Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/16/2014CN103730438A Chip package and method for manufacturing chip package
04/16/2014CN103730435A Semiconductor structure and manufacturing method thereof
04/16/2014CN103730434A Pop structures and methods of forming the same
04/16/2014CN103730433A Electric conducting plug and forming method of electric conducting plug
04/16/2014CN103730430A Multilayer composite membrane passivation structure of table top high-power semiconductor device and manufacturing technology of multilayer composite membrane passivation structure of table top high-power semiconductor device
04/16/2014CN103730426A Air cavity type packaging structure and method
04/16/2014CN103730424A Method for forming non-volatile memory device and configuration thereof
04/16/2014CN103730423A Oxygen-free rapid thermal annealing on gate first high dielectric constant metal gate stacks
04/16/2014CN103730422A Semiconductor device manufacturing method
04/16/2014CN103730421A CMOS forming method
04/16/2014CN103730420A CMOS transistor manufacturing method
04/16/2014CN103730419A Threshold voltage adjusting method
04/16/2014CN103730418A Method for manufacturing semiconductor device
04/16/2014CN103730417A Semiconductor device and manufacturing method thereof
04/16/2014CN103730416A Semiconductor device and manufacturing method thereof
04/16/2014CN103730415A Cleavage device
04/16/2014CN103730414A Method for manufacturing thin film transistor substrate
04/16/2014CN103730413A Manufacturing method of array substrate, array substrate and display device
04/16/2014CN103730412A Metal interconnecting wire formation method
04/16/2014CN103730411A Through-silicon-via (TSV) etching method
04/16/2014CN103730410A Semiconductor device having a self-forming barrier layer at via bottom
04/16/2014CN103730409A Manufacturing method, cleaning method and cleaning system of semiconductor device
04/16/2014CN103730408A Manufacturing method for polycrystalline silicon through hole
04/16/2014CN103730407A Copper connection wire structure and forming method thereof
04/16/2014CN103730406A Method for preparing dual damascene structure
04/16/2014CN103730405A SOI structure and manufacturing method thereof
04/16/2014CN103730404A Method for manufacturing shallow groove isolation
04/16/2014CN103730403A Semiconductor structure and forming method thereof
04/16/2014CN103730402A Method for manufacturing shallow trench isolation
04/16/2014CN103730401A Improved chip clamping device
04/16/2014CN103730400A Centring device for wafers of various sizes
04/16/2014CN103730399A Piece drawing device for semiconductor visual inspection machine
04/16/2014CN103730398A Apparatus for transferring substrate
04/16/2014CN103730397A Partial buried channel transfer device in image sensors
04/16/2014CN103730396A Wafer carrier
04/16/2014CN103730395A Wafer carrier
04/16/2014CN103730394A Fixture for preventing curing shift of bonding adhesive of radiating cover
04/16/2014CN103730393A Gas intake device of plasma etching equipment
04/16/2014CN103730392A Gas supply system of semiconductor processing device
04/16/2014CN103730391A Apparatus and method of surface treatment, method of manufacturing a pad conditioner, and method of manufacturing a semiconductor device
04/16/2014CN103730390A Lead bonding machine and method for testing lead bonding connection
04/16/2014CN103730389A Substrate bonding apparatus and substrate bonding method
04/16/2014CN103730388A Diffusion machine platform
04/16/2014CN103730387A Automatic cell thickness measuring mechanism
04/16/2014CN103730386A Semiconductor silicon wafer laser annealing online detection method based on photocarrier radio technology
04/16/2014CN103730385A Wafer level testing system and method for image sensor
04/16/2014CN103730384A TFT electrical property measuring method and device
04/16/2014CN103730383A Novel thin piece bonding method
04/16/2014CN103730382A Manufacturing method of copper-copper bonding salient points
04/16/2014CN103730381A Chip packaging method
04/16/2014CN103730380A Forming method of packaging structure
04/16/2014CN103730379A Chip packaging method and structure
04/16/2014CN103730378A Forming method of packaging structure
04/16/2014CN103730377A Method of die bonding and apparatus thereof
04/16/2014CN103730376A Packaging test method
04/16/2014CN103730375A OSP surface treatment package substrate forming milling method
04/16/2014CN103730374A Process for manufacturing cavity of package substrate
04/16/2014CN103730373A Manufacturing method of semiconductor device and semiconductor device
04/16/2014CN103730372A Super junction manufacturing method capable of improving withstand voltage of device
04/16/2014CN103730371A Method for manufacturing super junction high-voltage device
04/16/2014CN103730370A Method and structure to boost mosfet performance and nbti
04/16/2014CN103730369A Semiconductor device manufacturing method
04/16/2014CN103730368A Semiconductor device manufacturing method
04/16/2014CN103730367A Semiconductor device manufacturing method
04/16/2014CN103730366A Method for manufacturing stacked nanowire MOS transistor
04/16/2014CN103730365A Structure of transistor and manufacturing method of transistor
04/16/2014CN103730364A Low-temperature polycrystalline silicon thin film transistor, manufacturing method thereof and display device
04/16/2014CN103730363A Semiconductor structure and manufacturing method thereof
04/16/2014CN103730362A Semiconductor device and manufacturing method thereof
04/16/2014CN103730361A Semiconductor device manufacturing method
04/16/2014CN103730360A Enhanced HEMT (high electron mobility transistor) device with back field plate structure and preparation method thereof
04/16/2014CN103730359A Manufacturing method of composite gate media SiC MISFET
04/16/2014CN103730358A Method for producing transistor through silicon single crystal sheets
04/16/2014CN103730357A NPN transistor and forming method
04/16/2014CN103730356A Method for manufacturing back face of power semiconductor device
04/16/2014CN103730355A Method for manufacturing super junction structure
04/16/2014CN103730354A Method for manufacturing germanium-silicon heterojunction bipolar transistor
04/16/2014CN103730353A Method for manufacturing cobalt Schottky diode
04/16/2014CN103730352A Finfet device with silicided source-drain regions and method of making same using a two step anneal
04/16/2014CN103730351A Post-etching ashing method and forming method of magnetic sensor
04/16/2014CN103730350A Method for removing coarse pattern on surface of coarsened material
04/16/2014CN103730349A Method for forming contact hole
04/16/2014CN103730348A Method for reducing plasma etcher cavity pollution in back hole process
04/16/2014CN103730347A Recycled silicon wafer texturing method
04/16/2014CN103730346A Thin film transistor and manufacturing method thereof, array substrate and display device
04/16/2014CN103730345A Semiconductor device manufacturing method
04/16/2014CN103730344A Method for forming silicon oxide side wall of gate of metal tungsten silicide
04/16/2014CN103730343A Semiconductor device structure and manufacturing method thereof
04/16/2014CN103730342A Method for manufacturing semiconductor device
04/16/2014CN103730341A Semiconductor device manufacturing method
04/16/2014CN103730340A Method for improving metal Ni mask selection ratio in back hole process
04/16/2014CN103730339A Methods for manufacturing micro/nano scale pattern stamping die
04/16/2014CN103730338A Semiconductor device manufacturing method
04/16/2014CN103730337A Mask for photolithography process and prepared pattern thereof
04/16/2014CN103730336A Method for defining growth direction of polycrystalline silicon
04/16/2014CN103730335A Radio frequency model method for substrate eddy current of on-chip transformer
04/16/2014CN103730334A Chemical solution recycling device suitable for square substrate
04/16/2014CN103730333A Multi-centre chip stripping device
04/16/2014CN103730332A Delamination drying apparatus and method
04/16/2014CN103730331A Drying method and drying device
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