| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/12/2008 | US20080135625 Method for Producing a Portable Data Carrier |
| 06/12/2008 | US20080135532 Method of and an Apparatus for Forming a Perpendicular Crack in a Brittle Substrate |
| 06/12/2008 | US20080135519 Plasma processing apparatus and control method thereof |
| 06/12/2008 | US20080135518 Method and system for uniformity control in ballistic electron beam enhanced plasma processing system |
| 06/12/2008 | US20080135517 Carbon dioxide and optionally a passivation gas, such as a hydrocarbon gas, i.e., CxHy, wherein x, y represent integers greater than or equal to unity, is used to remove etch residue while reducing damage to underlying dielectric layers |
| 06/12/2008 | US20080135177 Plasma processing apparatus |
| 06/12/2008 | US20080135176 Apparatus for etching substrate and fabrication line for fabricating liquid crystal display using the same |
| 06/12/2008 | US20080135099 Solution-based fabrication of photovoltaic cell |
| 06/12/2008 | US20080135089 Graded hybrid amorphous silicon nanowire solar cells |
| 06/12/2008 | US20080134977 Substrate Treating Apparatus and Semiconductor Device Manufacturing Method |
| 06/12/2008 | US20080134976 Apparatus for Forming Thin Film |
| 06/12/2008 | US20080134484 Apparatus and process for precise encapsulation of flip chip interconnects |
| 06/12/2008 | US20080134483 Substrate processing apparatus and manufacturing method for semiconductor devices |
| 06/12/2008 | DE112005003634T5 Ein integrierter Schaltungsbaustein und ein Verfahren zum Ausbilden eines integrierten Schaltungsbausteins An integrated circuit device and a method of forming an integrated circuit package |
| 06/12/2008 | DE10345982B4 Verfahren zur Minimierung von mikroskopischen und makroskopischen Ausrichtungsfehlern einer Mehrfachschicht A method for minimizing microscopic and macroscopic alignment errors of a multiple layer |
| 06/12/2008 | DE10339988B4 Verfahren zur Herstellung einer antireflektierenden Schicht A process for producing an antireflective layer |
| 06/12/2008 | DE10326273B4 Verfahren zur Reduzierung der Scheibenkontaminierung durch Entfernen von Metallisierungsunterlagenschichten am Scheibenrand Method for reducing the Scheibenkontaminierung by removing Metallisierungsunterlagenschichten at the wafer edge |
| 06/12/2008 | DE10319136B4 Verfahren zur Herstellung einer Metallisierungsschicht mit einer mit Stickstoff angereicherten Barrierenschicht mit kleinem ε A process for producing a metallization layer with a nitrogen-enriched barrier layer with a small ε |
| 06/12/2008 | DE10314502B4 Verfahren zum elektrolytischen Beschichten einer Halbleiterstruktur A method for electrolytic coating of a semiconductor structure |
| 06/12/2008 | DE102007059161A1 Multi-Chip Package Struktur und Verfahren zu deren Herstellung Multi-chip package structure and methods for their preparation |
| 06/12/2008 | DE102007058556A1 Halbleitervorrichtung und Verfahren zum Herstellen von dieser A semiconductor device and method for producing these |
| 06/12/2008 | DE102007054350A1 Frame system for object storing device, has upper frame and lower frame horizontally extended, and receiving holes forms upper frame through which elongated support device extends in vertical direction |
| 06/12/2008 | DE102007053862A1 Probe station for e.g. testing semiconductor substrates, has positioning system positioning substrate with respect to sensors, housing enclosing chuck and sensors to form electromagnetic shielding |
| 06/12/2008 | DE102007049388A1 Method for forming a device with integrated circuits, involves lining of opening in electrically insulated layer with metal layer, where metal layer is nitrated with higher concentration of nitrogen related to part of metal layer |
| 06/12/2008 | DE102006059394A1 Integrated circuit manufacturing method, involves exposing defined section of semiconductor wafer such that web-like connections are arranged in lateral periphery of wafer defined section |
| 06/12/2008 | DE102006059113A1 Komplementäre Bipolar-Halbleitervorrichtung Complementary bipolar semiconductor device |
| 06/12/2008 | DE102006058892A1 Method for producing soldered joint between two elements, involves transferring heat in two elements that are to be connected, and thin protective layer is applied between soldering stamp and two elements |
| 06/12/2008 | DE102006058299A1 Handhabungswerkzeug für Bauelemente, insbesondere elektronische Bauelemente Handling tool components, in particular electronic components |
| 06/12/2008 | DE102006057903A1 Titandioxid enthaltende Dispersion Containing titanium dioxide dispersion |
| 06/12/2008 | DE10164913B4 Film forming material, useful for the production of semiconductor devices, has a low dielectric constant and comprises siloxane resin and polycarbosilane. |
| 06/12/2008 | CA2670527A1 Multicrystalline silicon solar cells |
| 06/11/2008 | EP1930946A2 Wiring substrate and method for manufacturing the same |
| 06/11/2008 | EP1930941A2 Method of chip manufacturing |
| 06/11/2008 | EP1930940A1 Organic thin film transistor, and method for surface modification of gate insulating layer in organic thin film transistor |
| 06/11/2008 | EP1930939A2 Two step etching of a bottom anti-reflective coating layer in dual damascene application |
| 06/11/2008 | EP1930938A1 Polishing agent, method for polishing surface to be polished, and method for manufacturing semiconductor integrated circuit device |
| 06/11/2008 | EP1930844A1 Noncontact information storage medium and method for manufacturing same |
| 06/11/2008 | EP1930775A1 Rinsing liquid for lithography and method for resist pattern formation |
