Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/17/2014US20140107959 Electron beam apparatus for inspecting a pattern on a sample using multiple electron beams
04/17/2014US20140107008 Cleaning composition and cleaning method using the same
04/17/2014US20140106652 Polishing pad and manufacturing method therefor
04/17/2014US20140106649 Wafer processing methods
04/17/2014US20140106577 Method and apparatus of forming silicon nitride film
04/17/2014US20140106576 Inorganic polysilazane, silica film-forming coating liquid containing same, and method for forming silica film
04/17/2014US20140106575 Directed self-assembly of block copolymers using laser annealing
04/17/2014US20140106574 Gapfill of variable aspect ratio features with a composite peald and pecvd method
04/17/2014US20140106573 Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
04/17/2014US20140106572 Plasma processing method and plasma processing device
04/17/2014US20140106571 Biasing system for a plasma processing apparatus
04/17/2014US20140106570 Composition for forming organic hard mask layer for use in lithography containing polymer having acrylamide structure
04/17/2014US20140106569 Method of fabricating three-dimensional semiconductor device and three-dimensional semiconductor device fabricated using the same
04/17/2014US20140106568 Method of forming opening on semiconductor substrate
04/17/2014US20140106566 Method For Etching an Ultra Thin Film
04/17/2014US20140106565 Methods For Atomic Layer Etching
04/17/2014US20140106564 Additive conductor redistribution layer (acrl)
04/17/2014US20140106563 Stress Reduction Apparatus
04/17/2014US20140106562 Barrier Layer for Copper Interconnect
04/17/2014US20140106561 Graphene Barrier Layers for Interconnects and Methods for Forming the Same
04/17/2014US20140106559 System and method for forming an aluminum fuse for compatibility with copper beol interconnect scheme
04/17/2014US20140106558 Semiconductor device having metal gate and manufacturing method thereof
04/17/2014US20140106557 Manufacturing method for semiconductor device having metal gate
04/17/2014US20140106556 Method for manufacturing a dual work function semiconductor device
04/17/2014US20140106555 Method for forming a semiconductor device
04/17/2014US20140106554 Methods of Forming Gated Devices
04/17/2014US20140106553 Process for manufacturing a semiconductor device and an intermediate product for the manufacture of a semiconductor device
04/17/2014US20140106552 Method Of Fabricating MEMS Transistors On Far Back End Of Line
04/17/2014US20140106551 Back contact solar cells with effective and efficient designs and corresponding patterning processes
04/17/2014US20140106550 Ion implantation tuning to achieve simultaneous multiple implant energies
04/17/2014US20140106548 Fabrication of III-Nitride Semiconductor Device and Related Structures
04/17/2014US20140106547 Epitaxy of high tensile silicon alloy for tensile strain applications
04/17/2014US20140106546 Lattice-Mismatched Semiconductor Structures with Reduced Dislocation Defect Densities and Related Methods for Device Fabrication
04/17/2014US20140106545 Laser processing method for workpiece
04/17/2014US20140106544 Semiconductor wafer with assisting dicing structure and dicing method thereof
04/17/2014US20140106543 Laser processing method for wafer
04/17/2014US20140106542 Laser and plasma etch wafer dicing with partial pre-curing of uv release dicing tape for film frame wafer application
04/17/2014US20140106541 Microchip charge patterning
04/17/2014US20140106540 Method and device for slicing a shaped silicon ingot using layer transfer
04/17/2014US20140106539 Semiconductor isolation structure and method of manufacture
04/17/2014US20140106538 Dummy pattern design for thermal annealing
04/17/2014US20140106537 Methods of manufacturing a semiconductor device
04/17/2014US20140106536 Cylindrical Embedded Capacitors
04/17/2014US20140106532 Semiconductor structure and manufacturing method for the same and esd circuit
04/17/2014US20140106528 Finfet circuits with various fin heights
04/17/2014US20140106527 Method of producing semiconductor device
04/17/2014US20140106523 Vertical Super-Thin Body Semiconductor on Dielectric Wall Devices and Methods of Their Fabrication
04/17/2014US20140106522 Integrated circuit device with well controlled surface proximity and method of manufacturing same
