Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/19/2008US20080142841 Bulk non-planar transistor having strained enhanced mobility and methods of fabrication
06/19/2008US20080142839 Semiconductor device, method of manufacturing the same, and method of evaluating semiconductor device
06/19/2008US20080142838 Semiconductor device and method of manufacturing semiconductor device
06/19/2008US20080142837 Vertical type semiconductor device and manufacturing method of the device
06/19/2008US20080142836 Method for growth of alloy layers with compositional curvature in a semiconductor device
06/19/2008US20080142835 Stress enhanced transistor and methods for its fabrication
06/19/2008US20080142824 Electroluminescent device and fabrication method thereof
06/19/2008US20080142820 Reflective Mounting Substrates For Light Emitting Diodes
06/19/2008US20080142817 Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
06/19/2008US20080142811 MOSFET devices and methods of fabrication
06/19/2008US20080142808 Thin film transistor and fabrication method thereof
06/19/2008US20080142804 Liquid crystal display device including driving circuit and method of fabricating the same
06/19/2008US20080142803 Display device and manufacturing method thereof
06/19/2008US20080142802 Tft-lcd pixel unit and method for manufacturing the same
06/19/2008US20080142801 Electronic-ink display apparatus and the manufacturing method thereof
06/19/2008US20080142800 Method of manufacturing thin film transistor, thin film transistor, and display unit
06/19/2008US20080142799 Semiconductor device having zener diode and method for manufacturing the same
06/19/2008US20080142797 Thin film transistor, thin film transistor substate, and method of manufacturing the same
06/19/2008US20080142796 ZnO diode and method of forming the same
06/19/2008US20080142795 Ga2o3 Semiconductor Device
06/19/2008US20080142784 Nanostructures and methods for manufacturing the same
06/19/2008US20080142783 Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
06/19/2008US20080142781 Nitride Semiconductor Light Emitting Device and Fabrication Method Thereof
06/19/2008US20080142777 Phase change memory device including resistant material and method of fabricating the same
06/19/2008US20080142712 Defect inspection and charged particle beam apparatus
06/19/2008US20080142576 Method for the production of a soldered joint
06/19/2008US20080142508 Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate
06/19/2008US20080142497 Rapid conductive cooling using a secondary process plane
06/19/2008US20080142481 In-situ particle collector
06/19/2008US20080142369 holders for electronics formed by adhering a patterned layer of to a previously formed layer or substrate and repeating the adhesion operation several times to form a multilayer configuration containing electrodes, conductor and dielectrics
06/19/2008US20080142363 Using cell voltage as a monitor for deposition coverage
06/19/2008US20080142360 Method and a system for operating a physical vapor deposition process
06/19/2008US20080142256 Wiring board manufacturing method
06/19/2008US20080142255 Printed circuit board and method of manufacturing printed circuit board
06/19/2008US20080142208 Method and apparatus for heating a substrate
06/19/2008US20080142160 Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanism
06/19/2008US20080142159 Plasma Processing Apparatus
06/19/2008US20080142156 laminating an antiferromagnetic layer, a pinned-magnetization layer, a nonmagnetic spacer layer and a free-magnetization layer; sputtering; argon; oxygen; film for the antiferromagnetic layer is made of PtMn alloy or IrMn alloy; magnetic heads; reduce roughness of an interface
06/19/2008US20080142084 Solution-based fabrication of photovoltaic cell
06/19/2008US20080142083 Solution-based fabrication of photovoltaic cell
06/19/2008US20080142082 Forming active material of copper/indium/gallium/selenium or sulfur as ink for solar cells by reacting a solution of non-oxide compounds and capping agent; annealing to form nanoparticles 1-500nm diameter; narrow size distribution; close packing; uniformity; polycrystalline; quality; high quality films
06/19/2008US20080142081 Solution-based fabrication of photovoltaic cell
06/19/2008US20080142080 Forming active material of copper/indium/gallium/selenium or sulfur as ink for solar cells by reacting a solution of non-oxide compounds and capping agent; annealing to form nanoparticles 1-500nm diameter; narrow size distribution; close packing; uniformity; polycrystalline; quality; high quality films
06/19/2008US20080142072 Solution-based fabrication of photovoltaic cell
06/19/2008US20080142066 Method for producing a nanostructure based on interconnected nanowires, nanostructure and use as thermoelectric converter
06/19/2008US20080142051 Recovery cup cleaning method and substrate treatment apparatus
06/19/2008US20080142048 Wafer Clamping Apparatus and Method for Operating the Same
06/19/2008US20080141943 Thin Film Forming Apparatus
06/19/2008US20080141941 Showerhead electrode assembly with gas flow modification for extended electrode life
06/19/2008US20080141940 Method and apparatus for preventing arcing at ports exposed to a plasma in plasma processing chambers
06/19/2008US20080141935 Mask for sequential lateral solidification and crystallization method using thereof
06/19/2008US20080141556 Rapid conductive cooling using a secondary process plane
06/19/2008US20080141510 Method and system for fabricating strained layers for the manufacture of integrated circuits
06/19/2008US20080141509 Substrate processing system, substrate processing method, and storage medium
06/19/2008DE112006000234T5 Verfahren zum Ausbilden von Silizid A method of forming suicide
06/19/2008DE10307279B4 Integrationsschema für die Füllung von Spalten zwischen Metallleitungen mit CMP mit fixiertem Schleifmittel Integration scheme for the filling of gaps between metal lines with fixed abrasive CMP
06/19/2008DE10297224B4 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zum Verbinden von Substraten und Verwendung eines derartigen Klebstoffs zur Verknüpfung und Verbindung von Substraten einer Halbleitervorrichtung Die attach adhesives for semiconductor applications, and methods of bonding substrates using such an adhesive for bonding substrates and linking of a semiconductor device