| 06/11/2008 | EP1930734A1 Probe card |
| 06/11/2008 | EP1930732A1 Minute structure inspection device, inspection method, and inspection program |
| 06/11/2008 | EP1930707A2 Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of rtp tool |
| 06/11/2008 | EP1930486A1 Process for producing semiconductor substrate |
| 06/11/2008 | EP1929537A2 High performance mosfet comprising a stressed gate metal silicide layer and method of fabricating the same |
| 06/11/2008 | EP1929536A1 Metal source/drain schottky barrier silicon-on-nothing mosfet device and method thereof |
| 06/11/2008 | EP1929535A1 Silicon carbide semiconductor device and method for producing the same |
| 06/11/2008 | EP1929534A2 Semiconductor device and method of manufacturing the same |
| 06/11/2008 | EP1929526A2 Flash memory with recessed floating gate |
| 06/11/2008 | EP1929518A1 Method for making amorphous and polycrystalline silicon thin-film circuits |
| 06/11/2008 | EP1929517A2 Memory cell layout and process flow |
| 06/11/2008 | EP1929516A2 Process for integrating planar and non-planar cmos transistors on a bulk substrate and article made thereby |
| 06/11/2008 | EP1929515A1 Method for connecting layers, corresponding component and organic light-emitting diode |
| 06/11/2008 | EP1929514A1 Method of mounting electronic components |
| 06/11/2008 | EP1929513A1 Method for manufacturing a semiconductor device with nitride and oxide layers |
| 06/11/2008 | EP1929512A2 High throughput chemical mechanical polishing composition for metal film planarization |
| 06/11/2008 | EP1929511A2 Semiconductor on glass insulator with deposited barrier layer |
| 06/11/2008 | EP1929510A2 Silicided recessed silicon |
| 06/11/2008 | EP1929509A2 Pitch multiplication spacers and methods of forming the same |
| 06/11/2008 | EP1929508A2 Method of forming pitch multipled contacts |
| 06/11/2008 | EP1929258A2 A photoelectron spectroscopy apparatus and method of use |
| 06/11/2008 | EP1929071A1 Composition and method for enhancing pot life of hydrogen peroxide-containing cmp slurries |
| 06/11/2008 | EP1929063A2 Siox:si sputtering targets and method of making and using such targets |
| 06/11/2008 | EP1929062A2 Aluminum sputtering while biasing wafer |
| 06/11/2008 | EP1928965A2 Compositions and methods for tantalum cmp |
| 06/11/2008 | EP1928764A2 Reticle pod |
| 06/11/2008 | EP1709646B1 Method and apparatus for hot carrier programmed one time programmable (otp) memory |
| 06/11/2008 | EP1624038B1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 06/11/2008 | EP1340250B1 Bump formation method and bump forming apparatus to semiconductor wafer |
| 06/11/2008 | EP1325519B1 Semiconductor apparatus with improved ESD withstanding voltage |
| 06/11/2008 | EP1060442B1 Pattern generator with improved address resolution |
| 06/11/2008 | EP1024953B1 Use of glass laminate as a substrate in semiconductor devices |
| 06/11/2008 | EP0940856B1 Ferroelectric memory element and method of producing the same |
| 06/11/2008 | CN201072762Y Texture surface etching tank of monocrystal silicon solar battery |
| 06/11/2008 | CN201072755Y Mechanical wafer fixing device |
| 06/11/2008 | CN201072754Y Silicon slice handling device |
| 06/11/2008 | CN201072753Y Checking device for semiconductor chip packaging |
| 06/11/2008 | CN201072752Y Point gum head of die bonder |
| 06/11/2008 | CN201072751Y Washing mould of semiconductor and integrated circuit package mold |
| 06/11/2008 | CN201072750Y Chip press fit device used for vacuum cavity |
| 06/11/2008 | CN201072749Y Vacuum cavity with chip cooling structure |
| 06/11/2008 | CN201072475Y Holding tray with screw recovery |
| 06/11/2008 | CN201072474Y Sharing hand-throwing holding tray for recovery of integrated circuit block |
| 06/11/2008 | CN201072473Y Hand-throwing holding tray for recovery of integrated circuit block |
| 06/11/2008 | CN101199246A Method for manufacturing a circuit board structure, and a circuit board structure |
| 06/11/2008 | CN101199059A Monolithically integrated semiconductor assembly comprising a power component and method for producing a monolithically integrated semiconductor assembly |
| 06/11/2008 | CN101199051A System for supplying carbon dioxide |
| 06/11/2008 | CN101199049A Method of forming through-silicon vias with stress buffer collars and resulting devices |
| 06/11/2008 | CN101199048A For crystal plate operation |
| 06/11/2008 | CN101199047A Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor |
| 06/11/2008 | CN101199046A Integration flow to prevent delamination from copper |
| 06/11/2008 | CN101199045A Short channel semiconductor device fabrication |
| 06/11/2008 | CN101199044A Method for silicon based dielectric chemical vapor deposition |
| 06/11/2008 | CN101199043A Etching composition for metal material and method for manufacturing semiconductor device by using same |
| 06/11/2008 | CN101199042A Semiconductor device structures and methods of forming semiconductor structures |
| 06/11/2008 | CN101199041A Electrode patterning layer comprising polyamic acid or polyimide and electronic device using the same |
| 06/11/2008 | CN101199040A Quartz glass tool for heat treatment of silicon wafer and process for producing the same |
| 06/11/2008 | CN101199039A Film-forming and cleaning method |
| 06/11/2008 | CN101199038A Method and apparatus for removing organic film on substrate surface |
| 06/11/2008 | CN101199037A High performance stress-enhanced mosfets using si:c and sige epitaxial source/drain and method of manufacture |
| 06/11/2008 | CN101199021A A method in the fabrication of a ferroelectric memory device |
| 06/11/2008 | CN101198908A Image processing device, image drawing device, and system |