04/17/2014US20140106521 Method for manufacturing semiconductor device
04/17/2014US20140106516 Self-doped ohmic contacts for compound semiconductor devices
04/17/2014US20140106514 Method for manufacturing semiconductor device and method for growing graphene
04/17/2014US20140106512 Microchip charge patterning
04/17/2014US20140106509 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
04/17/2014US20140106505 Method for manufacturing semiconductor device
04/17/2014US20140106504 Method for manufacturing semiconductor device
04/17/2014US20140106494 Dual-gate bio/chem sensor
04/17/2014US20140106491 Method of fabricating patterned substrate
04/17/2014US20140106484 Bonding apparatus and method for display device
04/17/2014US20140106482 Depositing apparatus and method for manufacturing organic light emitting diode display using the same
04/17/2014US20140106481 Method for wafer level reliability
04/17/2014US20140106480 Method and apparatus for depositing phosphor on semiconductor-light emitting device
04/17/2014US20140106479 End-Cut First Approach For Critical Dimension Control
04/17/2014US20140106477 Method of endpoint detection of plasma etching process using multivariate analysis
04/17/2014US20140106476 Differential measurements for endpoint signal enhancement
04/17/2014US20140106475 Method for etching polysilicon gate
04/17/2014US20140106474 Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes
04/17/2014US20140106473 Advanced handler wafer bonding and debonding
04/17/2014US20140106142 Adhesive transfer
04/17/2014US20140106137 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
04/17/2014US20140106106 Dicing film with protecting film
04/17/2014US20140105716 Apparatus for transferring substrates
04/17/2014US20140105709 Substrate processing apparatus
04/17/2014US20140105583 Apparatus for providing and directing heat energy in a process chamber
04/17/2014US20140104953 Semiconductor storage device and method for producing the same
04/17/2014US20140104945 Nonvolatile memory devices and methods forming the same
04/17/2014US20140104839 Desktop Item with LED Means Has USB-unit(s) or USB-Module to Charge Other Electric or Digital Data Device(s)
04/17/2014US20140104793 Stretchable electronic device and method of manufacturing same
04/17/2014US20140103612 Dielectric layer for electrostatic chuck and electrostatic chuck
04/17/2014US20140103547 Alignment key of semiconductor device and method of fabricating the same
04/17/2014US20140103546 Silicone polymers with high refractive indices and extended pot life
04/17/2014US20140103539 Semiconductor device and method of fabricating the same
04/17/2014US20140103538 Enhanced electrochemical deposition filling
04/17/2014US20140103534 Electrochemical deposition on a workpiece having high sheet resistance
04/17/2014US20140103532 Chip-level humidity protection
04/17/2014US20140103530 Three dimensional stacked semiconductor structure and method for manufacturing the same
04/17/2014US20140103529 Semiconductor device manufacturing method, semiconductor device, semiconductor device manufacturing apparatus and storage medium
04/17/2014US20140103521 Electronic device having a contact recess and related methods
04/17/2014US20140103520 Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs
04/17/2014US20140103518 Structure and method for air cavity packaging
04/17/2014US20140103509 Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages
04/17/2014US20140103505 Die down integrated circuit package with integrated heat spreader and leads
04/17/2014US20140103501 Circuit board with twinned cu circuit layer and method for manufacturing the same
04/17/2014US20140103495 Wafer and method for processing a wafer
04/17/2014US20140103492 Silicon wafer and method for producing the same
04/17/2014US20140103489 Electronic Device Comprising a Semiconductor Structure Having an Integrated Circuit Back End Capacitor and Thin Film Resistor and Method of Manufacturing the Same
04/17/2014US20140103488 POP Structures and Methods of Forming the Same
04/17/2014US20140103484 Electrostatic discharge devices and method of making the same
04/17/2014US20140103469 Seed Layer for Multilayer Magnetic Materials
04/17/2014US20140103464 Microphone System with Integrated Passive Device Die
04/17/2014US20140103460 MEMS Device and Method of Manufacturing a MEMS Device