Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/19/2008US20080144251 Annulus clamping and backside gas cooled electrostatic chuck
06/19/2008US20080144233 Tunnel magnetoresistance effect device, and a portable personal device
06/19/2008US20080144043 Apparatus for wavefront detection
06/19/2008US20080143996 Processing apparatus
06/19/2008US20080143994 Drive Method of Moving Body, Stage Unit, and Exposure Apparatus
06/19/2008US20080143984 Projection method including pupillary filtering and a projection lens therefor
06/19/2008US20080143948 Method of mounting flexible circuit boards, and display device
06/19/2008US20080143930 Liquid crystal display device and method for manufacturing the same
06/19/2008US20080143912 Thin film transistor substrate and method of manufacturing the same
06/19/2008US20080143909 Liquid crystal display device and method of fabricating the same
06/19/2008US20080143904 Display substrate, method of manufacturing the same and display device having the same
06/19/2008US20080143903 Liquid crystal display device
06/19/2008US20080143791 Liquid jet head chip and manufacturing method therefor
06/19/2008US20080143423 Semiconductor integrated circuit and manufacturing method therefor
06/19/2008US20080143387 Software programmable multiple function integrated circuit module
06/19/2008US20080143352 Titanium oxide extended gate field effect transistor
06/19/2008US20080143251 Electronic device and method of manufacturing the same
06/19/2008US20080143012 Novel Polymer Films and Textile Laminates Containing Such Polymer Films
06/19/2008US20080142998 Zero-order overlay targets
06/19/2008US20080142996 Controlling flow of underfill using polymer coating and resulting devices
06/19/2008US20080142992 Molding compound adhesion for map-molded flip-chip
06/19/2008US20080142990 Three-dimensional integrated circuits with protection layers
06/19/2008US20080142989 Semiconductor device and manufacturing method of semiconductor device
06/19/2008US20080142988 Method for selective removal of damaged multi-stack bilayer films
06/19/2008US20080142984 Multi-Layer Electrode Structure
06/19/2008US20080142983 Device having contact pad with a conductive layer and a conductive passivation layer
06/19/2008US20080142982 Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers
06/19/2008US20080142981 Top layers of metal for high performance IC's
06/19/2008US20080142980 Top layers of metal for high performance IC's
06/19/2008US20080142976 Interposer and electronic device using the same
06/19/2008US20080142975 Dummy patterns and method of manufacture for mechanical strength of low k dielectric materials in copper interconnect structures for semiconductor devices
06/19/2008US20080142974 Semiconductor device and method for manufacturing same
06/19/2008US20080142973 Method of forming wiring structure and semiconductor device
06/19/2008US20080142972 Methods and systems for low interfacial oxide contact between barrier and copper metallization
06/19/2008US20080142971 Interconnect structure and method of manufacturing a damascene structure
06/19/2008US20080142970 Nanowire chemical mechanical polishing
06/19/2008US20080142969 Microball mounting method and mounting device
06/19/2008US20080142968 Structure for controlled collapse chip connection with a captured pad geometry
06/19/2008US20080142966 Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same
06/19/2008US20080142964 Tubular-shaped bumps for integrated circuit devices and methods of fabrication
06/19/2008US20080142962 Integrated circuit packages, systems, and methods
06/19/2008US20080142960 Circuit device with at least partial packaging and method for forming
06/19/2008US20080142952 Semiconductor package
06/19/2008US20080142950 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
06/19/2008US20080142947 Chip package and method of manufacturing the same
06/19/2008US20080142946 Wafer level package with good cte performance
06/19/2008US20080142944 Stacked package and method for manufacturing the package
06/19/2008US20080142943 Integrated circuit package system with thermo-mechanical interlocking substrates
06/19/2008US20080142942 Method and apparatus for multi-chip packaging
06/19/2008US20080142940 Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate
06/19/2008US20080142939 Tools structure for chip redistribution and method of the same
06/19/2008US20080142936 Semiconductor device package diepad having features formed by electroplating
06/19/2008US20080142933 Semiconductor Device and Fabricating Method Thereof
