| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/17/2014 | US20140103455 FET Devices with Oxide Spacers |
| 04/17/2014 | US20140103450 Hybrid orientation fin field effect transistor and planar field effect transistor |
| 04/17/2014 | US20140103449 Oxygen free rta on gate first hkmg stacks |
| 04/17/2014 | US20140103448 Methods of forming secured metal gate antifuse structures |
| 04/17/2014 | US20140103440 I-shaped gate electrode for improved sub-threshold mosfet performance |
| 04/17/2014 | US20140103436 Extremely thin semiconductor-on-insulator with back gate contact |
| 04/17/2014 | US20140103435 Vertical source/drain junctions for a finfet including a plurality of fins |
| 04/17/2014 | US20140103430 Lateral high-voltage transistor and method for manufacturing the same |
| 04/17/2014 | US20140103405 Method for fabricating semiconductor device |
| 04/17/2014 | US20140103404 Replacement gate with an inner dielectric spacer |
| 04/17/2014 | US20140103403 Method for manufacturing semiconductor device |
| 04/17/2014 | US20140103402 Semiconductor Structure Having Contact Plug and Metal Gate Transistor and Method of Making the Same |
| 04/17/2014 | US20140103398 Rf power hemt grown on a silicon or sic substrate with a front-side plug connection |
| 04/17/2014 | US20140103366 Silicon device on si:c-oi and sgoi and method of manufacture |
| 04/17/2014 | US20140103363 Using stress reduction barrier sub-layers in a semiconductor die |
| 04/17/2014 | US20140103352 Nitride semiconductor and fabricating method thereof |
| 04/17/2014 | US20140103341 Method for producing amorphous oxide thin film and thin film transistor |
| 04/17/2014 | US20140103340 Semiconductor device |
| 04/17/2014 | US20140103338 Semiconductor device |
| 04/17/2014 | US20140103337 Semiconductor device |
| 04/17/2014 | US20140103331 Embedded Source/Drains with Epitaxial Oxide Underlayer |
| 04/17/2014 | US20140103251 Compositions for use in semiconductor devices |
| 04/17/2014 | US20140103027 Heated substrate support ring |
| 04/17/2014 | US20140102909 Copper electrodeposition in microelectronics |
| 04/17/2014 | US20140102903 Apparatus for particle removal |
| 04/17/2014 | US20140102640 Plasma processing apparatus |
| 04/17/2014 | US20140102637 Method and apparatus for liquid treatment of wafer shaped articles |
| 04/17/2014 | US20140102488 Method and System for Improving Performance and Preventing Corrosion in Multi-Module Cleaning Chamber |
| 04/17/2014 | US20140102474 Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
| 04/17/2014 | DE112012003231T5 CMOS-Transistor mit epitaxialer Erweiterung CMOS transistor with epitaxial expansion |
| 04/17/2014 | DE112012002633T5 System und Verfahren zum Bearbeiten von horizontal ausgerichteten Nanofasern aus Graphit in einem in 3D Chip-Stapeln verwendeten Material für eine thermische Grenzfläche System and method for processing horizontally oriented graphite nanofibers in a material used in 3D Chip Stack for a thermal interface |
| 04/17/2014 | DE112012002619T5 Verfahren und Vorrichtung zur Inspektion von lichtemittierenden Halbleiterelementen mittels Photolumineszenz-Abbildung Method and apparatus for inspection of semiconductor light emitting elements by means of photoluminescent imaging |
| 04/17/2014 | DE102013218423A1 Verfahren zum Herstellen einer Lötverbindung und Schaltungsbauteil A method for forming a solder connection and circuit component |
| 04/17/2014 | DE102013215378A1 Lateraler Hochspannungstransistor und Verfahren zu seiner Herstellung A lateral high-voltage transistor and method for its preparation |
| 04/17/2014 | DE102013111375A1 Transistorbauelement und verfahren zum herstellen einestransistorbauelements Transistor device and method of manufacturing a transistor device |
| 04/17/2014 | DE102013111293A1 Wafer und Verfahren zur Bearbeitung eines Wafers Wafer and method of processing a wafer |
| 04/17/2014 | DE102013111004A1 Ausrichtungsmarken und Halbleiter-Werkstück Alignment marks and semiconductor workpiece |
| 04/17/2014 | DE102013104019A1 Method for forming p-type FET (pFET) structure, involves forming germanium-channel implant region in n-type wall, through opening of mask layer formed on semiconductor substrate |
| 04/17/2014 | DE102013103580A1 Dreidimensional gestapelte Gehäuseanordnung und Verfahren zum Herstellen derselben Three-dimensional stacked housing assembly and method of making same |
| 04/17/2014 | DE102012218745A1 Method for simultaneous two-sided material-removing machining of surfaces of disc of e.g. semiconductor wafer, involves conducting disc of semiconductor material during co-material-machining of surfaces of recess in rotor disc |
| 04/17/2014 | DE102012218561A1 Electronic module of multiple modules for use in tetrahedral coolant container, has metal layer that comprises edge region which is directly connected to support |
| 04/17/2014 | DE102012217727A1 Detecting defects in single crystal silicon, comprises e.g. providing sample of single crystal silicon, contaminating sample with nickel, palladium or platinum, thermal processing the contaminated sample, and cooling the sample |
| 04/17/2014 | DE102012217105A1 Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung Electrical circuit and method for establishing an electrical circuit |
| 04/17/2014 | DE102012109144A1 Method of manufacturing optical components e.g. LEDs of component assembly, involves applying electromagnetic radiation to transparent or translucent molding compound on one side of component assembly |
