Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2007
12/27/2007US20070298546 Manufacturing method package substrate
12/27/2007US20070298545 Method of manufacturing a semiconductor device
12/27/2007US20070298544 Manufacturing method for a leadless multi-chip electronic module
12/27/2007US20070298543 Method for Manufacturing Heat Sink of Semiconductor Device
12/27/2007US20070298542 Multiple internal seal ring micro-electro-mechanical system vacuum packaging method
12/27/2007US20070298541 Method and system for sealing a substrate
12/27/2007US20070298540 Dicing and Packing Metod of Sheet-Like Wafer, Packed Product of Water, and Separation Jig
12/27/2007US20070298539 Method For Bonding Semiconductor Chip
12/27/2007US20070298538 Liquid crystal display device
12/27/2007US20070298537 Diamond composite heat spreader and associated methods
12/27/2007US20070298536 Single-crystal metal nanocrystals
12/27/2007US20070298535 Memory Cell With Memory Material Insulation and Manufacturing Method
12/27/2007US20070298534 Electronic device and method of manufacturing the same
12/27/2007US20070298533 Method and apparatus providing imager pixel array with grating structure and imager device containing the same
12/27/2007US20070298532 Micro-Electro-mechanical (MEMS) encapsulation using buried porous silicon
12/27/2007US20070298531 Quantum Well Intermixing in Semiconductor Photonic Devices
12/27/2007US20070298529 Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
12/27/2007US20070298528 Semiconductor laser manufacturing method
12/27/2007US20070298527 Determining geometrical configuration of interconnect structure
12/27/2007US20070298525 Integrated microelectronic package stress sensor
12/27/2007US20070298524 Methods of quantifying variations resulting from manufacturing-induced corner rounding of various features, and structures for testing same
12/27/2007US20070298523 Silicon wafers and method of fabricating the same
12/27/2007US20070298522 Method and apparatus for process control with in-die metrology
12/27/2007US20070298521 Method for cleaning post-etch noble metal residues
12/27/2007US20070298520 Method of Producing an Element Comprising an Electrical Conductor Encircled By Magnetic Material
12/27/2007US20070298335 Exposure Condition Setting Method, Substrate Processing Device, and Computer Program
12/27/2007US20070298332 Recesses are etched on surface of substrate to change refractive index of incident light; ultrafine patterns formed with decreased impact by proximity effect; photoresists; lithography
12/27/2007US20070298284 Low resistance TMR read head fabricated by a novel oxidation method
12/27/2007US20070298276 Au Bonding Wire For Semiconductor Device
12/27/2007US20070297878 Substrate transfer apparatus featuring lower and upper pneumatic sucker arms, and substrate transfer method carried ou in such substrate transfer apparatus
12/27/2007US20070297876 Heat Treatment Apparatus and Method of Manufacturing Substrate
12/27/2007US20070297775 Heating Configuration for Use in Thermal Processing Chambers
12/27/2007US20070297257 Semiconductor memory device capable of canceling out noise development
12/27/2007US20070297216 Self-assembly of molecular devices
12/27/2007US20070297151 Compliant conductive interconnects
12/27/2007US20070297118 Electrostatic Chuck Device
12/27/2007US20070297101 Magnetoresistive element and magnetic memory device
12/27/2007US20070296980 Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control
12/27/2007US20070296940 Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure method, device manufacturing method
12/27/2007US20070296885 Contact for semiconductor and display devices
12/27/2007US20070296884 Array substrate, liquid crystal display device having the same, and manufacturing method thereof
12/27/2007US20070296470 Semiconductor integrated circuit controlling output impedance and slew rate
12/27/2007US20070296440 Semiconductor integrated circuit apparatus, measurement result management system, and management server
12/27/2007US20070296431 Membrane probing system with local contact scrub
12/27/2007US20070296335 Process for Producing Layered Member and Layered Member
12/27/2007US20070296091 Semiconductor device having symbol pattern utilized as indentification sign and its manufacture method
12/27/2007US20070296089 Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
12/27/2007US20070296088 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
12/27/2007US20070296084 Small grain size, conformal aluminum interconnects and method for their formation
12/27/2007US20070296083 Low dielectric constant integrated circuit insulators and methods
