007US20070281423 Method for manufacuring semiconductor device
12/06/2007US20070281422 Mitigation of edge degradation in ferroelectric memory devices through plasma etch clean
12/06/2007US20070281421 Device and method for making air, gas or vacuum capacitors and other microwave components
12/06/2007US20070281420 Resistor random access memory cell with reduced active area and reduced contact areas
12/06/2007US20070281419 Titanium dioxide thin film systems and method of making same
12/06/2007US20070281418 Formation of high sheet resistance resistors and high capacitance capacitors by a single polysilicon process
12/06/2007US20070281417 Manufacturing method for an integrated semiconductor structure
12/06/2007US20070281416 Manufacturing method for an integrated semiconductor structure
12/06/2007US20070281415 Semiconductor device and manufacturing method thereof
12/06/2007US20070281414 Semiconductor device and method of manufacturing the same
12/06/2007US20070281413 N-channel mosfets comprising dual stressors, and methods for forming the same
12/06/2007US20070281412 Ambipolar organic thin-film field-effect transistor and making method
12/06/2007US20070281411 Formation of strain-inducing films
12/06/2007US20070281410 Spacer-less low-k dielectric processes
12/06/2007US20070281409 Multi-gate carbon nano-tube transistors
12/06/2007US20070281408 Versatile System for Cross-Lateral Junction Field Effect Transistor
12/06/2007US20070281407 Versatile System for Cross-Lateral Junction Field Effect Transistor
12/06/2007US20070281406 Method of making a self aligned ion implanted gate and guard ring structure for use in a sit
12/06/2007US20070281405 Methods of stressing transistor channel with replaced gate and related structures
12/06/2007US20070281404 Poly silicon layer and method of fabricating the same
12/06/2007US20070281403 Method of enhancing gate lithography performance by polysilicon chemical-mechanical polishing
12/06/2007US20070281402 Schottky barrier tunnel single electron transistor and method of manufacturing the same
12/06/2007US20070281401 Semiconductor device and method of fabricating the same
12/06/2007US20070281400 Semiconductor device and manufacturing method thereof
12/06/2007US20070281399 Producing SOI structure using high-purity ion shower
12/06/2007US20070281398 Device Structures for Reducing Device Mismatch Due to Shallow Trench Isolation Induced Oxides Stresses
12/06/2007US20070281397 Method of forming semiconductor packaged device
12/06/2007US20070281396 Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
12/06/2007US20070281395 Method and system for fabricating a semiconductor device
12/06/2007US20070281394 Method for manufacturing wiring board
12/06/2007US20070281393 Method of forming a trace embedded package
12/06/2007US20070281392 Multiple row exposed leads for mlp high density packages
12/06/2007US20070281391 Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device
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