06/19/2008DE10229625B4 Halbleitereinrichtung Semiconductor device
06/19/2008DE102007059697A1 Wafer separation process for separation of wafer, involves forming groove for holding rear surface side of wafer on clamping table of laser processing device
06/19/2008DE102007049033A1 Modulare Sensoranordnung und Verfahren zur Herstellung Modular sensor assembly and method for producing
06/19/2008DE102007020449A1 Device for the wet chemical, electrochemical or electrolytic treatment or for cleaning the lower side of a flat material comprises a treatment chamber with an overflow edge which forms a gap with a support for the material
06/19/2008DE102007018854B4 Halbleitervorrichtungs-Herstellungsverfahren, Halbleiterwafer und Halbleitervorrichtung A semiconductor device manufacturing method, semiconductor wafers and semiconductor device
06/19/2008DE102007018080B3 Manufacture of thin wafers, sheet or films from semiconductor body, cuts using laser and optional etchant, whilst spreading separated sheet away from body
06/19/2008DE102006062031B3 Electrochemical etching assembly has drive unit in frame above electrochemical vat
06/19/2008DE102006060366A1 Verfahren zur Herstellung von in einer Matrix eingebetteten Quantenpunkten und mit dem Verfahren hergestellte in einer Matrix eingebettete Quantenpunkte Process for the preparation of quantum dots embedded in a matrix and manufactured by the method quantum dots embedded in a matrix
06/19/2008DE102006060302B3 Anordnung sowie ein Verfahren zur Steuerung von Trocknungsprozessen für die Herstellung von Halbleiterbauelementen Arrangement and a method for controlling drying processes for the manufacture of semiconductor devices
06/19/2008DE102006059810A1 Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben Apparatus and method for cleaning articles, in particular thin slices
06/19/2008DE102006059809A1 Device for separating and transporting of disc-shaped substrates, has support unit arranged inside fluid, in which individual substrates stand sequentially one behind other in form of substrate pile in feed direction
06/19/2008DE102006058952A1 Clean room manipulation system for semiconductor wafer for charging horizontal Semiconductor processing plants, particularly charging and discharging diffusion oven or epitaxial installation, has robot system
06/19/2008DE102006058823A1 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück A method for separating a plurality of wafers from a workpiece
06/19/2008DE102006058820A1 Verfahren zur Herstellung von SGOI- und GeOI-Halbleiterstrukturen A process for preparing SGOI- and GeOI semiconductor structures
06/19/2008DE102006058493A1 Verfahren und Vorrichtung zum Bonden von Wafern Method and apparatus for bonding wafers
06/19/2008DE102006057739A1 Electronic component has connecting finger, where section of connecting finger projecting out of covering is protected against atmospheric influences partly by protection unit, and protection unit comprises bitumen
06/19/2008DE102006053916B3 Procedure for producing an adhesive surface on a surface of a die carrier, comprises pressing a self-hardenable adhesion adjusted under thixotropic with increased surface tension by a pattern pressing process on the surface of the carrier
06/19/2008DE102006037633B4 Halbleiterchip mit Beschädigungs-Detektierschaltung und ein Verfahren zum Herstellen eines Halbleiterchips Semiconductor chip having DAMAGE detecting circuit and a method for producing a semiconductor chip
06/19/2008DE102005029407B4 Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat Method and apparatus for permanently joining integrated circuits to a substrate
06/19/2008DE102004023987B4 Elektrische Prüfeinrichtung Electrical test equipment
06/19/2008DE102004022177B4 Verfahren zur Herstellung eines Koplanarleitungssystem auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement zur Übertragung von elektromagnetischen Wellen A method for producing a Koplanarleitungssystem on a substrate and produced by such a process component for transmitting electromagnetic waves
06/19/2008DE102004011430B4 Halbleiterspeichereinrichtung A semiconductor memory device
06/19/2008DE10164666B4 Halbleiterbauelement zum Schutz vor elektrostatischer Entladung Semiconductor device for protection against electrostatic discharge
06/19/2008DE10022649B4 Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden Polishing liquid and method for patterning metal oxides
06/19/2008CA2672259A1 Method of manufacturing semiconductor device
06/19/2008CA2671958A1 A semiconductor doping process
06/18/2008EP1933392A2 Solar cell fabrication using extruded dopant-bearing materials
06/18/2008EP1933390A1 Semiconductor device and fabrication method thereof
06/18/2008EP1933388A1 Silicon-based thin film photoelectric converter, and method and apparatus for manufacturing same
06/18/2008EP1933386A1 Process for producing silicon carbide semiconductor device
06/18/2008EP1933385A2 Thin film transistor, thin film transistor substrate, and method of manufacturing the same
06/18/2008EP1933378A1 Nonvolatile semiconductor memory element having excellent charge retention properties and process for producing the same
06/18/2008EP1933377A2 Semiconductor device and method for manufacturing the same
06/18/2008EP1933376A2 Transfer material, method for producing the same and wiring substrate produced by using the same
06/18/2008EP1933375A2 Methods for Recess Etching
06/18/2008EP1933374A1 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium
06/18/2008EP1933373A2 Method for producing a device based on nanocrystals covered with a nitride layer applied by CVD
06/18/2008EP1933372A1 Process for producing epitaxial wafer and epitaxial wafer produced therefrom
06/18/2008EP1933371A1 Exposure apparatus, exposure method, and device production method
06/18/2008EP1933370A2 Method and apparatus for heating a substrate
06/18/2008EP1933369A2 Method and apparatus for heating a substrate
06/18/2008EP1933368A2 Rapid conductive cooling using a secondary process plane
06/18/2008EP1933293A1 Tft substrate and method for manufacturing tft substrate