Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/16/2014CN203553108U Aluminum ribbon guiding groove for packaging techniques
04/16/2014CN203553107U Initial straightening device for diode leads
04/16/2014CN203553106U Cutting device for AlGaAs epitaxial wafer
04/16/2014CN203553105U Full-automatic mote cleaning equipment for semiconductor package
04/16/2014CN203551947U Wafer roasting device and automatic developing machine with same
04/16/2014CN203551882U LED bonding equipment double-optical path optical imaging system
04/16/2014CN203549395U Chemical liquid supply device
04/16/2014CN203546139U Plating pot for semiconductor elements
04/16/2014CN203546135U Epitaxial wafer evaporation-plating device
04/16/2014CN103733500A Semiconductor drive circuit and power conversion apparatus using same
04/16/2014CN103733363A Wavelength conversion body and method for manufacturing same
04/16/2014CN103733346A Organic thin film transistor
04/16/2014CN103733345A Thin film transistor, method for producing same, display device, image sensor, x-ray sensor, and x-ray digital imaging device
04/16/2014CN103733339A Memory cell structures
04/16/2014CN103733338A High-reliability high-speed memristor
04/16/2014CN103733337A Microelectronic device
04/16/2014CN103733330A Semiconductor power module, method for manufacturing semiconductor power module, and circuit board
04/16/2014CN103733328A Substrate supporting unit and substrate processing device, and method for producing substrate supporting unit
04/16/2014CN103733327A Substrate support with heater
04/16/2014CN103733326A Transport system
04/16/2014CN103733325A Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots
04/16/2014CN103733324A Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
04/16/2014CN103733323A Noncontact conveyance device
04/16/2014CN103733322A Method for providing a prediction model for crack detection and method for crack detection on a semiconductor structure
04/16/2014CN103733321A Method for manufacturing semiconductor device, and semiconductor device
04/16/2014CN103733320A Capping layers for improved crystallization
04/16/2014CN103733319A Method for manufacturing transistor, and transistor
04/16/2014CN103733318A Vacuum processing device and vacuum processing method
04/16/2014CN103733317A Dry-etch for silicon-and-nitrogen-containing films
04/16/2014CN103733316A Surface protecting adhesive tape for use in semiconductor processing
04/16/2014CN103733315A Two-part plastic retaining ring
04/16/2014CN103733314A Silicon wafer polishing method and abrasive
04/16/2014CN103733313A Dicing sheet substrate film and dicing sheet
04/16/2014CN103733312A Dicing sheet substrate film and dicing sheet
04/16/2014CN103733311A Thin film structures and devices with integrated light and heat blocking layers for laser patterning
04/16/2014CN103733310A Semiconductor element and method for manufacturing semiconductor element
04/16/2014CN103733309A Equipment for manufacturing semiconductor for epitaxial process
04/16/2014CN103733308A Nitride semiconductor structure and method of fabricating same
04/16/2014CN103733307A Equipment for manufacturing semiconductor for epitaxial process
04/16/2014CN103733306A Method and device for fabricating a layer in semiconductor material
04/16/2014CN103733305A Method of making delamination resistant assemblies
04/16/2014CN103733304A Hermetically sealed MEMS device with a portion exposed to the environment with vertically integrated electronics
04/16/2014CN103733303A A method for attaching an optical lens to a printed circuit board with electronic light source
04/16/2014CN103733138A Method for correcting alignment of substrate to be exposed, and exposure device
04/16/2014CN103733023A Method for estimating shape before shrink, and CD-SEM apparatus
04/16/2014CN103733019A Method and apparatus for determining coplanarity in integrated circuit packages
04/16/2014CN103732809A Method for peeling group 13 element nitride film
04/16/2014CN103732807A Ingot growing apparatus and method of manufacturing ingot
04/16/2014CN103732791A Deposition systems including a precursor gas furnace within a reaction chamber, and related methods
04/16/2014CN103732790A Sputtering target
04/16/2014CN103732642A Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition
04/16/2014CN103730548A Method for utilizing high-temperature oxidation gas to recycle patterned sapphire substrate
04/16/2014CN103730547A LED chip manufacturing method
04/16/2014CN103730517A Junction field effect transistor and manufacturing method thereof
04/16/2014CN103730512A Thin film transistor, manufacturing method of thin film transistor and display device
04/16/2014CN103730511A Thin-film transistor, manufacturing method thereof, array substrate and display device
