| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 04/24/2014 | US20140110840 Semiconductor Packages with Integrated Antenna and Method of Forming Thereof |
| 04/24/2014 | US20140110839 Metal Bump Joint Structure |
| 04/24/2014 | US20140110838 Semiconductor devices and processing methods |
| 04/24/2014 | US20140110836 Packaging Devices, Methods of Manufacture Thereof, and Packaging Methods |
| 04/24/2014 | US20140110835 Bump Package and Methods of Formation Thereof |
| 04/24/2014 | US20140110828 Semiconductor Packages and Methods of Formation Thereof |
| 04/24/2014 | US20140110826 Backside protection for a wafer-level chip scale package (wlcsp) |
| 04/24/2014 | US20140110825 Compound Semiconductor Lateral PNP Bipolar Transistors |
| 04/24/2014 | US20140110823 Contact structure |
| 04/24/2014 | US20140110821 Folded conical inductor |
| 04/24/2014 | US20140110820 Passive component as thermal capacitance and heat sink |
| 04/24/2014 | US20140110818 Random access memory device and manufacturing method for nodes thereof |
| 04/24/2014 | US20140110817 Sub-lithographic semiconductor structures with non-constant pitch |
| 04/24/2014 | US20140110815 High Voltage Diode |
| 04/24/2014 | US20140110814 Resurf High Voltage Diode |
| 04/24/2014 | US20140110811 Semiconductor device, imaging device, method of inspecting semiconductor substrate, and method of fabricating semiconductor device |
| 04/24/2014 | US20140110801 Packaging for semiconductor sensor devices and methods |
| 04/24/2014 | US20140110798 Methods of forming a semiconductor device with low-k spacers and the resulting device |
| 04/24/2014 | US20140110797 Semiconductor device and method for manufacturing semiconductor device |
| 04/24/2014 | US20140110796 Semiconductor Package with Conductive Carrier Integrated Heat Spreader |
| 04/24/2014 | US20140110794 Facilitating gate height uniformity and inter-layer dielectric protection |
| 04/24/2014 | US20140110793 Cmos transistor and fabrication method |
| 04/24/2014 | US20140110792 Pfet polysilicon layer with n-type end cap for electrical shunt |
| 04/24/2014 | US20140110791 HYBRID GATE LAST INTEGRATION SCHEME FOR MULTI-LAYER HIGH-k GATE STACKS |
| 04/24/2014 | US20140110790 Structure and method for forming a low gate resistance high-k metal gate transistor device |
| 04/24/2014 | US20140110784 Replacement metal gate finfet |
| 04/24/2014 | US20140110783 High gain device |
| 04/24/2014 | US20140110780 Insulated gate type semiconductor device and method for fabricating the same |
| 04/24/2014 | US20140110777 Trench gate metal oxide semiconductor field effect transistor and fabricating method thereof |
| 04/24/2014 | US20140110767 Bulk finfet well contacts with fin pattern uniformity |
| 04/24/2014 | US20140110766 Semiconductor structure and manufacturing method thereof |
| 04/24/2014 | US20140110765 Field effect transistor having phase transition material incorporated into one or more components for reduced leakage current |
| 04/24/2014 | US20140110764 Method to control amorphous oxide layer formation at interfaces of thin film stacks for memory and logic components |
| 04/24/2014 | US20140110757 Fabricating method of semiconductor device and semiconductor device fabricated using the same method |
| 04/24/2014 | US20140110755 Apparatus and Method for Forming Semiconductor Contacts |
| 04/24/2014 | US20140110754 Epitaxy Technique for Growing Semiconductor Compounds |
| 04/24/2014 | US20140110751 Thyristor and method for the same |
| 04/24/2014 | US20140110719 Array substrate, manufacturing method therefor and display device |
| 04/24/2014 | US20140110718 Thin film transistor, array substrate, and manufacturing method thereof |
| 04/24/2014 | US20140110717 Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrate |
| 04/24/2014 | US20140110716 Thin Film Transistor and Manufacturing Method Thereof, an Array Substrate and a Display Device |
| 04/24/2014 | US20140110712 Semiconductor wafer and method for manufacturing semiconductor device |
| 04/24/2014 | US20140110711 Stacked chip module with integrated circuit chips having integratable built-in self-maintenance blocks |
| 04/24/2014 | US20140110710 Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocks |
| 04/24/2014 | US20140110708 Semiconductor device and method for manufacturing the same |
| 04/24/2014 | US20140110707 Semiconductor device and method for manufacturing the same |
| 04/24/2014 | US20140110705 Semiconductor device and method for manufacturing the same |
| 04/24/2014 | US20140110678 Thin film transistor array panel and method for repairing the same |
| 04/24/2014 | US20140110670 Doped graphene structure comprising hydrophobic organic material, method for preparing the same, and transparent electrode, display device and solar cell comprising the electrode |
| 04/24/2014 | US20140110662 Graphene-based composite structure and method for making the same |
| 04/24/2014 | US20140110660 Nonvolatile memory cell without a dielectric antifuse having high- and low-impedance states |
| 04/24/2014 | US20140110469 Glass Substrate Handling System, Cassette and Forklift Having the Same |
| 04/24/2014 | US20140110372 Method for manufacturing a probe |
