Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/16/2014CN103730318A Wafer edge protection ring and method for reducing particles at wafer edge
04/16/2014CN103728832A Electronic device manufacturing method, display device manufacturing method, photomask manufacturing method and photomask
04/16/2014CN103728828A Mask having optical-isolation channel holes and proximity correction characteristic, and making method thereof
04/16/2014CN103728827A Photomask, thin film transistor element and method of preparing thin film transistor element
04/16/2014CN103728803A Array substrate, manufacturing method thereof and display device
04/16/2014CN103728797A Display panel, production method thereof and display device
04/16/2014CN103728795A Array substrate common electrode structure, manufacturing method thereof and array substrate
04/16/2014CN103726103A Reaction chamber
04/16/2014CN103726097A Copper anode or phosphorous-containing copper anode, method of electroplating copper on semiconductor wafer, and semiconductor wafer with low particle adhesion
04/16/2014CN103725455A Cleaning composition and cleaning method using the same
04/16/2014CN103725215A Fill roll for producing semiconductor device
04/16/2014CN103320018B Additive for crystalline silicon polishing solution and application method thereof
04/16/2014CN102844837B Fluid supply apparatus
04/16/2014CN102820253B Preparation method of high mobility ratio double channel material based on silicon-on-insulator (SOI) substrate
04/16/2014CN102723266B Solar battery diffusion method
04/16/2014CN102658551B Chip transfer manipulator
04/16/2014CN102654948B Display panel for blind and manufacturing method of display panel, blind display device
04/16/2014CN102646624B Three-dimensional array type back grid type Si-NWFET (Nano Wire Field Effect Transistor) manufacturing method based on SOI (Silicon On Insulator)
04/16/2014CN102629588B Method for manufacturing array substrate
04/16/2014CN102629579B Flexible TFT array substrate and manufacturing method thereof and display device
04/16/2014CN102623491B High-voltage withstanding device in bipolar low-voltage process and manufacturing method thereof
04/16/2014CN102610638B SiC-bipolar junction transistor (SiC-BJT) device for power integrated circuit and manufacturing method of SiC-BJT device
04/16/2014CN102575343B Catalytic CVD device, method for formation of film, process for production of solar cell, and substrate holder
04/16/2014CN102569116B Detection structure suitable for detecting source and drain conduction and detection method for detection structure
04/16/2014CN102569084B P-type high-concentration doped silicon and technology for preparing P-channel MOS (Metal Oxide Semiconductor) pipe of BCD products
04/16/2014CN102544049B Three-dimensional semiconductor storage device and preparation method for three-dimensional semiconductor storage device
04/16/2014CN102522425B Structure of ultrahigh pressure germanium-silicon heterojunction bipolar transistor (HBT) device and preparation method
04/16/2014CN102522343B Microcomponent vacuum packaging exhaust device and method
04/16/2014CN102522338B Forming method of high-voltage super-junction metal oxide semiconductor field effect transistor (MOSFET) structure and P-shaped drift region
04/16/2014CN102479823B Vertical NROM storage structure and preparation method thereof
04/16/2014CN102479806B Super junction semiconductor device and manufacturing method thereof
04/16/2014CN102468306B Array base plate, liquid crystal display, and manufacturing method for array substrate
04/16/2014CN102468284B Stacked semiconductor device and method for manufacturing same
04/16/2014CN102465413B Slurry supply system
04/16/2014CN102437028B PMOS (p-channel metal-oxide-semiconductor field-effect transistor) source/drain region ion implantation method and corresponding device manufacturing method
04/16/2014CN102437022B Method for manufacturing multilayer metal-oxide-metal (MOM) capacitor
04/16/2014CN102420211B Image sensor package structure of micro salient point interconnection structure and realization method of image sensor package structure
04/16/2014CN102420191B Semiconductor device with stress memorization effect and manufacture method thereof
04/16/2014CN102412313B MOS (metal oxide semiconductor) variable capacitor adopting SiGe HBT (heterojunction bipolar transistor) process and manufacturing method thereof
04/16/2014CN102412162B Method for improving breakdown voltage of N-groove laterally diffused metal oxide semiconductor (LDMOS)
04/16/2014CN102412147B Manufacturing method of field blocking type semiconductor device
04/16/2014CN102403314B Active area sidewall in bipolar CMOS (Complementary Metal Oxide Semiconductor) process and manufacturing method
04/16/2014CN102403313B Semiconductor element and method for making the same
04/16/2014CN102403208B Preparation method for grid of RFLDMOS (radio frequency laterally diffused metal oxide semiconductor) device