| 04/17/2014 | DE102012109112A1 Manufacturing semiconductor component, comprises e.g. providing three-dimensional substrate body with first closed substrate surface, applying film-forming starting material on body, and forming layer sequence having semiconductor material |
| 04/17/2014 | DE102012108996A1 Method for producing radiation-emitting components, involves adjusting process parameters of electrophoresis before performing electro-phoretic deposition of converting layer, so that color locus of light is provided in specified area |
| 04/17/2014 | DE102012018747A1 Verfahren und Vorrichtung zum Anordnen von Kleinteilen Method and apparatus for disposing of small parts |
| 04/17/2014 | DE102011116243B4 Vorrichtung zum Bestimmen der Temperatur eines Substrats Apparatus for determining the temperature of a substrate |
| 04/17/2014 | DE102010028463B4 Verfahren zur Herstellung eines Halbleiterbauelements mit komplexen leitenden Elementen in einem dielektrischen Materialsystem unter Anwendung einer Barrierenschicht und Halbleiterbauelement diese aufweisend A process for producing a semiconductor device with conductive elements in a complex dielectric material system using a barrier layer and this semiconductor device comprising |
| 04/16/2014 | EP2720518A2 Plasma-generating source comprising a belt-type magnet, and thin-film deposition system using same |
| 04/16/2014 | EP2720269A1 Semiconductor device |
| 04/16/2014 | EP2720264A1 Microchip charge patterning |
| 04/16/2014 | EP2720260A1 Microchip charge patterning |
| 04/16/2014 | EP2720259A2 Method to protect against contact related shorts on utbb |
| 04/16/2014 | EP2720258A1 Wafer handling system |
| 04/16/2014 | EP2720257A1 Semiconductor element, hemt element, and method for manufacturing semiconductor element |
| 04/16/2014 | EP2720256A2 Strained semiconductor device |
| 04/16/2014 | EP2720255A1 Method for manufacturing silicon carbide semiconductor device |
| 04/16/2014 | EP2720254A1 Semiconductor device and method for producing same |
| 04/16/2014 | EP2720253A1 Illumination optical assembly, exposure device, and device manufacture method |
| 04/16/2014 | EP2720086A1 Methods of fabricating transparent and nanomaterial-based conductive film |
| 04/16/2014 | EP2719995A1 Eddy current sensor |
| 04/16/2014 | EP2719795A1 Zinc oxide precursor and method of depositing zinc oxide-based thin film using the same |
| 04/16/2014 | EP2719794A2 Plasma etching of diamond surfaces |
| 04/16/2014 | EP2719486A1 Bonding material and bonded object produced using same |
| 04/16/2014 | EP2718973A2 Techniques for providing a semiconductor memory device |
| 04/16/2014 | EP2718968A1 Low-stress tsv design using conductive particles |
| 04/16/2014 | EP2718967A2 Using three-dimensional representations for defect-related applications |
| 04/16/2014 | EP2718966A1 Component protective overmolding |
| 04/16/2014 | EP2718965A1 Method for producing a field effect transistor with implantation through the spacers |
| 04/16/2014 | EP2718964A2 Semiconductor constructions having through-substrate interconnects, and methods of forming through-substrate interconnects |
| 04/16/2014 | EP2718963A2 Method and system for inline chemical vapor deposition |
| 04/16/2014 | EP2718962A1 High-concentration active doping in semiconductors and semiconductor devices produced by such doping |
| 04/16/2014 | EP2718875A1 A method for manufacturing a card connector |
| 04/16/2014 | CN203553201U Solar panel string cleaning device |
| 04/16/2014 | CN203553199U Photovoltaic glass carrying device used for solar cell module |
| 04/16/2014 | CN203553198U Solar cell module transmission device |
| 04/16/2014 | CN203553197U Material carrying device used for crystalline silicon solar cell module |
| 04/16/2014 | CN203553196U Silicon chip caching device of solar energy ion implanter |
| 04/16/2014 | CN203553170U Semiconductor device |
| 04/16/2014 | CN203553140U Wafer-level chip TSV packaging structure |
| 04/16/2014 | CN203553130U Packaging structure of plastic flat integrated circuit with leads at four sides |
| 04/16/2014 | CN203553126U Centre jig mechanism for semiconductor chip packaging |
| 04/16/2014 | CN203553125U An adsorptive tool for cutting IC products |
| 04/16/2014 | CN203553124U Feeding device semiconductor material box clamping mechanism improved structure |
| 04/16/2014 | CN203553123U Supporting seat of semiconductor wafer |
| 04/16/2014 | CN203553122U A wafer carrying protective device used for a wafer production device |
| 04/16/2014 | CN203553121U Horizontal calibration apparatus |
| 04/16/2014 | CN203553120U Framework diode mounting rack |
| 04/16/2014 | CN203553119U Operating apparatus and photovoltaic assembly processing apparatus |
| 04/16/2014 | CN203553118U Electron-irradiation loading box of power device |
| 04/16/2014 | CN203553117U Cartridge for drying wafer |
| 04/16/2014 | CN203553116U Drying tank apparatus |
| 04/16/2014 | CN203553115U Double flattening machine for SMD diode |
| 04/16/2014 | CN203553114U Large-power LED and surface-mounted support box loading distance separation device |
| 04/16/2014 | CN203553113U Grain sieve tray |
| 04/16/2014 | CN203553112U Grain double-face sieve tray |
| 04/16/2014 | CN203553111U Full-automation mega sound wave cleaning equipment for semiconductor wafers |
| 04/16/2014 | CN203553110U Mirror surface detection apparatus of solar cell panel |
| 04/16/2014 | CN203553109U Bipolar transistor array structure for measuring bipolar transistor junction capacitance |