Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/22/2014US8704288 Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devices
04/22/2014US8704285 Capacitor device and display apparatus having the same
04/22/2014US8704278 Structure for MOSFET sensor
04/22/2014US8704260 Light emitting device and light-emitting system including the same
04/22/2014US8704235 Semiconductor circuit having capacitor and thin film transistor, flat panel display including the semiconductor circuit, and method of manufacturing the semiconductor circuit
04/22/2014US8704233 Semiconductor device and method of manufacturing the same
04/22/2014US8704225 Semiconductor integrated circuit
04/22/2014US8704210 Boundary-modulated nanoparticle junctions and a method for manufacture thereof
04/22/2014US8704206 Memory device including transistor array with shared plate channel and method for making the same
04/22/2014US8704156 Solid-state image pickup apparatus, electronic apparatus, and method of manufacturing a solid-state image pickup apparatus
04/22/2014US8703845 Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
04/22/2014US8703626 Method, tool, and apparatus for manufacturing a semiconductor device
04/22/2014US8703625 Methods to prepare silicon-containing films
04/22/2014US8703624 Dielectric films comprising silicon and methods for making same
04/22/2014US8703623 Fabrication technique for gallium nitride substrates
04/22/2014US8703622 Flat panel display device and method of manufacturing the same
04/22/2014US8703621 Manufacturing method of magnetic recording medium
04/22/2014US8703620 Methods for PFET fabrication using APM solutions
04/22/2014US8703619 Taper-etching method and method of manufacturing near-field light generator
04/22/2014US8703618 Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die
04/22/2014US8703617 Method for planarizing interlayer dielectric layer
04/22/2014US8703616 Method for adjusting feature size and position
04/22/2014US8703615 Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
04/22/2014US8703614 Metal organic chemical vapor deposition apparatus and method
04/22/2014US8703613 Plasma processing apparatus and plasma processing method
04/22/2014US8703612 Process for forming contact plugs
04/22/2014US8703611 Method for manufacturing a semiconductor structure
04/22/2014US8703610 Semiconductor device and method of forming conductive TSV with insulating annular ring
04/22/2014US8703609 Through-substrate via for semiconductor device
04/22/2014US8703608 Control of local environment for polysilicon conductors in integrated circuits
04/22/2014US8703607 Method to alter silicide properties using GCIB treatment
04/22/2014US8703605 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
04/22/2014US8703604 Creation of vias and trenches with different depths
04/22/2014US8703603 Device package and methods for the fabrication and testing thereof
04/22/2014US8703602 Selective seed layer treatment for feature plating
04/22/2014US8703601 Method for applying liquid material, application device and program
04/22/2014US8703600 Electronic component and method of connecting with multi-profile bumps
04/22/2014US8703598 Manufacturing method of lead frame substrate
04/22/2014US8703597 Method for fabrication of a semiconductor device and structure
04/22/2014US8703596 Semiconductor device and method of manufacturing semiconductor device
04/22/2014US8703595 N/P boundary effect reduction for metal gate transistors
04/22/2014US8703594 Semiconductor device having a treated gate structure and fabrication method thereof
04/22/2014US8703593 Techniques for FinFET doping
04/22/2014US8703592 Methods of forming semiconductor devices having faceted semiconductor patterns
04/22/2014US8703591 Method for fabricating black silicon by using plasma immersion ion implantation
04/22/2014US8703590 Vapor-phase growth method for semiconductor film
04/22/2014US8703589 Flat panel display and method of manufacturing the same
04/22/2014US8703588 Methods of forming a phase change material
04/22/2014US8703587 Method of manufacturing of a semi-conductor element and semi-conductor element
04/22/2014US8703586 Apparatus for forming deposited film and method for forming deposited film
04/22/2014US8703585 Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device
04/22/2014US8703584 Dicing tape-integrated film for semiconductor back surface
04/22/2014US8703583 Fabrication method of semiconductor device
04/22/2014US8703582 Laser processing method
04/22/2014US8703581 Water soluble mask for substrate dicing by laser and plasma etch
04/22/2014US8703580 Silicon on insulator (SOI) wafer and process for producing same
04/22/2014US8703579 Method of manufacturing semiconductor device
04/22/2014US8703578 Middle in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations
04/22/2014US8703577 Method for fabrication deep trench isolation structure
04/22/2014US8703576 Gap-fill keyhole repair using printable dielectric material
04/22/2014US8703575 Method of forming isolation area and structure thereof
04/22/2014US8703574 Semiconductor device with integrated antenna and manufacturing method therefor
04/22/2014US8703573 Semiconductor device and method of manufacturing the same
04/22/2014US8703572 Embeded DRAM cell structures with high conductance electrodes and methods of manufacture
04/22/2014US8703571 Methods of fabricating bipolar junction transistors having a fin
04/22/2014US8703570 Methods of fabricating substrates
04/22/2014US8703569 MOS transistor, manufacturing method thereof, and semiconductor device
04/22/2014US8703568 Advanced CMOS using super steep retrograde wells
04/22/2014US8703567 Method for manufacturing a semiconductor device
04/22/2014US8703566 Transistors comprising a SiC-containing channel
04/22/2014US8703565 Bottom-notched SiGe FinFET formation using condensation
04/22/2014US8703563 Source and body contact structure for trench-DMOS devices using polysilicon
04/22/2014US8703562 Manufacturing method of random access memory
04/22/2014US8703561 High quality GaN high-voltage HFETs on silicon
04/22/2014US8703560 Methods for manufacturing thin film transistor
04/22/2014US8703559 Thin-film transistor array substrate and manufacturing method thereof
04/22/2014US8703558 Graphene device and method for manufacturing the same
04/22/2014US8703557 Methods of removing dummy fin structures when forming finFET devices
04/22/2014US8703556 Method of making a FinFET device
04/22/2014US8703555 Defect prevention on SRAM cells that incorporate selective epitaxial regions
04/22/2014US8703554 Array substrate for liquid crystal display device and method of fabricating the same
04/22/2014US8703553 MOS capacitors with a finFET process
04/22/2014US8703552 Method and structure for forming capacitors and memory devices on semiconductor-on-insulator (SOI) substrates
04/22/2014US8703551 Process flow to reduce hole defects in P-active regions and to reduce across-wafer threshold voltage scatter
04/22/2014US8703550 Dual shallow trench isolation liner for preventing electrical shorts
04/22/2014US8703549 Semiconductor device and manufacturing method thereof
04/22/2014US8703548 Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)
04/22/2014US8703547 Thyristor comprising a special doped region characterized by an LDD region and a halo implant
04/22/2014US8703546 Activation treatments in plating processes
04/22/2014US8703545 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package
04/22/2014US8703544 Electronic component employing a layered frame
04/22/2014US8703543 Vertical sensor assembly method
04/22/2014US8703542 Wafer-level packaging mechanisms
04/22/2014US8703541 Electronic system with expansion feature
04/22/2014US8703540 Chip-scale semiconductor die packaging method
04/22/2014US8703539 Multiple die packaging interposer structure and method
04/22/2014US8703538 Integrated circuit packaging system with external wire connection and method of manufacture thereof
04/22/2014US8703536 In-situ foam material as integrated heat spreader (IHS) sealant
04/22/2014US8703535 Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof
04/22/2014US8703534 Semiconductor packages and methods of packaging semiconductor devices