| 04/24/2014 | US20140110249 Sputtering target, method for manufacturing same, and method for manufacturing thin film transistor |
| 04/24/2014 | US20140110059 Atmospheric-pressure plasma processing apparatus for substrates |
| 04/24/2014 | US20140109941 Retention device and retention method |
| 04/24/2014 | US20140109931 Cleaning Formulations |
| 04/24/2014 | US20140109930 Method for in-situ dry cleaning, passivation and functionalization of si-ge semiconductor surfaces |
| 04/24/2014 | US20140109833 Substrate processing apparatus |
| 04/24/2014 | US20140109432 Multi-step system and method for curing a dielectric film |
| 04/24/2014 | US20140109430 Substrate treating apparatus |
| 04/24/2014 | US20140109400 Container opening/closing device |
| 04/24/2014 | DE112012003114T5 Verfahren und Vorrichtung zum Herstellen einer Schicht in Halbleitermaterial Method and apparatus for producing a layer in semiconductor material |
| 04/24/2014 | DE112012003037T5 Konditionierer für CMP-Pads Conditioners for CMP Pads |
| 04/24/2014 | DE112012001943T5 Verfahren zum Einstellen der Höhenposition eines Polierkopfs und Verfahren zum Polieren eines Werkstücks A method for adjusting the height position of a polishing head and method for polishing a workpiece |
| 04/24/2014 | DE112011105495T5 Sensorvorrichtung Sensor device |
| 04/24/2014 | DE112006002377B4 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 04/24/2014 | DE112006001431B4 Verfahren zum Bilden von einer Durchkontaktierung in einer integrierten Schaltung eines Halbleiterpackages A method of forming a via in an integrated circuit of a semiconductor package |
| 04/24/2014 | DE112005001488B4 Tri-Gate Bauelement mit hoher Beweglichkeit und dessen Herstellungsverfahren Tri-gate device with high mobility and its manufacturing method |
| 04/24/2014 | DE10315176B4 Überspannungsschutzschaltung An overvoltage protection circuit |
| 04/24/2014 | DE102013221370A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 04/24/2014 | DE102013221228A1 Verfahren zum entfernen einer dielektrischen schicht von einem boden eines grabens A method for removing a dielectric layer from a bottom of a trench |
| 04/24/2014 | DE102013111569A1 Semiconductor package of semiconductor system, has chip that is provided with several contact pads on first major surface, and substrate that is located in first Vias tab that is provided with first antenna structure |
| 04/24/2014 | DE102013111540A1 Höckergehäuse und Verfahren zu seiner Herstellung Hump housing and method for its preparation |
| 04/24/2014 | DE102013111452A1 Halbleitervorrichtungen und Halbleiterverarbeitungsverfahren Semiconductor devices and semiconductor processing method |
| 04/24/2014 | DE102013110404A1 Chipanordnungen, ein Chip Package und ein Verfahren zum Herstellen einer Chipanordnung Chip arrays, a chip package and a method for producing a chip arrangement |
| 04/24/2014 | DE102013105084A1 Bump-on-trace-verbindungsstruktur für flip-chip-gehäuse Bump-on-trace interconnect structure for flip-chip package |
| 04/24/2014 | DE102012109995A1 Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess |
| 04/24/2014 | DE102012020785A1 Erhöhung der Dotierungseffizienz bei Protonenbestrahlung Increasing the doping efficiency of proton irradiation |
| 04/24/2014 | DE102009014582B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device |
| 04/23/2014 | EP2722903A1 Strongly correlated oxide field effect element |
| 04/23/2014 | EP2722901A1 Light emitting device with dislocation propagation prevention |
| 04/23/2014 | EP2722898A1 Electrode for light emitting diode |
| 04/23/2014 | EP2722893A1 Finfet device with silicided source-drain regions and method of making same using a two step anneal |
| 04/23/2014 | EP2722892A1 Silicon carbide semiconductor device and method for manufacturing same |
| 04/23/2014 | EP2722879A1 Semiconductor unit and semiconductor device using same |
| 04/23/2014 | EP2722878A1 Semiconductor device and method for manufacturing semiconductor device |
| 04/23/2014 | EP2722875A2 Apparatus and method of electrical testing for flip chip |
| 04/23/2014 | EP2722874A1 Method for producing amorphous oxide thin film and thin film transistor |
| 04/23/2014 | EP2722873A1 Chemical mechanical polishing (cmp) composition for shallow trench isolation (sti) applications and methods of making thereof |
| 04/23/2014 | EP2722872A1 Polishing composition |
| 04/23/2014 | EP2722871A1 A method of depositing an amorphous silicon film |
| 04/23/2014 | EP2722870A1 Semiconductor heterostructure and method of fabrication thereof |
| 04/23/2014 | EP2722704A2 Projection optical system, and exposure apparatus and exposure method |
| 04/23/2014 | EP2722703A2 Projection optical system, and exposure apparatus and exposure method |
| 04/23/2014 | EP2722702A2 Projection optical system, and exposure apparatus and exposure method |
| 04/23/2014 | EP2722423A2 Silicon wafer and manufacturing method thereof |
| 04/23/2014 | EP2722171A1 Adhesive tape film, and adhesive tape |
| 04/23/2014 | EP2721650A1 Process for producing a photovoltaic cell having a selective emitter |
| 04/23/2014 | EP2721640A1 Current aperture vertical electron transistors |