| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/24/2014 | WO2014061417A1 Polishing solution for cmp, stock solution, and polishing method |
| 04/24/2014 | WO2014061413A1 Contamination amount measuring method for vapor phase epitaxy device, and manufacturing method for epitaxial wafer |
| 04/24/2014 | WO2014061373A1 Semiconductor device and fabrication method therefor |
| 04/24/2014 | WO2014061367A1 Silicon carbide semiconductor device and method for manufacturing same |
| 04/24/2014 | WO2014061353A1 Substrate processing device |
| 04/24/2014 | WO2014061328A1 Group-iii nitride semiconductor laser element, method for producing group-iii nitride semiconductor laser element, method for evaluating end surface for optical resonator of group-iii nitride semiconductor laser element, and method for evaluating scribe groove |
| 04/24/2014 | WO2014061312A1 Circuit simulation device, circuit simulation method, and program |
| 04/24/2014 | WO2014061272A1 Sputtering target |
| 04/24/2014 | WO2014061271A1 Sputtering target, oxide semiconductor thin film, and methods for producing these |
| 04/24/2014 | WO2014061254A1 Field-effect transistor and semiconductor device |
| 04/24/2014 | WO2014061245A1 Etching material |
| 04/24/2014 | WO2014061204A1 Semiconductor device and method for manufacturing same |
| 04/24/2014 | WO2014061196A1 Soi wafer manufacturing method |
| 04/24/2014 | WO2014061075A1 Semiconductor device and method for manufacturing same |
| 04/24/2014 | WO2014061053A1 Wire saw apparatus, and cut-machining method |
| 04/24/2014 | WO2014060980A1 Semiconductor device fabrication method |
| 04/24/2014 | WO2014060817A1 Method for bonding by means of molecular adhesion |
| 04/24/2014 | WO2014060804A2 Semiconductor device and manufacturing method of semiconductor device |
| 04/24/2014 | WO2014060536A1 Semiconductor heterostructure and method of fabrication thereof |
| 04/24/2014 | WO2014060500A1 Apparatus for and method of handling workpieces |
| 04/24/2014 | WO2014059812A1 Method for manufacturing stacked nano-wire mos transistor |
| 04/24/2014 | WO2014059811A1 Off-axis alignment system and alignment method |
| 04/24/2014 | WO2014059733A1 Semiconductor structure having beryllium oxide |
| 04/24/2014 | WO2014059728A1 Semiconductor device and manufacturing method therefor |
| 04/24/2014 | WO2014059713A1 Thin film transistor array manufacturing method |
| 04/24/2014 | WO2014059687A1 Semiconductor structure and method for manufacturing same |
| 04/24/2014 | WO2014059686A1 Method for manufacturing finfet fin structure |
| 04/24/2014 | WO2014059565A1 Method for manufacturing cmos device |
| 04/24/2014 | WO2014059564A1 Semiconductor device manufacturing method |
| 04/24/2014 | WO2014059563A1 Semiconductor device and manufacturing method thereof |
| 04/24/2014 | WO2014059562A1 Semiconductor device manufacturing method |
| 04/24/2014 | WO2014031968A3 Wavelength converting material deposition methods and associated articles |
| 04/24/2014 | WO2014022619A3 Dual solder layer for fluidic self assembly and electrical component substrate and method employing same |
| 04/24/2014 | WO2013011372A8 Method for separating a layer from a composite structure |
| 04/24/2014 | WO2012122388A3 Chip-last embedded interconnect structures and methods of making the same |
| 04/24/2014 | WO2012118951A3 Silicon germanium mask for deep silicon etching |
| 04/24/2014 | US20140113526 Wafer process control |
| 04/24/2014 | US20140113459 Method for in-situ dry cleaning, passivation and functionalization of ge semiconductor surfaces |
| 04/24/2014 | US20140113458 Minimal contact edge ring for rapid thermal processing |
| 04/24/2014 | US20140113457 Plasma enhanced atomic layer deposition with pulsed plasma exposure |
| 04/24/2014 | US20140113456 Preparation of cerium-containing precursors and deposition of cerium-containing films |
| 04/24/2014 | US20140113455 Method of forming a semiconductor structure including a wet etch process for removing silicon nitride |
| 04/24/2014 | US20140113454 Low profile magnetic filter |
| 04/24/2014 | US20140113453 Tungsten carbide coated metal component of a plasma reactor chamber and method of coating |
| 04/24/2014 | US20140113452 Wafer edge trimming method |
| 04/24/2014 | US20140113451 Method for forming a pattern |
| 04/24/2014 | US20140113450 Plasma etching method |
| 04/24/2014 | US20140113448 Positive photosensitive resin composition for spray coating and method for producing through electrode using the same |
| 04/24/2014 | US20140113447 Electrical Connection for Chip Scale Packaging |