12/27/2007US20070296082 Semiconductor device having conductive adhesive layer and method of fabricating the same
12/27/2007US20070296079 Heat dissipating structure and method for fabricating the same
12/27/2007US20070296077 Semiconductor component and method of manufacture
12/27/2007US20070296073 Three dimensional integrated circuit and method of making the same
12/27/2007US20070296070 Semiconductor package having functional and auxiliary leads, and process for fabricating it
12/27/2007US20070296064 Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same
12/27/2007US20070296061 Group III-Nitride Crystal Substrate and Manufacturing Method Thereof, and Group III-Nitride Semiconductor Device
12/27/2007US20070296060 Method for Forming P-Type Semiconductor Region, and Semiconductor Element
12/27/2007US20070296059 Semiconductor device
12/27/2007US20070296058 Semiconductor structure of a high side driver and method for manufacturing the same
12/27/2007US20070296053 Semiconductor device and method of forming the same
12/27/2007US20070296048 Double gate transistor, method of manufacturing same, and system containing same
12/27/2007US20070296046 Semiconductor device and method of manufacture thereof
12/27/2007US20070296038 High performance stress-enhanced mosfets using si:c and sige epitaxial source/drain and method of manufacture
12/27/2007US20070296037 Semiconductor device and manufacturing method of semiconductor device
12/27/2007US20070296036 SOI device with contact trenches formed during epitaxial growing
12/27/2007US20070296033 Non-volatile memory device having four storage node films and methods of operating and manufacturing the same
12/27/2007US20070296031 Semiconductor device and manufacture method thereof
12/27/2007US20070296030 Semiconductor integrated circuit device having deposited layer for gate insulation
12/27/2007US20070296028 Vertical Field-Effect Transistor and Method of Forming the Same
12/27/2007US20070296027 Cmos devices comprising a continuous stressor layer with regions of opposite stresses, and methods of fabricating the same
12/27/2007US20070296026 SONOS memory device
12/27/2007US20070296021 Nonvolatile semiconductor memory with backing wirings and manufacturing method thereof
12/27/2007US20070296019 Non-volatile electromechanical field effect devices and circuits using same and methods of forming same
12/27/2007US20070296016 Semiconductor device and method of manufacturing the same
12/27/2007US20070296009 Semiconductor device including a capacitance
12/27/2007US20070295995 Methods of forming a semiconductor device including buried bit lines
12/27/2007US20070295993 Low Density Drain HEMTs
12/27/2007US20070295992 Hetero junction field effect transistor and method of fabricating the same
12/27/2007US20070295991 Semiconductor device and manufacturing method of the same
12/27/2007US20070295990 Gan-Based Field Effect Transistor and Production Method Therefor
12/27/2007US20070295989 Strained semiconductor device and method of making same
12/27/2007US20070295986 Method of fabricating vertical structure LEDs
12/27/2007US20070295985 Gallium nitride material devices and methods of forming the same
12/27/2007US20070295982 Micro universal serial bus memory package and manufacturing method the same
12/27/2007US20070295980 Semiconductor Light Emitting Device, Illuminating Device, Mobile Communication Device, Camera, and Manufacturing Method Therefor
12/27/2007US20070295978 Light emitting diode with direct view optic
12/27/2007US20070295977 Optical semiconductor device and method of manufacturing the same
12/27/2007US20070295976 Semiconductor Device And Production Method Thereof
12/27/2007US20070295973 Method for manufacturing semiconductor device
12/27/2007US20070295970 Base apparatus of a light emitting diode and method for manufacturing the light emitting diode
12/27/2007US20070295967 Active matrix tft array substrate and method of manufacturing the same
12/27/2007US20070295965 Thin film transistor, method of fabricating the same, and method of fabricating liquid crystal display device having the same
12/27/2007US20070295964 Semiconductor device and method for preparing the same
12/27/2007US20070295955 N-Channel Transistor
12/27/2007US20070295950 Variable resistance random access memory device and a method of fabricating the same
12/27/2007US20070295934 Polishing slurry and polishing method
12/27/2007US20070295918 Method for fabricating semiconductor device and equipment for fabricating the same
12/27/2007US20070295786 Semiconductor device, manufacturing method and apparatus for the same
12/27/2007US20070295455 Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrate
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