06/19/2008US20080142932 Semiconductor Device with Plastic Housing Composition and Method for Producing the Same
06/19/2008US20080142931 Method of Impurity Introduction, Impurity Introduction Apparatus and Semiconductor Device Produced with Use of the Method
06/19/2008US20080142930 Porous composition of matter, and method of making same
06/19/2008US20080142929 Method of producing a porous dielectric element and corresponding dielectric element
06/19/2008US20080142928 Semiconductor component with through-vias
06/19/2008US20080142925 Programmable-resistance memory cell
06/19/2008US20080142923 Semiconductor structure and method of manufacture
06/19/2008US20080142921 Method of fabricating semiconductor device
06/19/2008US20080142913 Z offset mems devices and methods
06/19/2008US20080142912 Mems resonator and manufacturing method of the same
06/19/2008US20080142911 Electromagnetic bandgap motion sensor device and method for making same
06/19/2008US20080142910 Semiconductor device
06/19/2008US20080142909 Ultra dense trench-gated power device with reduced drain source feedback capacitance and miller charge
06/19/2008US20080142908 Method of using iii-v semiconductor material as gate electrode
06/19/2008US20080142907 Isolated multigate fet circuit blocks with different ground potentials
06/19/2008US20080142901 Manufacturing method of semiconductor device
06/19/2008US20080142899 Radiation immunity of integrated circuits using backside die contact and electrically conductive layers
06/19/2008US20080142892 Interconnect feature having one or more openings therein and method of manufacture therefor
06/19/2008US20080142890 Multiple-gate MOSFET device with lithography independnet silicon body thickness and methods for fabricating the same
06/19/2008US20080142889 Strapping contact for charge protection
06/19/2008US20080142887 Silicon nitride film and semiconductor device, and manufacturing method thereof
06/19/2008US20080142886 Treatment method of semiconductor, method for manufacturing mos, and mos structure
06/19/2008US20080142885 Semiconductor device with improved source and drain and method of manufacturing the same
06/19/2008US20080142884 Semiconductor device
06/19/2008US20080142881 Semiconductor device including a fin-channel recess-gate misfet
06/19/2008US20080142880 Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands
06/19/2008US20080142878 Charge trap memory device and a method of manufacturing the same
06/19/2008US20080142876 Nonvolatile semiconductor storage device and manufacturing method of the same
06/19/2008US20080142875 Memory cells having split charge storage nodes and methods for fabricating memory cells having split charge storage nodes
06/19/2008US20080142874 Integrated circuit system with implant oxide
06/19/2008US20080142873 Integrated circuit system with metal and semi-conducting gate
06/19/2008US20080142872 Non-volatile memory devices including stepped source regions and methods of fabricating the same
06/19/2008US20080142871 Semiconductor device and method for manufacturing semiconductor device
06/19/2008US20080142869 Non-volatile memory device and method of forming the same
06/19/2008US20080142868 Floating body memory and method of fabricating the same
06/19/2008US20080142867 Non-volatile memory device with polysilicon spacer and method of forming the same
06/19/2008US20080142865 Semiconductor device and method for manufacturing the same
06/19/2008US20080142864 Semiconductor device and method for manufacturing the same
06/19/2008US20080142863 Semiconductor device and method for fabricating the same
06/19/2008US20080142860 Method and system for utilizing DRAM components in a system-on-chip
06/19/2008US20080142859 Microelectronics; thin films; nanodots; integrated circuits; semiconductors
06/19/2008US20080142855 Mos transistor, method for manufacturing the mos transistor, cmos semiconductor device including the mos transistor, and semiconductor device including the cmos semiconductor device
06/19/2008US20080142854 Circuit and Method for Suppressing Gate Induced Drain Leakage
06/19/2008US20080142851 Charge transfer device and solid state imager device
06/19/2008US20080142846 Nitride semiconductor substrate and manufacturing method thereof
06/19/2008US20080142843 NMOS device, PMOS device, and SiGe HBT device formed on soi substrate and method of fabricating the same
06/19/2008US20080142842 Relaxed silicon germanium substrate with low defect density
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