| 04/24/2014 | US20140113446 Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch |
| 04/24/2014 | US20140113445 Al bond pad clean method |
| 04/24/2014 | US20140113444 Active area bonding compatible high current structures |
| 04/24/2014 | US20140113441 Method of manufacturing semiconductor device |
| 04/24/2014 | US20140113440 Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| 04/24/2014 | US20140113439 Method of depositing an amorphous silicon film |
| 04/24/2014 | US20140113438 Method of manufacturing semiconductor device |
| 04/24/2014 | US20140113437 Substrate structure and method of manufacturing the same |
| 04/24/2014 | US20140113436 Method of depositing a film and film deposition apparatus |
| 04/24/2014 | US20140113435 Use of repellent material to protect fabrication regions in semi conductor assembly |
| 04/24/2014 | US20140113434 Process for forming a crack in a material |
| 04/24/2014 | US20140113433 Wafer bonding for 3d device packaging fabrication |
| 04/24/2014 | US20140113432 Semiconductor Fins with Reduced Widths and Methods for Forming the Same |
| 04/24/2014 | US20140113425 Method of fabricating semiconductor device |
| 04/24/2014 | US20140113421 Silicon carbide semiconductor apparatus and method of manufacturing same |
| 04/24/2014 | US20140113420 Methods of avoiding shadowing when forming source/drain implant regions on 3d semiconductor devices |
| 04/24/2014 | US20140113419 Methods of reducing material loss in isolation structures by introducing inert atoms into oxide hard mask layer used in growing channel semiconductor material |
| 04/24/2014 | US20140113418 Method of manufacturing semiconductor device with offset sidewall structure |
| 04/24/2014 | US20140113416 Dielectric for carbon-based nano-devices |
| 04/24/2014 | US20140113415 Method of manufacturing circuit board and chip package and circuit board manufactured by using the method |
| 04/24/2014 | US20140113414 Semiconductor mounting device and method for manufacturing semiconductor mounting device |
| 04/24/2014 | US20140113412 Chip package and fabrication method thereof |
| 04/24/2014 | US20140113410 System in package manufacturing method using wafer-to-wafer bonding |
| 04/24/2014 | US20140113409 Package substrate dynamic pressure structure |
| 04/24/2014 | US20140113407 Semiconductor element and method for manufacturing the same |
| 04/24/2014 | US20140113406 Method for manufacturing semiconductor device |
| 04/24/2014 | US20140113395 Vapor deposition apparatus, method of forming thin film by using vapor deposition apparatus, and method of manufacturing organic light emitting display apparatus |
| 04/24/2014 | US20140113390 Method for Producing Singulated Semiconductor Devices |
| 04/24/2014 | US20140113389 Multi-Wafer Reactor |
| 04/24/2014 | US20140113156 Making semiconductor bodies from molten material using a free-standing interposer sheet |
| 04/24/2014 | US20140112743 Substrate processing system and substrate transfer control method |
| 04/24/2014 | US20140112741 Article Storage Facility and Article Transport Facility |
| 04/24/2014 | US20140112740 Overhead buffer device and wafer transport system |
| 04/24/2014 | US20140112049 Semiconductor memory device and method for manufacturing the same |
| 04/24/2014 | US20140111301 High-Resistance Thin-Film Resistor and Method of Forming the Resistor |
| 04/24/2014 | US20140111269 Through-silicon via self-routing circuit and routing method thereof |
| 04/24/2014 | US20140111234 Die, Chip, Method for Driving a Die or a Chip and Method for Manufacturing a Die or a Chip |
| 04/24/2014 | US20140110894 Wafer Carrier Having Cavity |
| 04/24/2014 | US20140110867 Substrate and Method for Cutting the Substrate |
| 04/24/2014 | US20140110862 TSV Formation |
| 04/24/2014 | US20140110861 Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support |
| 04/24/2014 | US20140110859 Embedding thin chips in polymer |
| 04/24/2014 | US20140110858 Embedded chip packages and methods for manufacturing an embedded chip package |
| 04/24/2014 | US20140110857 Reduction chemistry for etching |
| 04/24/2014 | US20140110856 Fan-Out Wafer Level Package Structure |
| 04/24/2014 | US20140110855 Cd control |
| 04/24/2014 | US20140110853 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 04/24/2014 | US20140110850 Semiconductor device and method for manufacturing the same |
| 04/24/2014 | US20140110845 Damascene gap structure |
| 04/24/2014 | US20140110842 Using a double-cut for mechanical protection of a wafer-level chip scale package (wlcsp) |
| 04/24/2014 | US20140110841 Semiconductor Packages with Integrated Antenna and Methods of Forming Thereof |