04/16/2014CN103730510A Thin film transistor and manufacturing method thereof, array substrate and display device
04/16/2014CN103730509A Semiconductor device
04/16/2014CN103730508A Vertical thin film transistor structure of display panel and manufacturing method of vertical thin film transistor structure
04/16/2014CN103730506A Low-grid charge power device and manufacturing method thereof
04/16/2014CN103730505A I-shaped gate electrode for improved sub-threshold MOSFET performance
04/16/2014CN103730504A Transistor device and method for producing a transistor device
04/16/2014CN103730503A Lateral high-voltage transistor and method for manufacturing the same
04/16/2014CN103730498A Semiconductor device and manufacturing method thereof
04/16/2014CN103730497A Structure of chip scale package power device
04/16/2014CN103730496A Semiconductor structure and manufacturing method thereof
04/16/2014CN103730495A Metal oxide semiconductor device and manufacturing method thereof
04/16/2014CN103730494A Structure of semiconductor power device for chip scale package
04/16/2014CN103730492A MIS-HEMT (metal insulating layer-high electron mobility transistor) device with back field plate structure and preparation method thereof
04/16/2014CN103730491A High electron mobility transistor and method of driving the same
04/16/2014CN103730490A Semiconductor device provided with perpendicular conducting channel and preparation method thereof
04/16/2014CN103730489A Semiconductor device of three-dimensional pier type channel structure and preparation method thereof
04/16/2014CN103730488A Silicon controlled punchthrough structure formed by cutting grooves and method thereof
04/16/2014CN103730487A Controllable silicon table top structure for improving forward direction voltage withstanding and manufacturing technology of controllable silicon table top structure for improving forward direction voltage withstanding
04/16/2014CN103730485A Two-side displaying OLED array substrate, manufacturing method thereof, and display device
04/16/2014CN103730475A Array substrate, manufacturing method thereof and display device
04/16/2014CN103730474A Array substrate and manufacturing method thereof and display device
04/16/2014CN103730473A Array substrate, method for manufacturing array substrate and display device
04/16/2014CN103730472A Array substrate, manufacturing method of array substrate and display device
04/16/2014CN103730471A Semiconductor device and method of manufacturing the same
04/16/2014CN103730470A Three-dimensional laminated semiconductor structure and manufacturing method thereof
04/16/2014CN103730469A SRAM (static random access memory) unit and forming method thereof
04/16/2014CN103730468A Semiconductor structure, forming method of semiconductor structure, SRAM memory unit and SRAM memorizer
04/16/2014CN103730467A Structure and preparation method of semiconductor power device
04/16/2014CN103730465A Linear constant-current device and manufacturing method of linear constant-current device
04/16/2014CN103730464A Semiconductor device with integratable fly-wheel diode, and manufacturing method of semiconductor device
04/16/2014CN103730463A Thin film transistor substrate with photoelectric detector and manufacturing method thereof
04/16/2014CN103730461A SCR structure with high maintaining voltage and manufacturing method thereof
04/16/2014CN103730459A High-voltage integrated capacitor and fabrication method thereof
04/16/2014CN103730457A Semiconductor storage device and method for producing the same
04/16/2014CN103730451A Multi-chip packaging body and packaging method
04/16/2014CN103730450A Organic electric excitation light-emitting diode storage capacitor structure and manufacturing method thereof
04/16/2014CN103730448A Package substrate and method of fabricating the same
04/16/2014CN103730447A Package-on-package structure without through assembly vias
04/16/2014CN103730446A Interconnection structure and manufacture method for rigid and flexible combined printed circuit board three-dimensional packaging structure
04/16/2014CN103730445A Circuit board with twinned cu circuit layer and method for manufacturing the same
04/16/2014CN103730444A Packaging assembly and manufacture method thereof
04/16/2014CN103730443A Area array quad flat no lead package (AAQFN) IC chip package in package (PiP) piece with solder balls and production method
04/16/2014CN103730442A Area array quad flat no lead package (AAQFN) package body package in package (PiP) piece with solder balls and production method
04/16/2014CN103730441A Lead frame and method for packaging semiconductor device with lead frame
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