04/16/2014CN102386183B Parasitic PIN device combing structure in BICMOS process and fabrication method
04/16/2014CN102376775B Parasitic PIN (Personal Identification Number) device in BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) process and manufacturing method thereof
04/16/2014CN102376759B Semiconductor device having both IGBT area and diode area
04/16/2014CN102376756B Polysilicon gate structure
04/16/2014CN102376651B Method for improving capacity of filling dielectric medium between magnetic tunnel junction (MTJ) metals in magnetic random access memory (MRAM)
04/16/2014CN102365828B Signal transmission communication unit and coupler
04/16/2014CN102349137B Substrate cleaning method
04/16/2014CN102341905B Semiconductor integrated circuit device and method for designing same
04/16/2014CN102341896B Cmp method
04/16/2014CN102300688B Substrate breaking apparatus
04/16/2014CN102299085B Packaged semiconductor device having improved locking properties
04/16/2014CN102299082B Producing method of semiconductor bearing element and producing method of package using the semiconductor bearing element
04/16/2014CN102298265B Photoetching dielectric compositions and electrical or electronic device
04/16/2014CN102290363B Apparatus for driving placing table
04/16/2014CN102290347B Etching system
04/16/2014CN102281991B Slurry regenerating device and method
04/16/2014CN102280337B Reactive ion etching equipment and method
04/16/2014CN102263085B Packaging structure and process
04/16/2014CN102257190B Substrate, substrate provided with thin film, semiconductor device, and method for manufacturing semiconductor device
04/16/2014CN102237343B Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package
04/16/2014CN102237276B Method for manufacturing radio frequency LDMOS (Laterally Diffused Metal Oxide Semiconductor) device
04/16/2014CN102234830B Electroplating apparatus and method for electroplating conducting layers on substrate
04/16/2014CN102232240B Film-forming apparatus and film-forming method
04/16/2014CN102210009B Method for manufacturing metal laminated substrate for semiconductor element formation and metal laminated substrate for semiconductor element formation
04/16/2014CN102208369B Wire bonding structure of semiconductor device and wire bonding method
04/16/2014CN102201386B QFN semiconductor package and fabricating method thereof
04/16/2014CN102194748B Semiconductor device and manufacture method thereof
04/16/2014CN102187464B Electrode, semiconductor device, and method for manufacturing the semiconductor device
04/16/2014CN102150218B Method for smoothing optical member for EUVL and optical member for EUVL having smoothed optical surface
04/16/2014CN102148259B Thin film transistor, array substrate and manufacturing methods thereof and liquid crystal display
04/16/2014CN102105817B Photoelectronic sensor and photoelectronic sensor system
04/16/2014CN102099894B Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters
04/16/2014CN102097358B Shallow trench isolation groove
04/16/2014CN102077335B Apparatus and method for measuring radiation energy during thermal processing
04/16/2014CN102077326B Protective film composition for wafer dicing
04/16/2014CN102037790B Clamped monolithic showerhead electrode
04/16/2014CN102034873B Thin film transistor and method for manufacturing the same
04/16/2014CN102023401B TFT-LCD array substrate and method for manufacturing the same
04/16/2014CN102017087B Phosphorus paste for diffusion and process for producing solar battery utilizing the phosphorus paste
04/16/2014CN101989537B Liquid processing apparatus and liquid processing method
04/16/2014CN101978793B Electrode assembly and plasma processing chamber utilizing thermally conductive gasket
04/16/2014CN101971293B Flash light annealing for thin films
04/16/2014CN101946208B Optical component for euvl and smoothing method thereof
04/16/2014CN101937856B Semiconductor device and method of manufacturing the same
04/16/2014CN101930975B Optimized configurations to integrate steering diodes in low capacitance transient voltage suppressor (tvs)
04/16/2014CN101853794B Electronic components jointing method and salient point forming method and device
04/16/2014CN101794782B Semiconductor devices including buried gate electrodes including bitline shoulder attack protection and methods of forming such semiconductor devices
04/16/2014CN101770978B Method of high aspect ratio plug fill
04/16/2014CN101720269B Test head manipulator
04/16/2014CN101719486B Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
04/16/2014CN101687214B Coat film forming method and coat film forming apparatus
04/16/2014CN101667525B Substrate processing apparatus
04/16/2014CN101660141B Film deposition apparatus and substrate process apparatus
04/16/2014CN101657482B Novel polyimide precursor composition and use thereof
04/16/2014CN101640187B Four layer transistor SRAM unit manufacturing method
04/16/2014CN101621002B Manufacturing method of low-voltage transient voltage suppression diode chip