Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/23/2014CN103745928A Preparation method of transistor with stressed channel and transistor with stressed channel
04/23/2014CN103745927A Manufacturing method of static induction transistor and static induction transistor
04/23/2014CN103745926A Low-voltage-drop high-reverse-voltage fast-recovery diode process control method
04/23/2014CN103745925A Planarization polysilicon film manufacturing method
04/23/2014CN103745924A Preparation method of high-temperature superconducting Lange coupler
04/23/2014CN103745923A Method for growing gate dielectric on gallium nitride substrate and electrical performance testing method
04/23/2014CN103745922A Method for manufacturing GaN high electron mobility transistor composite medium insulated gate
04/23/2014CN103745921A Double patterning technology using single-patterning-spacer-technique
04/23/2014CN103745920A Method for controlling cooling of wafer in semiconductor process
04/23/2014CN103745919A Manufacturing method of ferroelectric storage
04/23/2014CN103745918A Imaged sapphire scrapping piece reusing method
04/23/2014CN103745917A Method for preparing nanostructure on surface of monocrystalline Si substrate under control of electric field
04/23/2014CN103745916A Method for defining growth direction of polysilicon
04/23/2014CN103745915A Growth method of strained layer and substrate with strained layer
04/23/2014CN103745914A Growth method of strained layer and substrate with strained layer
04/23/2014CN103745913A Growth method of strained layer and substrate with strained layer
04/23/2014CN103745912A Method and apparatus for integrating metrology with etch processing
04/23/2014CN103745902A PECVD processing device and method for carrying out PECVD processing on substrate
04/23/2014CN103744213A Array base-plate and preparation method thereof
04/23/2014CN103736690A Silicon chip washing method
04/23/2014CN103736689A Silicon wafer cleaning method
04/23/2014CN102763487B Induction heating device
04/23/2014CN102738060B Preparation method of gate oxide integrity (GOI) wafer structure
04/23/2014CN102681338B Resist pattern improving material, method for forming resist pattern, method for producing semiconductor device, and semiconductor device
04/23/2014CN102637646B Preparation method of memory
04/23/2014CN102593063B Manufacture method of bipolar stannous oxide phase inverter
04/23/2014CN102593043B Increasing dielectric strength by optimizing dummy metal distribution
04/23/2014CN102569418B Schottky barrier transistor possessing carbonic insulating layer and manufacturing method thereof
04/23/2014CN102569382B Metallic-oxide semiconductor element and forming method thereof
04/23/2014CN102522344B Epoxy glue curing process for automobile rectifier
04/23/2014CN102487085B Semiconductor device and manufacture method thereof
04/23/2014CN102479279B Method for dielectric window patterning mask distribution for dielectric window
04/23/2014CN102460680B Electronic device
04/23/2014CN102458800B Mold for imprinting, and method for manufacturing same
04/23/2014CN102449755B Semiconductor device
04/23/2014CN102439831B Drive device for driving voltage-driven element
04/23/2014CN102414805B Diode
04/23/2014CN102412172B Cut/ground silicon wafer surface cleaning method
04/23/2014CN102403190B Circular piece cleaning method
04/23/2014CN102365720B Structure and method for forming a salicide on the gate electrode of a trench-gate fet
04/23/2014CN102339851B Power semiconductor with polysilicon structure at bottom of trench and method for manufacturing same
04/23/2014CN102318055B A method for manufacturing a heterostructure aiming at reducing the tensile stress condition of the donor substrate
04/23/2014CN102315228B Array substrate for display device and method of fabricating the same
04/23/2014CN102263115B Method of manufacturing solid-state image sensor
04/23/2014CN102226999B 衬底结构及其制作方法 Substrate structure and manufacturing method thereof
04/23/2014CN102223757B Wiring board and method for manufacturing wiring board
04/23/2014CN102217036B Laser ablation tooling via sparse patterned masks
04/23/2014CN102214692B High voltage semiconductor transistor and method of manufacturing same
04/23/2014CN102208340B Method for making self-support gallium nitride substrate
04/23/2014CN102208338B Sapphire-base compound substrate and manufacturing method thereof
04/23/2014CN102208329B Substrate treatment apparatus and substrate treatment method
04/23/2014CN102197312B Probe detection system and relay driving test method therefor
04/23/2014CN102194682B Method of fabricating an integrated circuit device
04/23/2014CN102149750B Semiconducting polymers
04/23/2014CN102132394B Non-contact manipulating devices and methods
04/23/2014CN102113089B Stretchable and foldable electronic devices
04/23/2014CN102104047B Nonvolatile semiconductor memory device and method for producing the same
04/23/2014CN102037548B MOSFET with integrated field effect rectifier
04/23/2014CN101981678B A method for fabricating thin films
04/23/2014CN101969056B Cast grid array (CGA) package and socket
04/23/2014CN101958280B Organic electroluminescent display device and method of fabricating the same
04/23/2014CN101924116B Extensible oversize light-emitting diode (LED) chip and manufacture method thereof
04/23/2014CN101901741B Piping system and control for semiconductor processing
04/23/2014CN101887199B Liquid crystal display and manufacturing method thereof
04/23/2014CN101740622B Trench shielding structure for semiconductor device and method
04/23/2014CN101685817B Semiconductor chip
04/23/2014CN101681886B Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
04/23/2014CN101562142B Method for mounting semiconductor element and method for manufacturing semiconductor device
04/23/2014CN101404314B Light emitting device and method for manufacturing the same
04/23/2014CN101221895B Method for manufacturing compound material wafers
04/22/2014US8705274 Three-dimensional multi-bit non-volatile memory and method for manufacturing the same
04/22/2014US8705008 Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
04/22/2014US8704999 Exposure apparatus, exposure method, and method for producing device
04/22/2014US8704998 Lithographic apparatus and device manufacturing method involving a barrier to collect liquid
04/22/2014US8704997 Immersion lithographic apparatus and method for rinsing immersion space before exposure
04/22/2014US8704736 Light emitting device, method of driving a light emitting device, element substrate, and electronic equipment
04/22/2014US8704551 Semiconductor device and a display device
04/22/2014US8704443 Organic EL device
04/22/2014US8704384 Stacked die assembly
04/22/2014US8704382 Film for flip chip type semiconductor back surface
04/22/2014US8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
04/22/2014US8704375 Barrier structures and methods for through substrate vias
04/22/2014US8704373 Semiconductor device and a method of manufacturing the same
04/22/2014US8704362 Resin-diamagnetic material composite structure
04/22/2014US8704360 Top port surface mount silicon condenser microphone package
04/22/2014US8704355 Semiconductor device comprising through-electrode interconnect
04/22/2014US8704354 Package on package structures and methods for forming the same
04/22/2014US8704351 Stacked microelectronic assemblies
04/22/2014US8704349 Integrated circuit package system with exposed interconnects
04/22/2014US8704343 Borderless interconnect line structure self-aligned to upper and lower level contact vias
04/22/2014US8704338 Chip comprising a fill structure
04/22/2014US8704335 Spacer formation in the fabrication of planar bipolar transistors
04/22/2014US8704331 MEMS integrated chip with cross-area interconnection
04/22/2014US8704325 Pixel sensors of multiple pixel size and methods of implant dose control
04/22/2014US8704323 Method for manufacturing solid state image forming device, and solid state image forming device
04/22/2014US8704314 Mechanical memory transistor
04/22/2014US8704310 Trench isolation structure
04/22/2014US8704309 Display panel and method of manufacturing the same
04/22/2014US8704298 MOS diode with termination structure and method for manufacturing the same
04/22/2014US8704291 Semiconductor device and method for fabricating the same
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